485CD

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
QFN32 4x4, 0.4P
CASE 485CD
ISSUE A
1
DATE 09 OCT 2012
SCALE 2:1
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
PIN ONE
REFERENCE
B
A
D
L
L1
DETAIL A
E
ALTERNATE TERMINAL
CONSTRUCTIONS
EXPOSED Cu
TOP VIEW
A
0.05 C
DIM
A
A1
A3
b
D
D2
E
E2
e
K
K2
L
L1
ÏÏ
ÏÏ
0.10 C
0.10 C
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND 0.30 MM
FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED PAD
AS WELL AS THE TERMINALS.
MOLD CMPD
DETAIL B
ALTERNATE
CONSTRUCTION
A3
0.05 C
DETAIL B
NOTE 4
A1
SIDE VIEW
GENERIC
MARKING DIAGRAM*
SEATING
PLANE
C
XXXXXX
XXXXXX
ALYWG
G
0.10 C A B
DETAIL A
D2
9
K
4X
K2
17
32X
XXXXX = Specific Device Code
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer
to device data sheet for actual part
marking. Pb−Free indicator, “G”, may
or not be present.
L
DETAIL C
CORNER LEAD
CONSTRUCTION
E2
1
DETAIL C
0.10 C A B
25
e
BOTTOM VIEW
32X
b
0.07
M
0.05
M
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.15
0.25
4.00 BSC
2.60
2.80
4.00 BSC
2.60
2.80
0.40 BSC
0.30 REF
0.45 REF
0.25
0.45
−−−
0.15
C A B
C NOTE 3
RECOMMENDED
MOUNTING FOOTPRINT
4.30
2.80
PACKAGE
OUTLINE
32X
0.58
1
2.80
8X
4.30
C0.08
0.40
PITCH
DOCUMENT NUMBER:
98AON66248E
32X
0.25
DIMENSIONS: MILLIMETERS
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
QFN32 4X4, 0.4P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON66248E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY D. SHORT.
12 DEC 2011
A
CHANGED DIMENSION L3 TO DIMENSION K2 IN DETAIL C. REQ. BY D. SHORT.
09 OCT 2012
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2012
October, 2012 − Rev. A
Case Outline Number:
485CD