Data Sheet

KMZ41
Magnetic field sensor
Rev. 6 — 18 November 2010
Product data sheet
1. Product profile
1.1 General description
The KMZ41 is a sensitive magnetic field sensor, employing the magneto-resistive effect of
thin film permalloy. The sensor contains two galvanically separated Wheatstone bridges,
which enclose an angle of 45 degrees.
A rotating magnetic field strength > 40 kA/m (recommended field strength > 100 kA/m) in
the surface parallel to the chip (x-y plane) will deliver two independent sinusoidal output
signals, one following a cos(2α) and the second following a sin(2α) function.
The sensor can be operated at any frequency between DC and 1 MHz.
1.2 Features and benefits
„
„
„
„
„
Accurate and reliable angle measurement
Mechanical robustness, contactless principle
Wear-free operation
Accuracy independent of mechanical tolerances
Extended temperature range
1.3 Quick reference data
Table 1.
Quick reference data
Tamb = 25 °C and Hext = 100 kA/m, VCC = 5 V unless otherwise specified.
Symbol
VCC
Vpeak
Parameter
Min
Typ
Max
Unit
supply voltage
[1]
-
5
9
V
peak voltage
see Figure 2
[1]
73
81
89
mV
per supply voltage;
see Figure 2
[1]
−2
-
+2
mV/V
2.0
2.5
3.0
kΩ
Voffset
offset voltage
Rbridge
bridge resistance
Conditions
[1][2]
[1]
Applicable for bridge 1 and bridge 2.
[2]
Bridge resistance between pin 4 and pin 8, pin 3 and pin 7, pin 5 and pin 1, pin 6 and pin 2.
KMZ41
NXP Semiconductors
Magnetic field sensor
2. Pinning information
Table 2.
Pinning
Pin
Symbol
Description
Simplified outline
1
ON1
output voltage bridge 1
2
ON2
output voltage bridge 2
3
VCC2
supply voltage bridge 2
4
VCC1
supply voltage bridge 1
5
OP1
output voltage bridge 1
6
OP2
output voltage bridge 2
7
GND2
supply voltage bridge 2
8
GND1
supply voltage bridge 1
8
5
x
y
1
4
mgd790
3. Ordering information
Table 3.
Ordering information
Type number
KMZ41
Package
Name
Description
Version
SO8
plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
4. Circuit diagram
KMZ41
bridge 1
bridge 2
cos
R11
R13
VCC1
OP1
VCC1
sin
R21
R12
R14
R23
GND1
ON1
OP2
R22
R24
GND2
VO1
VO2
V
V
VOP1
V
VON1
V
VOP2
V
ON2
VCC2
VON2
VCC2
V
006aaa529
Fig 1.
KMZ41
Product data sheet
Device and test circuit diagram
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 18 November 2010
© NXP B.V. 2010. All rights reserved.
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KMZ41
NXP Semiconductors
Magnetic field sensor
5. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
[1]
Min
Max
Unit
-
9
V
VCC
supply voltage
Hext
external magnetic field strength
40
-
kA/m
Tamb
ambient temperature
−40
+150
°C
Tstg
storage temperature
−65
+150
°C
[1]
Applicable for bridge 1 and bridge 2.
6. Thermal characteristics
Table 5.
KMZ41
Product data sheet
Thermal characteristics
Symbol
Parameter
Rth(j-a)
thermal resistance from junction
to ambient
Conditions
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 18 November 2010
Typ
Unit
155
K/W
© NXP B.V. 2010. All rights reserved.
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KMZ41
NXP Semiconductors
Magnetic field sensor
7. Characteristics
Table 6.
Characteristics
Tamb = 25 °C and Hext = 100 kA/m, VCC = 5 V unless otherwise specified.
Symbol
Min
Typ
Max
Unit
supply voltage
[1]
-
5
9
V
Vpeak
peak voltage
[1]
73
81
89
mV
TCVpeak
temperature coefficient of peak Tamb = −40 °C to +150 °C
voltage
[1][2]
−0.38
−0.41
−0.44
%/K
Rbridge
bridge resistance
[1][3]
2.0
2.5
3.0
kΩ
[1][4]
0.31
0.33
0.35
%/K
[1]
−2
-
+2
mV/V
VCC
Parameter
Conditions
see Figure 2
TCRbridge
temperature coefficient of
bridge resistance
Tamb = −40 °C to +150 °C
Voffset
offset voltage
per supply voltage;
see Figure 2
TCVoffset
temperature coefficient of
offset voltage
per supply voltage;
Tamb = −40 °C to +150 °C;
see Figure 2
[1][5]
−2
-
+2
(μV/V)/K
FH
hysteresis of output voltage
see Figure 3
[1][6]
k
amplitude synchronism
TCk
temperature coefficient of
amplitude synchronism
Δα
angular inaccuracy
Tamb = −40 °C to +150 °C
0
0.01
0.04
%FS
[7]
99
100
101
%
[8]
−0.005
0
+0.005
%/K
[9]
0
0.1
0.25
deg
[1]
Applicable for bridge 1 and bridge 2.
[2]
V peak ( at 150 °C ) – V peak ( at – 40 °C )
TCV peak = 100 × --------------------------------------------------------------------------------------------------V peak ( at 25 °C ) × ( 150 °C – ( – 40 °C ) )
[3]
Bridge resistance between pin 4 and pin 8, pin 3 and pin 7, pin 5 and pin 1, pin 6 and pin 2.
[4]
R bridge ( at 150 °C ) – R bridge ( at – 40 °C )
TCR bridge = 100 × ------------------------------------------------------------------------------------------------------R bridge ( at 25 °C ) × ( 150 °C – ( – 40 °C ) )
[5]
V offset ( at 150 °C ) – V offset ( at – 40 °C )
TCV offset = ------------------------------------------------------------------------------------------------150 °C – ( – 40 °C )
[6]
V O1 ( 67.5° )135° → 45 ° – V O1 ( 67.5° )45° → 135 °
FH 1 = 100 × --------------------------------------------------------------------------------------------------------------------------2 × V peak1
V O2 ( 22.5° )90° → 0 ° – V O2 ( 22.5° )0° → 90 °
FH 2 = 100 × --------------------------------------------------------------------------------------------------------------2 × V peak2
[7]
V peak1
k = 100 × ---------------V peak2
[8]
k ( at 150 °C ) – k ( at – 40 °C )
TCk = 100 × ---------------------------------------------------------------------------------------k ( at 25 °C ) × ( 150 °C – ( – 40 °C ) )
[9]
Δα = |αreal − αmeas|; Voffset = 0 V; inaccuracy of angular measurement due to deviation from ideal sinusoidal characteristics, calculated
from the third and fifth harmonics of the spectrum of VO.
KMZ41
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 18 November 2010
© NXP B.V. 2010. All rights reserved.
4 of 10
KMZ41
NXP Semiconductors
Magnetic field sensor
VO
(mV)
α = 0°
VO2
direction of
magnetic field
α
Vpeak2
Voffset2
ON1
GND1
ON2
GND2
0
VCC2
OP2
VCC1
OP1
VO1
mgu175
0
Fig 2.
90
270
180
α (deg)
360
Output signals related to the direction of the magnetic field
006aaa530
VO
(mV)
FH2
FH1
VO1
0
0
Fig 3.
KMZ41
Product data sheet
45
VO2
90
α (deg)
135
Definition of hysteresis
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 18 November 2010
© NXP B.V. 2010. All rights reserved.
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KMZ41
NXP Semiconductors
Magnetic field sensor
8. Package outline
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
c
y
HE
v M A
Z
5
8
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
4
1
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.069
0.010 0.057
0.004 0.049
0.01
0.019 0.0100
0.014 0.0075
0.20
0.19
0.16
0.15
0.05
0.01
0.01
0.004
0.028
0.012
inches
0.244
0.039 0.028
0.041
0.228
0.016 0.024
θ
o
8
o
0
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
Fig 4.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT96-1
076E03
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Package outline SOT96-1 (SO8/MS-012)
KMZ41
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 18 November 2010
© NXP B.V. 2010. All rights reserved.
6 of 10
KMZ41
NXP Semiconductors
Magnetic field sensor
9. Packing information
Table 7.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
Package
Description
Packing quantity
2500
KMZ41
[1]
SOT96-1
8 mm pitch, 12 mm tape and reel
-118
12NC ordering code: 9340 372 10118. For further information and the availability of packing methods, see Section 12.
10. Revision history
Table 8.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
KMZ41 v.6
20101118
Product data sheet
CPCN201007013F
KMZ41_5
KMZ41_5
20061127
Product data sheet
-
KMZ41_4
KMZ41
Product data sheet
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Rev. 6 — 18 November 2010
© NXP B.V. 2010. All rights reserved.
7 of 10
KMZ41
NXP Semiconductors
Magnetic field sensor
11. Legal information
11.1
Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
11.2
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
11.3
Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. The product is not designed, authorized or warranted to be
KMZ41
Product data sheet
suitable for use in medical, military, aircraft, space or life support equipment,
nor in applications where failure or malfunction of an NXP Semiconductors
product can reasonably be expected to result in personal injury, death or
severe property or environmental damage. NXP Semiconductors accepts no
liability for inclusion and/or use of NXP Semiconductors products in such
equipment or applications and therefore such inclusion and/or use is at the
customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 18 November 2010
© NXP B.V. 2010. All rights reserved.
8 of 10
KMZ41
NXP Semiconductors
Magnetic field sensor
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
11.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
KMZ41
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 18 November 2010
© NXP B.V. 2010. All rights reserved.
9 of 10
KMZ41
NXP Semiconductors
Magnetic field sensor
13. Contents
1
1.1
1.2
1.3
2
3
4
5
6
7
8
9
10
11
11.1
11.2
11.3
11.4
12
13
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Circuit diagram . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6
Packing information . . . . . . . . . . . . . . . . . . . . . 7
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 7
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Contact information. . . . . . . . . . . . . . . . . . . . . . 9
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 18 November 2010
Document identifier: KMZ41