Plastic Packages for Integrated Circuits Package Outline Drawing L48.7x7L 48 LEAD QUAD FLATPACK NO LEAD PLASTIC PACKAGE (QFN) Rev 0, 2/11 0.10 C A 7.00 4X 5.50 A PIN 1 INDEX AREA PIN 1 ID B 37 6 6 48 1 36 44X 0.50 EXP. DAP 7.00 5.30 ±0.10 SQ. 12 25 24 0.10 C B 13 48X 0.25 -0.07/+0.05 4 48X 0.40 TOP VIEW 0.10 M C A B BOTTOM VIEW SEE DETAIL "X" C 0.85 ±0.05 0 . 2 REF 5 C 0.10 C 0 . 00 MIN. 0 . 05 MAX. 0.08 C SIDE VIEW SEATING PLANE DETAIL "X" 44X (0.50) NOTES: (6.80 SQ) 48X (0.25) (5.30 SQ) 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 48X (0.60) TYPICAL RECOMMENDED LAND PATTERN 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 7. 1 Reference document: JEDEC MO220.