Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L8.1.4x1.2
8 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 0, 4/09
0.80
REF
4X 0.40 BSC
1.40
A
PIN 1
INDEX AREA
PIN 1
INDEX AREA
B
6
8
0.30
1.20
C0.10
5
1
0.40
0.60
7X 0.30
0.10
2X
±0.05
2
4
0.10 M C A B
0.40 BSC
TOP VIEW
0.05 M C
4 8 X 0.20
BOTTOM VIEW
SEE DETAIL "X"
0.80
REF
MAX. 0.50
4X 0.40
PKG OUTLINE
0.10
C
C
SEATING PLANE
0.08
8 X 0.20
C
SIDE VIEW
0.60
0.60
7X 0.50
C
0 . 2 REF
0.70
0.60
0-0.05
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 indentifier may be
either a mold or mark feature.
1