485CJ

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
QFN48 6x6, 0.4P
CASE 485CJ
ISSUE A
1 48
SCALE 2:1
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
D
ÉÉ
ÉÉ
EXPOSED Cu
A B
PIN ONE
REFERENCE
MOLD CMPD
DETAIL B
ALTERNATE
CONSTRUCTION
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSIONS: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS
MEASURED BETWEEN 0.15 AND 0.30mm FROM TERMINAL TIP
4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS
THE TERMINALS.
5. POSITIONAL TOLERANCE APPLIES TO ALL THREE EXPOSED
PADS IN BOTH X AND Y AXIS.
L
2X
0.15 C
L
DETAIL A
TOP VIEW
(A3)
DETAIL B
0.10 C
0.08 C
ALTERNATE TERMINAL
CONSTRUCTIONS
A
L2
A1
NOTE 4
45 5
SEATING
PLANE
C
SIDE VIEW
DETAIL C
D2
D3
DETAIL A
D4
G3
DETAIL C
13
G4
13
25
E3
25
E4
E2
1
48X
DIM
A
A1
A3
b
D
D2
D3
D4
D5
E
E2
E3
E4
e
G3
G4
H2
H3
H4
L
L1
L2
L1
0.15 C
2X
DATE 09 AUG 2012
48
L
37
e
e/2
BOTTOM VIEW
48X
NOTE 5
H3
0.10 M C A B
b
0.10 M C A B
0.05 M C NOTE 3
RECOMMENDED
SOLDERING FOOTPRINT*
48X
0.58
48X
0.25
1.91
H2
1
48
GENERIC
MARKING DIAGRAM*
1
37
XXXXXXXXX
XXXXXXXXX
AWLYYWWG
D5
SUPPLEMENTAL
BOTTOM VIEW
XXXXX
A
WL
YY
WW
G
6.30
4.81
2.09
4.80 6.30
0.40
PITCH
H4
2.54
MILLIMETERS
MIN
MAX
0.80
1.00
−−−
0.05
0.20 REF
0.15
0.25
6.00 BSC
4.53
4.73
1.64
1.84
2.42
2.62
4.58
4.78
6.00 BSC
1.86
2.06
2.41
2.61
2.30
2.50
0.40 BSC
1.45 BSC
1.06 BSC
1.40 BSC
1.19 BSC
1.10 BSC
0.25
0.45
−−− 0.15
0.15 REF
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
2.66
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON80730E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
QFN48, 6x6, 0.4MM PITCH
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON80730E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY S. MOHAMMED.
24 MAY 2012
A
CORRECTED TABLE LABELS ONLY FOR E2, E3 & E4. REQ. BY S. MOHAMMED.
09 AUG 2012
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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© Semiconductor Components Industries, LLC, 2012
Aug, 2012 − Rev. A
Case Outline Number:
485CJ
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