UM1002/1002L Rev.01 Reliability Report FOR UM1002/1002L February 8, 2007 UNION SEMICONDUCTOR, INC. Written by Approved by Liming Ge Quality Assurance Engineer Tina Liu Quality Assurance Manager Conclusion The UM1002/1002L successfully meets the quality and reliability standards required of all Union products. In addition, Union’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Union’s quality and reliability standards. Table of Contents I. ........Device Description II. ........Manufacturing Information III. ........Packaging Information IV. ........Die Information V. ............Reliability Evaluation I. Device Description A. General UM1002/UM1002L is a low pass filter array with integrated TVS diodes for ESD protection. It is designed to provide bidirectional filtering of EMI/ RFI signals and electrostatic discharge (ESD) protection in portable electronic equipment. This state-of-the art device utilizes solid-state silicon-avalanche technology for superior clamping performance and DC electrical characteristics. They have been optimized for use on a USB port in cellular phone and other portable electronics. This small package will protect and filter up to two lines. The TVS diodes are bi-directional for supporting bipolar signals without distortion. The TVS diodes provide effective suppression of ESD voltages in excess of 15kV (air discharge) and 8kV (contact discharge) per IEC61000-4-2, level 4. B. Absolute Maximum Ratings Steady-State Power (Pss ) 100 mWatts Lead Soldering Temperature (TL) 260°C (10 sec.) Operating Temperature (TA) -55 to +125 °C Storage Temperature ( TSTG) -55 to +150 °C Maximum Junction Temperature TJMAX 150 °C II. Manufacturing Information A. Process: Bipolar B. Wafer Type: 1002 C. Fabrication Location: P.R.China D. Assembly Location: P.R.China III. Packaging Information A. Package Type: SOT23-6 B. Lead Frame: Copper C. Lead Finish: Solder Plate D. Die Attach: N/A E. Bondwire: Gold (1.0 mil dia.) F. Mold Material: Epoxy with silica filler G. Flammability Rating: Class UL94-V0 I. Classification of Moisture Sensitivity per JEDEC standard JESD22-A113: Level 1 IV. Die Information A. Dimensions: 0.919 x 0.893 mm2 B. Passivation: Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) C. Interconnect: Al/Si/Cu D. Backside Metallization: GeNiAg E. Minimum Metal Width: Metal 1 .2microns F. Minimum Metal Spacing: Metal 1 .2 microns G. Bondpad Dimensions: 90 x 90 mm2 H. Isolation Dielectric: SiO2 I. Die Separation Method: Wafer Saw V. Reliability Evaluation A. Accelerated Life Test Sample Size Conditions Pass Failure 80 Tj=125℃,168hr 80 0 Test Circuit UM1002/1002L B. Reliability evaluation test Test Item Test Condition Failure Package Identifi-cation Sample Number Size of Failure Precondition -65-150ºC,Dewell=15Min, Electrical JESD22-A113-D 5 Cycle; 125ºC,24h; parameters & 85ºC/85%RH, 168h; functionality SOT23-6 100 0 SOT23-6 77 0 SOT23-6 77 0 SOT23-6 77 0 240ºC, 3 Times TEMP. Cycle -65-150ºC,Dewell=15Min, Electrical JESD22-A104-B 5 Cycle， 500 Cycles parameters & functionality Pressure Cooker 121ºC, 100%RH, 2atm, Electrical JESD22-A102-C 168h parameters & functionality Temp. & Humi. 85ºC/85%RH, 500h Electrical JESD22-A101-B parameters & functionality High Temp. Storage 150ºC, 500h JESD22-A103-B Electrical SOT23-6 77 0 parameters & functionality C. ESD The UM1002/1002L die type has been found to have all pins able to withstand a transient pulse of ± 15KV (Air) and 8 KV (Contact), per IEC 61000-4-2, level 4. (reference following ESD Test Circuit). Terminal A: Each pin individually connected to terminal A except Pin 2, 5 with the other pins floating. Terminal B: Pin 2, 5 connected to terminal B. A B