Data Sheet

KMZ43T
Magnetic field sensor
Rev. 05 — 4 March 2009
Product data sheet
1. Product profile
1.1 General description
The KMZ43T is a sensitive magnetic field sensor, employing the magnetoresistive effect
of thin-film permalloy. The sensor contains two galvanic separated Wheatstone bridges, at
a relative angle of 45° to one another.
A rotating magnetic field in the x-y plane will produce two independent sinusoidal output
signals, one a function of +cos(2α) and the second a function of +sin(2α), α being the
angle between sensor and field direction (see Figure 2). The KMZ43T is suited to high
precision angle measurement applications under low field conditions (saturation field
strength 25 kA/m).
The sensor can be operated at any frequency between 0 Hz and 1 MHz.
1.2 Features
n
n
n
n
n
Accurate and reliable angle measurement
Mechanical robustness, contactless principle
Wear-free operation
Accuracy independent of mechanical tolerances
Extended temperature range
1.3 Applications
n Steering angle and torsion
n Headlight adjustment
n Motor positioning
n Window wipers
n Fuel level
n Mirror positioning
1.4 Quick reference data
Table 1.
Quick reference data
Tamb = 25 °C and Hext = 25 kA/m; VCC = 5 V; unless otherwise specified.
Symbol
Parameter
Min
Typ
Max
Unit
VCC
supply voltage
[1]
-
5
9
V
peak output voltage
see Figure 2
[1]
60
67
75
mV
per supply voltage;
see Figure 2
[1]
−2
-
+2
mV/V
2.7
3.2
3.7
kΩ
Vpeak
Voffset
offset voltage
Rbridge
bridge resistance
Conditions
[1][2]
[1]
Applicable for bridge 1 and bridge 2.
[2]
Bridge resistance between pin 4 to pin 8, pin 3 to pin 7, pin 1 to pin 5 and pin 2 to pin 6.
KMZ43T
NXP Semiconductors
Magnetic field sensor
2. Pinning information
Table 2.
Pinning
Pin
Symbol
Description
Simplified outline
1
ON1
output voltage bridge 1
2
ON2
output voltage bridge 2
3
VCC2
supply voltage bridge 2
4
VCC1
supply voltage bridge 1
5
OP1
output voltage bridge 1
6
OP2
output voltage bridge 2
7
GND2
ground 2
8
GND1
ground 1
8
5
1
4
3. Ordering information
Table 3.
Ordering information
Type number
KMZ43T
Package
Name Description
Version
SO8
SOT96-1
plastic small outline package; 8 leads; body width 3.9 mm
4. Circuit diagram
KMZ43T
bridge 1
bridge 2
cos
R11
R13
VCC1
OP1
VCC1
sin
R21
R12
R14
R23
GND1
ON1
OP2
R22
R24
GND2
VO1
VO2
V
V
VOP1
V
VON1
V
VOP2
V
ON2
VCC2
VON2
VCC2
V
008aaa100
Fig 1.
Device and test circuit diagram
KMZ43T_5
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 05 — 4 March 2009
2 of 8
KMZ43T
NXP Semiconductors
Magnetic field sensor
5. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
[1]
Min
Max
Unit
-
9
V
kA/m
VCC
supply voltage
Hext
external magnetic field strength
25
-
Tamb
ambient temperature
−40
+150 °C
Tstg
storage temperature
−65
+150 °C
[1]
Applicable for bridge 1 and bridge 2.
6. Thermal characteristics
Table 5.
Thermal characteristics
Symbol
Parameter
Rth(j-a)
thermal resistance from junction to ambient
KMZ43T_5
Product data sheet
Conditions
Typ
Unit
155
K/W
© NXP B.V. 2009. All rights reserved.
Rev. 05 — 4 March 2009
3 of 8
KMZ43T
NXP Semiconductors
Magnetic field sensor
7. Characteristics
Table 6.
Characteristics
Tamb = 25 °C and Hext = 25 kA/m; VCC = 5 V; unless otherwise specified.
Symbol
Min
Typ
Max
Unit
supply voltage
[1]
-
5
9
V
Vpeak
peak output voltage
[1]
60
67
75
mV
TCVpeak
temperature coefficient of peak Tamb = −40 °C to +150 °C
output voltage
[1][2]
−0.3
−0.36
−0.42
%/K
Rbridge
bridge resistance
[1][3]
2.7
3.2
3.7
kΩ
[1][4]
0.24
0.26
0.29
%/K
[1]
−2
-
+2
mV/V
VCC
Parameter
Conditions
see Figure 2
TCRbridge
temperature coefficient of
bridge resistance
Tamb = −40 °C to +150 °C
Voffset
offset voltage
per supply voltage;
see Figure 2
TCVoffset
temperature coefficient of
offset voltage
per supply voltage;
Tamb = −40 °C to +150 °C;
see Figure 2
[1][5]
−4
-
+4
(µV/V)/K
FH
hysteresis of output voltage
see Figure 3
[1][6]
0
0.05
0.18
%FS
k
amplitude synchronism
TCk
temperature coefficient of
amplitude synchronism
∆α
angular inaccuracy
Tamb = −40 °C to +150 °C
[7]
99.5
100
100.5
%
[8]
−0.01
-
+0.01
%/K
[9]
0
0.05
0.1
deg
[1]
Applicable for bridge 1 and bridge 2.
[2]
V peak ( at 150 °C ) – V peak ( at – 40 °C )
TC Vpeak = 100 × ---------------------------------------------------------------------------------------------------V peak ( at 25 °C ) × ( 150 °C – ( – 40 °C ) )
[3]
Bridge resistance between pin 4 to pin 8, pin 3 to pin 7, pin 1 to pin 5 and pin 2 to pin 6.
[4]
R bridge ( at 150 °C ) – R bridge ( at – 40 °C )
TC Rbridge = 100 × -------------------------------------------------------------------------------------------------------R bridge ( at 25 °C ) × ( 150 °C – ( – 40 °C ) )
[5]
V offset ( at 150 °C ) – V offset ( at – 40 °C )
TC Voffset = --------------------------------------------------------------------------------------------------150 °C – ( – 40 °C )
[6]
V O1 ( 67.5° )135°→45° – V O1 ( 67.5° )45°→135°
FH 1 = 100 × ----------------------------------------------------------------------------------------------------------------------2 × V peak1
V O2 ( 22.5° )90°→0° – V O2 ( 22.5° )0°→90°
F H 2 = 100 × ----------------------------------------------------------------------------------------------------------2 × V peak2
[7]
V peak1
k = 100 × ----------------V peak2
[8]
k ( at 150 °C ) – k ( at – 40 °C )
TC k = 100 × ---------------------------------------------------------------------------------------k ( at 25 °C ) × ( 150 °C – ( – 40 °C ) )
[9]
∆α = α real – α meas ; Voffset = 0 V; inaccuracy of angular measurement due to deviations from ideal sinusoidal characteristics,
calculated from the third and fifth harmonics of the spectrum VO.
KMZ43T_5
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 05 — 4 March 2009
4 of 8
KMZ43T
NXP Semiconductors
Magnetic field sensor
VO
(mV)
α = 0°
VO2
direction of
magnetic field
α
Vpeak2
Voffset2
ON1
GND1
ON2
GND2
0
VCC2
OP2
VCC1
OP1
VO1
mgu175
0
Fig 2.
90
270
180
α (deg)
360
Output signals related to the direction of the magnetic field
006aaa530
VO
(mV)
FH2
FH1
VO1
0
0
Fig 3.
45
90
α (deg)
135
Definition of hysteresis
KMZ43T_5
Product data sheet
VO2
© NXP B.V. 2009. All rights reserved.
Rev. 05 — 4 March 2009
5 of 8
KMZ43T
NXP Semiconductors
Magnetic field sensor
8. Package outline
5.0
4.8
1.75
1.0
0.4
6.2
5.8
4.0
3.8
pin 1 index
1.27
0.49
0.36
0.25
0.19
Dimensions in mm
Fig 4.
03-02-18
Minimized package outline SOT96-1
9. Revision history
Table 7.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
KMZ43T_5
20090304
Product data sheet
-
KMZ43T_4
Modifications:
•
Table 6: TCVpeak and TCRbridge values adapted to 25 °C reference point
KMZ43T_4
20080326
Product data sheet
-
KMZ43T_3
KMZ43T_3
20030915
Product specification
-
KMZ43T_2
KMZ43T_2
20030326
Preliminary specification
-
KMZ43_1
KMZ43_1
20000824
Objective specification
-
-
KMZ43T_5
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 05 — 4 March 2009
6 of 8
KMZ43T
NXP Semiconductors
Magnetic field sensor
10. Legal information
10.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
10.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
10.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
11. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
KMZ43T_5
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 05 — 4 March 2009
7 of 8
KMZ43T
NXP Semiconductors
Magnetic field sensor
12. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
10.1
10.2
10.3
10.4
11
12
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . .
General description. . . . . . . . . . . . . . . . . . . . . .
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . .
Quick reference data. . . . . . . . . . . . . . . . . . . . .
Pinning information . . . . . . . . . . . . . . . . . . . . . .
Ordering information . . . . . . . . . . . . . . . . . . . . .
Circuit diagram. . . . . . . . . . . . . . . . . . . . . . . . . .
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal characteristics. . . . . . . . . . . . . . . . . . .
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .
Package outline . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . . . .
Legal information. . . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information. . . . . . . . . . . . . . . . . . . . . .
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1
1
1
1
1
2
2
2
3
3
4
6
6
7
7
7
7
7
7
8
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 4 March 2009
Document identifier: KMZ43T_5
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