MATERIAL DECLARATION SHEET PTVS3-015C-TH Material Number Product Line Semiconductor Products Compliance Date November 18 2015 RoHS Compliant No. 1 Yes Construction Element(subpart) Encapsulation Homogeneous Material Epoxy Resin MSL Material weight [g] 0.164000 2 Electrodes Copper 0.404000 3 Terminations Copper 0.516451 4 Termination Finish Silver 0.003549 5 Chip Silicon Die 0.023100 6 Die Attach Solder 0.030845 7 Die Coating Silicone 0.034000 Total weight 1.175945 Not Applicable Homogeneous Material\ Substances CASRN if applicable Materials Mass % Material Mass % of total unit wt. Bisphenol Copolymer 25036-25-3 60.00 8.37 Alumina Trihydrate 21645-51-2 15.00 2.09 Fused silica 60676-86-0 20.00 2.79 Hydrated Iron Oxide 20344-49-4 1.50 0.21 Titanium Dioxide 13463-67-7 1.50 0.21 Melamine Cyanurate Amine Adduct Copper Silver Other, not to declare 37640-57-6 trade secret 7440-50-8 7440-22-4 - 1.50 0.50 99.10 0.40 0.50 0.21 0.07 34.05 0.14 0.17 Subpart mass of total wt. (%) 13.95 34.36 Copper 7440-50-8 99.50 43.70 Other, not to declare - 0.50 0.22 Silver Silicon Aluminium Nickel Gold Lead* Tin Silver Polysiloxane Chromium Sesquioxide Fumed Silica Filler 7440-22-4 7440-21-3 7429-90-5 7440-02-0 7440-57-5 7439-92-1 7440-31-5 7440-22-4 63148-62-9 100.00 85.34 5.13 9.09 0.44 92.50 5.00 2.50 22.11 0.30 1.67 0.10 0.18 0.01 2.42 0.13 0.07 0.64 0.30 1308-38-9 112945-52-5 trade secret 5.67 11.11 61.11 0.16 0.32 1.77 2.89 43.92 1.96 2.62 This Document was updated on: 2015/11/18 Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. 2. * 7(a)-Lead in high melting temperature type solders (i.e. lead- based alloys containing 85% by weight or more lead) Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 1