Plastic Packages for Integrated Circuits Wafer Level Chip Scale Package (WLCSP) W6x6.36 6x6 ARRAY 36 BALL WAFER LEVEL CHIP SCALE PACKAGE E PIN 1 ID D TOP VIEW SYMBOL MILLIMETERS A 0.44 Min, 0.495 Nom, 0.55 Max A1 0.190 ±0.030 A2 0.305 ±0.025 b 0.270 ±0.030 D 2.530 ±0.020 D1 2.000 BASIC E 2.530 ±0.020 E1 2.000 BASIC e 0.400 BASIC SD 0.200 BASIC SE 0.200 BASIC Number of Bumps: 36 Rev. 0 6/08 NOTES: 1. Dimensions are in millimeters. A A2 A1 b SIDE VIEW E1 SE e SD D1 b BOTTOM VIEW 1