Plastic Packages for Integrated Circuits Package Outline Drawing L40.5x5D 40 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 0, 9/10 4X 3.60 5.00 36X 0.40 A B 6 PIN #1 INDEX AREA 5.00 3.65 6 PIN 1 INDEX AREA (4X) 0.15 40X 0.4± 0.1 TOP VIEW b BOTTOM VIEW 0.20 0.10 M C A B 4 PACKAGE OUTLINE 0.40 SEE DETAIL "X" 0.750 // 0.10 C C BASE PLANE SEATING PLANE 0.08 C 0.050 3.65 5.00 SIDE VIEW (36X 0.40) (40X 0.20) 5 C 0.2 REF (40X 0.60) 0.00 MIN 0.05 MAX TYPICAL RECOMMENDED LAND PATTERN DETAIL "X" NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.27mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be 7. JEDEC reference drawing: MO-220WHHE-1 either a mold or mark feature. 1