Plastic Packages for Integrated Circuits Package Outline Drawing L12.3x3Z 12 LEAD THIN QUAD FLAT NO LEAD PLASTIC PACKAGE FOR ISL99202 USE ONLY WITH REDUCED e-PAD SIZE TO 1.4mm ON LAND PATTERN Rev 0, 10/08 3.00 0.5 BSC A B 6 12 10 PIN #1 INDEX AREA 6 3.00 4X 1.70 REF PIN 1 INDEX AREA 9 1 7 3 0.10 M C A B (4X) 0.15 4 6 0.25 +0.07 / -0.05 4 12X 0 . 4 ± 0 . 1 TOP VIEW BOTTOM VIEW SEE DETAIL "X" 0.10 C 0 . 75 C BASE PLANE ( 2 . 8 TYP ) 1.40 ) SEATING PLANE 0.08 C ( SIDE VIEW 0.6 C 0 . 50 0 . 2 REF 5 0 . 00 MIN. 0 . 05 MAX. 0 . 25 TYPICAL RECOMMENDED LAND PATTERN DETAIL "X" NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to JEDEC STD MO-229. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension b applies to the metallized terminal and is measured between 0.20mm and 0.32mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 1