510AH

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WQFN12 3x3, 0.5P
CASE 510AH−01
ISSUE O
DATE 20 JAN 2009
1
SCALE 4:1
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
A
D
PIN ONE
REFERENCE
2X
0.10 C
2X
L
B
L1
DETAIL A
ALTERNATE
CONSTRUCTIONS
E
ÎÎÎ
ÏÏ
ÏÏÏ ÏÏ
ÎÎ
EXPOSED Cu
0.10 C
TOP VIEW
DETAIL B
A3
0.10 C
A1
NOTE 4
C
SIDE VIEW
ALTERNATE
CONSTRUCTIONS
SEATING
PLANE
D2
DETAIL A
12X
4
L
7
E2
12X
b
0.10 C A B
1
0.05 C
K
MOLD CMPD
A1
A
DETAIL B
0.10 C
13X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L
NOTE 3
12
e
A3
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
MILLIMETERS
MIN
MAX
0.65
0.85
0.00
0.05
0.22 REF
0.20
0.30
3.00 BSC
1.30
1.50
3.00 BSC
1.30
1.50
0.50 BSC
0.20
−−−
0.30
0.50
0.00
0.15
GENERIC
MARKING DIAGRAM*
XXXXX
XXXXX
ALYWG
G
XXXXX = Specific Device Code
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”,
may or may not be present.
BOTTOM VIEW
SOLDERING FOOTPRINT*
12X
0.63
PACKAGE
OUTLINE
1
2X
2X
1.50 3.30
12X
0.30
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON38317E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
WQFN12, 3X3, 0.5P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON38317E
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY J. SAMUDIO.
DATE
20 JAN 2009
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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© Semiconductor Components Industries, LLC, 2009
January, 2009 − Rev. 01O
Case Outline Number:
510AH