C850-260-WH MDS

MATERIAL DECLARATION SHEET
Material Number
C850-180-WH
Product Line
TBU
Compliance Date
January-2008
RoHS Compliant
Yes
No.
1
Construction
Element(subpart)
Semiconductor
Device
MSL
Homogeneous
Material
Silicon Chip
2
Lead Frame
Copper alloy with
silver plating
3
Bond wire
Gold wire
Die Attach
Adhesive
5
Mold compound
(halogen-free)
Epoxy resin
Matte tin plating
6.68
47.28
1.74
matte tin
37.02
2.94
Total weight
This Document was updated on:
Material
weight
[mg]
0.23
4
6
3
Homogeneous
Material\
Substances
CASRN
if applicable
Materials
Mass %
Material
Mass % of
total unit wt.
Subpart
mass of total
wt. (%)
6.96
Doped silicon
7440-21-3
100
6.96
Copper
Chromium III
Tin
Zinc
Silver (plating)
Gold
Di-ester resin
Functionalized ester
Polymeric compound
Silver
Silica fused
Epoxy resin
Phenolic resin
Carbon black
Tin
7440-50-8
7440-47-3
7440-31-5
7440-66-6
7440-22-4
97.29
0.25
0.25
0.22
2.0
100
3
7
3
87
90.5
4.7
4.7
0.1
100
47.97
0.12
0.12
0.11
0.99
0.24
0.05
0.13
0.05
1.58
34.94
1.81
1.81
0.04
3.07
7440-57-5
proprietary
proprietary
proprietary
7440-22-4
60676-86-0
proprietary
proprietary
1333-86-4
7440-31-5
49.31
0.24
1.81
38.6
3.07
95.89
January 12, 2010
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