Plastic Packages for Integrated Circuits Thin Shrink Small Outline Plastic Packages (TSSOP) M38.173 N INDEX AREA E 0.25(0.010) M E1 2 INCHES GAUGE PLANE -B1 38 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-153-BD-1 ISSUE F) B M SYMBOL A 3 A1 L 0.05(0.002) -A- A D -C- e α A2 A1 b 0.10(0.004) M 0.25 0.010 SEATING PLANE c 0.10(0.004) C A M B S MIN 0.002 1. These package dimensions are within allowable dimensions of JEDEC MO-153-BD-1, Issue F. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E1” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. (Angles in degrees) 1 MIN MAX NOTES 0.047 - 1.20 - 0.006 0.05 0.15 - A2 0.031 0.051 0.80 1.05 - b 0.0075 0.0106 0.17 0.27 9 c 0.0035 0.0079 0.09 0.20 - D 0.378 0.386 9.60 9.80 3 E1 0.169 0.177 4.30 4.50 4 e 0.0197 BSC 0.500 BSC - E 0.246 0.256 6.25 6.50 - L 0.0177 0.0295 0.45 0.75 6 8o 0o N NOTES: MILLIMETERS MAX α 38 0o 38 7 8o Rev. 0 1/03