Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
P5.064A
5 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE
Rev 0, 2/10
1.90
0-3°
D
A
0.08-0.20
5
4
PIN 1
INDEX AREA
2.80
3
1.60
3
0.15 C D
2x
2
5
(0.60)
0.20 C
2x
0.95
SEE DETAIL X
B
0.40 ±0.05
3
END VIEW
0.20 M C A-B D
TOP VIEW
10° TYP
(2 PLCS)
2.90
5
H
0.15 C A-B
2x
C
1.45 MAX
1.14 ±0.15
0.10 C
SIDE VIEW
SEATING PLANE
(0.25) GAUGE
PLANE
0.45±0.1
0.05-0.15
4
DETAIL "X"
(0.60)
(1.20)
NOTES:
(2.40)
(0.95)
(1.90)
TYPICAL RECOMMENDED LAND PATTERN
1
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5M-1994.
3.
Dimension is exclusive of mold flash, protrusions or gate burrs.
4.
Foot length is measured at reference to guage plane.
5.
This dimension is measured at Datum “H”.
6.
Package conforms to JEDEC MO-178AA.