488

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DFN6 2x2.2 mm
CASE 488−03
ISSUE G
DATE 06 FEB 2006
SCALE 4:1
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. TERMINAL b MAY HAVE MOLD COMPOUND
MATERIAL ALONG SIDE EDGE.
6. DETAILS A AND B SHOW OPTIONAL VIEWS
FOR END OF TERMINAL LEAD AT EDGE OF
PACKAGE AND SIDE EDGE OF PACKAGE.
B
A
ÍÍÍ
ÍÍÍ
ÍÍÍ
E
PIN ONE
REFERENCE
0.10 C
2X
TOP VIEW
0.10 C
2X
DIM
A
A1
A3
b
b1
D
D2
E
e
L
L1
DETAIL B
0.10 C
A3
A
6X
0.08 C
A1
SIDE VIEW
0.10 C A
0.05 C
C
B b1
SEATING
PLANE
MIN
0.80
0.00
0.20
0.30
0.40
0.30
0.00
MILLIMETERS
NOM
MAX
0.90
1.00
0.03
0.05
0.20 REF
0.25
0.30
0.35
0.40
2.00 BSC
0.50
0.60
2.20 BSC
0.65 BSC
0.35
0.40
0.05
0.10
GENERIC
MARKING DIAGRAM*
e
3
1
NOTE 3
xxM
DETAIL A
D2
xx
M
4
6
6X
L
b
*This information is generic. Please refer
to device data sheet for actual part
marking.
5X
0.10 C A
0.05 C
BOTTOM VIEW
EDGE OF PACKAGE
MOLD CMPD
L1
A1
ÉÉ
ÉÉ
B
SOLDERING FOOTPRINT*
NOTE 3
0.50
0.020
EXPOSED Cu
0.65
0.025
0.40
0.016
A3
0.50
0.020
DETAIL B
Side View
(Optional)
DETAIL A
Bottom View
(Optional)
= Specific Device Code
= Date Code
1.9
0.075
0.65
0.025
SCALE 10:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
98AON04199D
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
http://onsemi.com
DFN6 2 X 2.2 X 0.9 X 0.65P
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON04199D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY J. HOSKINS.
30 JAN 2001
A
REMOVED DIM’S E,F,K,M,N,P,Q AND R. UPDATED VIEW. REQ. BY M. JONES.
23 MAY 2001
B
REMOVED IDENT PIN. SWAPPED THE TOP LEFT AND RIGHT PAD LOCATIONS.
REQ. BY M. SALEH.
13 SEP 2001
C
CHANGED DESCRIPTION FROM 2 X 2 TO 2 X 2.2. CHANGE MARKING
DIAGRAM. REQ. BY K. OPPEN.
27 JUN 2003
D
CHANGED MARKING DIAGRAM. REQ. BY S. RIGGS.
30 JUL 2003
E
ADDED “U’ DIMENSION TO DIMENSION TABLE. REQ. BY K. OPPEN.
03 MAR 2004
F
CHANGED DEVICE DESCRIPTION FROM QFN TO DFN.
REQ. BY A. GARLINGTON.
02 NOV 2005
G
CHANGED DRAWING FORMAT TO STANDARD FORMAT. REQ. BY B. LOFTS.
06 FEB 2006
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
© Semiconductor Components Industries, LLC, 2006
February, 2006 − Rev. 03G
Case Outline Number:
488
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