Plastic Packages for Integrated Circuits Package Outline Drawing L8.2x2 8 Lead Ultra Thin Dual Flat No-Lead COL Plastic Package (UTDFN COL) Rev 4, 05/15 2X 1.5 2.00 A 6 PIN 1 INDEX AREA PIN #1 INDEX AREA 6 B 6X 0.50 1 4 7X 0.4 ± 0.1 1X 0.5 ±0.1 2.00 (4X) 0.15 8 5 0.10 M C A B TOP VIEW 4 0.25 +0.05 / -0.07 BOTTOM VIEW ( 8X 0 . 25 ) SEE DETAIL "X" ( 1X 0 .70 ) 0 . 55 MAX 0.10 C C BASE PLANE SEATING PLANE 0.08 C (1.8 ) SIDE VIEW C ( 7X 0 . 60 ) 0 . 2 REF 5 0 . 00 MIN. 0 . 05 MAX. ( 6X 0 . 5 ) DETAIL "X" TYPICAL RECOMMENDED LAND PATTERN NOTES: 1. 1 Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends). 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature.