Plastic Packages for Integrated Circuits Wafer Level Chip Scale Package (WLCSP) W4x3.10A 4X3 ARRAY 10 BALL WAFER LEVEL CHIP SCALE PACKAGE E PIN 1 ID SYMBOL MILLIMETERS NOTES A 0.64 +0.05 -0.10 - A1 0.29 ±0.02 - D TOP VIEW bb A2 A A1 b A2 0.35 REF. - b θ 0.37 ±0.03 - bb θ 0.30 REF. - D 1.50 ±0.05 - D1 1.00 BASIC - E 2.00 ±0.05 - E1 1.50 BASIC - e 0.50 BASIC - SD 0.00 BASIC - SE 0.25 BASIC - N 10 3 Rev. 1 10/05 SIDE VIEW NOTES: 1. Dimensions are in Millimeters. 2. Dimensioning and tolerancing conform to ASME 14.5M-1994. E1 3. Symbol “N” is the actual number of solder balls. e SE C B SD A 1 3 2 BOTTOM VIEW 1 4 b D1