Q U A L I T Y S E R V I C E I N N O V A T I O N TitanBrite™ 10-Watt High Power LED Market-Leading Brightness and Thermal Resistance Lumex’s new TitanBrite™ 10-Watt (SML-LX4747 series) SMD high-power LED technology provides market-leading brightness and thermal resistance. The technology also provides opportunities for significant cost and real estate savings for applications switching from two 5W or ten 1W technologies to a single 10W LED. The new TitanBrite 10W White LED provides market-leading brightness (23% brighter than alternative 10W LEDs), and thanks to its unique thermal enhanced design with the LEDs mounted onto a ceramic substrate (rather than onto a PCB), heat dissipation performance is improved up to 61% compared to the use of two 5W LEDs. Features: • Brightness of 600lm for cool white, 550lm for neutral white and 530lm for warm white • Unique thermal enhanced design • Compact 12mm2 package size • 120˚ viewing angle • Extended operating temperature of -40˚C to 100˚C Recommended Markets: • Small space lighting • Medical devices • Appliances w w w . l u m e x . c o m 05/04/2011 8 0 0 . 2 7 8 . 5 6 6 6 TitanBrite™ 10-Watt High Power LEDs-Square Package TitanBrite™ 10-Watt High Power LEDs Emitted Chip PN Color Material Color Temp (K) Lens Type Vf (V) SML-LX4747MWC-TR10 Warm White InGaN 3000 Yellow 10.4 SML-LX4747NWC-TR10 Neutral White InGaN 4000 Yellow 10.4 SML-LX4747UWC-TR10 Cool White InGaN 6000 Yellow 10.4 w w w . l u m e x . c o m If (mA) 1000 1000 1000 Total Flux (lm) 530lm 550lm 600lm View Angle 120 120 120 8 0 0 . 2 7 8 . 5 6 6 6 TitanBrite™ 10-Watt High Power LEDs Product Specifications Specification Total Flux Warm White: 530lm @ 1000mA Neutral white: 550lm @ 1000mA Cool white: 600lm @ 1000mA Correlated Color Temperature: Warm white: 3000K Neutral white: 4000K Cool white: 6000K Vf 10.4V Resin Material Epoxy Electric Static Discharge (ESD) Protection: ESD protection for GaP and AlGaAs based chips is required even though they are relatively resistant to low levels of electro-static discharge. Parts built with AlInGaP, GaN, or/and InGaN based chips are STATIC SENSITIVE devices and strict ESD precautions must be taken during design, handling and assembly. If manual work or processing is needed, please ensure the device is adequately protected from ESD during the process. w w w . l u m e x . c o m 8 0 0 . 2 7 8 . 5 6 6 6 Absolute Maximum Ratings Parameter DC Forward Current Peak Pulsed Forward Current Average Forward Current Reverse Voltage LED Junction Temperature Operating Temperature Storage Temperature Soldering Temperature White 1000 1200 Unit mA mA 1000 5 110 -40˚C ~ +100˚C 260˚C See Temperature Profile Chart mA V ˚C ˚C ˚C Conditions 0.1ms PW, 1/10 duty Ir = μOμA - Electro-Optical Characteristics Parameter Symbol Min. Typ. Max. Unit Condition Forward Voltage VF - 10.4 - V If=1000mA View Angle 2 theta ½ - 120 - deg If=1000mA Temperature Coefficent of Forward Voltage ∆VF/∆T -5.6 mV/˚C 3.5 ˚C/W Thermal Resistance Junction to Board Correlated Color Temperature Rank for White Color Warm White Condition If=1000mA Neutral White If=1000mA Cold White If=1000mA Bin Code Min. Typ. Max. Unit TW1 2580 2700 2870 K TW2 2870 3000 3220 K TW3 3220 3500 3710 K TN1 3710 4000 4260 K TN2 4260 4700 5310 K TC1 5310 6000 7040 K Tolerance ±5% w w w . l u m e x . c o m 8 0 0 . 2 7 8 . 5 6 6 6 Correlated Color Temperature Rank for White (XE,XF) w w w . l u m e x . c o m 8 0 0 . 2 7 8 . 5 6 6 6 Characteristics Curves (WARM WHITE) w w w . l u m e x . c o m 8 0 0 . 2 7 8 . 5 6 6 6 Characteristics Curves (NEUTRAL WHITE) w w w . l u m e x . c o m 8 0 0 . 2 7 8 . 5 6 6 6 Characteristics Curves (COOL WHITE) w w w . l u m e x . c o m 8 0 0 . 2 7 8 . 5 6 6 6 Soldering • • Recommend tin glue specifications: melting temperature in the range of 178˚C ~ 192˚C. The recommended soldering profile is as follows (temperatures indicated are as measured on the surface of the LED resin): Lead-Free Solder Profile Tape and Reel w w w . l u m e x . c o m 8 0 0 . 2 7 8 . 5 6 6 6 Rework • • Rework should be completed within 5 seconds under 260˚C. Manual soldering (not recommended): - Soldering tin material: tin 6/4 alloy or contained Ag. - To prevent cracking, bake before manual soldering. - Temperature of iron tip: 300˚C±5 ˚C maximum (25W) - Soldering duration: 3sec±1sec Cleaning The following are cleaning procedures after soldering: • An alcohol-based solvent such as isopropyl alcohol (IPA) is recommended. • Temperature x Time should be 50˚C x 30sec. or <30˚C x 3min. • Ultra sonic cleaning: <15W/ bath; bath volume ≤ 1 liter • Curing: 100˚C max, <3min. Pick and Place Hazards • Avoid stress on the resin at elevated temperature. • Avoid rubbing or scraping the resin by any object. • Electric-static may cause damage to the component. Please ensure that the equipment is properly grounded. Use of an ionizer fan is recommended. Storage • It is recommended that products be stored under the following conditions: Humidity: 60%R.H. maximum Temperature: 5˚C ~ 30˚C • Shelf life in sealed bag: 6 months at <40˚C and <90%R.H. • After opening the bag, devices that will be subjected to soldering or equivalent processing should be used within one year at a condition of ≤30˚C / 60%R.H. w w w . l u m e x . c o m 8 0 0 . 2 7 8 . 5 6 6 6 Reliability Test Item Duration JIS C 7021 Ref Conditions Criteria High Temperature Operating Life 1000 hrs JIS C7035 If = 1A Note 2 Room Temperature Operating Life 1000 hrs If = 1A Note 2 High Temperature Humidity Operation 1000 hrs Method B-11 If = 1A 85˚C / 85% RH Note 2 Powered Temperature Cycle (PTMCL) 100 cycles Method A-4 -40˚C/100˚C 5min dwell, 5mm xter Note 1, No. Catastrophic Non Operating Temperature Cycle (TMCL) 100 cycles Method A-4 -40˚C/100˚C 5min dwell, 5mm xter No Catastrophic High Temperature Storage Life (HTSL) 1000 hrs Method B-11 85˚C, non op. Note 2 Low Temperature Storage Life (LTSL) 1000 hrs Method B-11 -40˚C, non op. Note 2 Method A-1 260˚C 5 sec No Catastrophic Solder Heat Resistance (SHR) Note 1: Dependant upon the maximum de-rating curve Note 2: Failure criteria includes units with catastrophic failure, or units with greater than 50% lv degradation at 1000 hours, or an average lv degradation for the test of greater than 35% at 1000 hours. w w w . l u m e x . c o m 8 0 0 . 2 7 8 . 5 6 6 6