Plastic Packages for Integrated Circuits Package Outline Drawing Q32.5X5A 32 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE (TQFP) Rev 1, 10/11 D D D1 D E E1 B A D e TOP VIEW BOTTOM VIEW 11o-13o SEATING PLANE 0 MIN A A2 -C- -03 +0.07 BASE METAL o 0.08 0.003 0.20 WITH PLATING 0.020 MIN A A1 0.08 0.003 M C A-B S D S 0.09/0.16 0.004/0.006 0.25 11o-13o SIDE VIEW 0o-7o 0.09/0.20 0.004/0.008 b1 b DETAIL "A" SCALE NONE SYMBOL A A1 A2 b b1 D E D1 E1 e 7.40 0.28 TYP L N (0.50) 7.40 MIN MAX 1.13 0.089 0.039 0.95 1.05 0.17 0.27 0.17 -0.23 7 BSC 7 BSC 5 BSC 5 BSC 0.5 BSC 0.45 0.75 32 NOTES 6 6 NOTES: 1. Controlling Dimension; Millimeter, converted inch dimensions are not necessarily exact. 2. All dimensioning and tolerancing conform to ANSI Y14.5-1982. 3. Dimensions D and E to be determined at seating plane -C4. Dimensions D1 and E1 to be determined at datum plane -H- (1.20) TYP TYPICAL RECOMMENDED LAND PATTERN 5. Dimensions D1 and E1 do not include mold protusion. Allowable protusion is 0.25mm (0.010 inch) per side. 6. Dimension b does not include dambar protusion. Allowable dambar protusion shall not cause the lead width to exceed the maximum b dimensions by more than 0.08mm (0.0003 inch). 7. “N” is the number of terminal position. 1