Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
Q80.12x12A
80 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE (TQFP)
Rev 1, 3/11
14.00
12.00
D
A
3
4
14.00
12.00
3 4
B
4X
0.20 C A-B D
4X
BOTTOM VIEW
0.20 H A-B D
0.50
TOP VIEW
1.20 MAX
11/13°
0° MIN
0.05
2
H
1.00 ±0.05
C
0.09-0.20
0.20 -0.03/+0.07
0.08 M C A - B D
0.08 C
SEE DETAIL "A"
6
0.05/0.15
0.08
R. MIN.
0.20 MIN.
SIDE VIEW
0.25
0-7° GAUGE
PLANE
0.60 ±0.15
(1.00)
DETAIL "A"
SCALE: NONE
(14.60)
(0.28) TYP
NOTES:
1. All dimensioning and tolerancing conform to ANSI Y14.5-1982.
2. Datum plane H located at mold parting line and coincident
with lead, where lead exits plastic body at bottom of parting line.
3. Dimensions do not include mold protrusion. Allowable mold
protrusion is 0.25mm per side.
4. These dimensions to be determined at datum plane H.
(14.60)
5. Package top dimensions are smaller than bottom dimensions
and top of package will not overhang bottom of package.
(0.50)
(1.20) TYP
TYPICAL RECOMMENDED LAND PATTERN
1
6. Does not include dambar protrusion. Allowable dambar
protrusion shall be 0.08mm total in excess of the dimension
at maximum material condition. Dambar cannot be located on
the lower radius or the foot.
7. Controlling dimension: millimeter.
8. This outline conforms to JEDEC publication 95 registration
MS-026, variation ADD.
9. Dimensions in ( ) are for reference only.