568AG

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP20, 1.62x2.02
CASE 568AG
ISSUE D
SCALE 4:1
PIN A1
REFERENCE
2X
ÈÈ
ÈÈ
D
A
DATE 13 AUG 2013
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
B
E
DIE COAT
(OPTIONAL)
A2
DIM
A
A1
A2
A3
b
D
E
e
A3
0.10 C
2X
0.10 C
TOP VIEW
DETAIL A
A2
DETAIL A
MILLIMETERS
MIN
MAX
−−−
0.60
0.17
0.23
0.33
0.39
0.02
0.04
0.24
0.28
1.62 BSC
2.02 BSC
0.40 BSC
GENERIC
MARKING DIAGRAM*
0.10 C
A
XXXXXX
AWLYWW
G
0.05 C
NOTE 3
A1
C
SIDE VIEW
SEATING
PLANE
e/2
20X
b
0.05 C A B
0.03 C
A
WL
Y
WW
G
e
E
e
D
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
C
B
A
1
2
3
4
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
A1
PACKAGE
OUTLINE
0.40
PITCH
20X
0.40
PITCH
0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON82918E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
WLCSP20, 1.62X2.02
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON82918E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY M. HILTON.
14 AUG 2012
A
CHANGED DIMENSION SIZE FROM 1.66X2.06 TO 1.62X2.02. ADDED GENERIC
MARKING DIAGRAM. REQ. BY M. HILTON.
02 OCT 2012
B
ADDED DETAIL A FOR DIE COAT OPTION. REQ. BY M. HILTON.
13 DEC 2012
C
CHANGED MAX VALUE FOR DIMENSION B FROM 0.29 TO 0.28. REQ. BY M.
HILTON.
17 JUN 2013
D
CHANGED MARKING DIAGRAM ORIENTATION. REQ. BY M. HILTON.
13 AUG 2013
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2013
August, 2013 − Rev. D
Case Outline Number:
568AG
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