485ED

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
QFN32 7x7, 0.65P
CASE 485ED
ISSUE A
DATE 09 JUL 2015
1
32
SCALE 2:1
ÇÇ
PIN 1
INDICATOR
A B
D
L
L1
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
E
EXPOSED Cu
0.10 C
2X
TOP VIEW
DIM
A
A1
A3
b
D
D2
E
E2
e
L
L1
MOLD CMPD
DETAIL B
DETAIL B
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.25MM FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
ÉÉ
ÇÇ
0.10 C
2X
L
ALTERNATE
CONSTRUCTION
A3
A
0.08 C
A1
SIDE VIEW
NOTE 4
C
DETAIL A
32X
SEATING
PLANE
MILLIMETERS
MIN
MAX
0.80
0.90
0.00
0.05
0.20 REF
0.25
0.35
7.00 BSC
4.60
4.80
7.00 BSC
4.60
4.80
0.65 BSC
0.45
0.65
0.00
0.15
GENERIC
MARKING DIAGRAM*
D2
L
1
9
16
XXXXXXXXX
XXXXXXXXX
AWLYYWWG
17
8
E2
1
24
32
25
e
e/2
BOTTOM VIEW
32X
b
0.10 C A B
0.05 C
NOTE 3
RECOMMENDED
MOUNTING FOOTPRINT
7.30
5.00
A
WL
YY
WW
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
32X
0.78
PACKAGE
OUTLINE
1
5.00
7.30
32X
0.65
PITCH
DOCUMENT NUMBER:
0.40
DIMENSIONS: MILLIMETERS
98AON23217F
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
QFN32 7X7, 0.65MM PITCH
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON23217F
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY D. TRUHITTE.
29 JUN 2013
A
REDREW TO ON SEMICONDUCTOR AND JEDEC STANDARDS. REQ. BY B.
BLAUER.
09 JUL 2015
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2015
July, 2015 − Rev. O
Case Outline Number:
485ED