Plastic Packages for Integrated Circuits Package Outline Drawing M48.240 48 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP) Rev 1, 11/10 0.50 B 0.09-0.20 48 8.1 C L 6.1±0.10 4 0.20 C A B 2X N/2 TIPS 123 PIN 1 ID 0.17-0.27 SEE DETAIL "A" 0.08 M C A B 5 BOTTOM VIEW TOP VIEW A 1.10 MAX 0.90±0.05 0.05 (1.45) C 12.50±0.10 (7.35) 0.05/0.15 4 0.10 C SEATING PLANE SIDE VIEW (12°) TYP (1.00) (46X 0.50) (48X 0.28) 0.25 PARTING LINE TYPICAL RECOMMENDED LAND PATTERN H 3 (0-8°) 0.6±0.15 DETAIL "A" SCALE: (NONE) (VIEW ROTATED 90° C.W.) NOTES: 1. All dimensions are in millimeters (angles in degrees). 2. Dimensioning & tolerances per ASME. Y14.5m-1994. 3. Datum plane H located at mold parting line and coincident with lead where lead exits plastic body at bottom of parting line. 4. At reference datum and does not include mold flash or protrusions, and is measured at the bottom parting line. Mold flash or protrusions shall not exceed 0.15mm on the package ends and 0.25mm between the leads. 5. The lead width dimension does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm total in excess of the lead width dimension at maximum material condition. Dambar cannot be located on the lower radius or the foot. Minimum space between protrusions and an adjacent lead should be 0.07mm. 6. This part is compliant with JEDEC specification MO-153 variation ED except it is 0.1mm thinner. 7. Dimensions in ( ) are for reference only. 1