Plastic Packages for Integrated Circuits Package Outline Drawing W5x7.35 35 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm Pitch) Rev 0, 11/14 0.400 X Y 2.14±0.030 G F 35x0.265±0.035 E D 2.88 ±0.030 C B 0.240 A (4X) 0.10 1 TOP VIEW 2 3 4 5 0.005 PIN 1 (A1 CORNER) 0.275 0.265 BOTTOM VIEW Z 0.240 0.05 Z PACKAGE OUTLINE SEATING PLANE 3 0.290 2 0.265±0.035 0.10 0.05 0.400 4 6 NSMD 0.200±0.030 RECOMMENDED LAND PATTERN 0.500±0.050 SIDE VIEW NOTES: 1. Dimensions and tolerance per ASME Y 14.5M - 1994. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z . 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. 5. All dimensions are in millimeters. 6. NSMD refers to non-solder mask defined pad design per Intersil Techbrief TB451. 1 ZXY Z