MATERIAL DECLARATION SHEET Package Type TCS-DL004-250-WH Product Line Semiconductor Products Compliance Date RoHS Compliant 1 June 2012 Yes No. 1 2 Construction Element (subpart) Encapsulation Leadframe Homogeneous Material Epoxy resin Copper alloy MSL Material weight [g] 0.014456 0.008790 1 Homogeneous Material\ Substances if applicable Materials Mass % Material Mass % of total unit wt. Subpart mass of total wt. (%) 60676-86-0 Trade secret 29690-82-2 Trade secret 1333-86-4 87.70 5.00 2.00 5.00 0.30 49.91 2.85 1.14 2.85 0.17 56.92 Copper 7440-50-8 93.32 32.29 Iron 7439-89-6 2.20 0.76 Fused Silica Epoxy resin Epoxy CN Phenol resin Carbon Black CASRN Zinc 7440-66-6 0.01 0.00 Phosphorous 7723-14-0 0.03 0.01 Silver (Plating) 7440-22-4 4.45 1.54 Silicon 7440-21-3 99.43 6.65 Aluminum 7429-90-5 0.57 0.01 Silver 7440-22-4 75.00 0.19 Epoxy 9003-36-5 25.00 0.06 34.60 6.66 3 Chip Silicon 0.001692 4 Die Attach Silver epoxy 0.000066 5 Bond wires Gold 0.000050 Gold 7440-57-5 100.00 0.20 0.20 6 Terminal Finish Matte Tin 0.000345 Matte Tin 7440-31-5 100.00 1.36 1.36 Total Weight 0.26 0.0254000 Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society Rev July 2012 page 1 of 1