Plastic Packages for Integrated Circuits Package Outline Drawing W7x8.52 7X8 ARRAY 52 BALLS WITH 0.40 PITCH WAFER LEVEL CHIP SCALE PACKAGE Rev 1, 10/14 Y X 0.400 3.14 ±0.030 H G 52x 0.265 ±0.035 F E 3.54 ±0.030 D C 0.370 B A 0.10 (4X) 1 2 0.400 PIN 1 (A1 CORNER) 3 4 5 6 7 0.370 TOP VIEW BOTTOM VIEW 0.05 PACKAGE OUTLINE 0.240 Z Z SEATING PLANE 5 0.265 ±0.035 4 0.10 ZXY 0.05 Z 0.290 0.400 0.200 ±0.030 3 NSMD TYPICAL RECOMMENDED LAND PATTERN NOTES: 1. 2. 3. 4. 5. All dimensions are in millimeters. Dimensions and tolerance per ASME Y 14.5M - 1994, and JESD 95-1 SPP-010. NSMD refers to non-solder mask defined pad design per Intersil Techbrief TB451. Dimension is measured at the maximum bump diameter parallel to primary datum Z . Primary datum Z and seating plane are defined by the spherical crowns of the bump. 1 0.500 ±0.050 SIDE VIEW