Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Wafer Level Chip Scale Package (WLCSP 0.4mm Ball Pitch)
W3x4.12
3x4 ARRAY 12 BALL WAFER LEVEL CHIP SCALE PACKAGE
D
SYMBOL
MILLIMETERS
A
0.445 Min 0.495 Nom 0.545 Max
A1
0.190 ±0.025
A2
0.305 ±0.025
E
PIN 1 ID
TOP VIEW
A2
A
A1
b
0.270 ±0.030
D
1.695 ±0.020
D1
0.400 BASIC
E
1.295 ±0.020
E1
0.400 BASIC
e
0.400 BASIC
SD
0.200 BASIC
SE
0 BASIC
NUMBER OF BUMPS: 12
b
Rev. 0 12/08
SIDE VIEW
NOTES:
1. All Dimensions are in Millimeters.
b
e (E1)
SD
3
2
1
D
C
B
A
e (D1)
BOTTOM VIEW
1
SE