Plastic Packages for Integrated Circuits Package Outline Drawing L56.8x8G 56 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (PUNCH QFN WITH WETABLE FLANK) Rev 1, 2/14 2X A 8.00 0.10 C A 7.75 0.10 M C A B PIN #1 ID 0.20 R. N 4.5 4X 0.42±0.18 2X 0.10 C B N 4X 0.42±0.18 1 2 3 5 0.80 DIA. 1 2 3 0.45 7.75 8.00 5.2 (1.00) 0.10 M C B A CC 0.10 C B 2X B 0.10 C A 2X Nx 0.25 0.10 M C A B 0.05 M C 0.50 0.40±0.10 0.15±0.10 (6.50) TOP VIEW BOTTOM VIEW 4.50 Sq 6 0.10 C 0.85 (52 x 0.50) 0.08 C 0.00 MIN/0.05 MAX 0.25 0.20 4 0.65 7.80 Sq 5.20 Sq 0.01 SECTION "C-C" SCALE: NONE 56 x 0.25 0.15±0.05 0.25 0.00 MIN/0.05 MAX (56 x 0.60) TYPICAL RECOMMENDED LAND PATTERN SEE DETAIL "A" 0 TO 12° C SEATING PLANE SIDE VIEW NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. Allowable die thickness is 0.305mm. Maximum 0.012 inches. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ±0.05 4. Dimension b applies to the plated terminal and is measured 5. The pin #1 identifier must exist on the top surface of the package by using indentation mark or other feature of package body. 6. Unilateral coplanarity zone applies to the exposed pad as well as the terminals. between 0.15mm and 0.30mm from the terminal tip. 1 0.10±0.05 DETAIL "A" SCALE: NONE