Application Notes

AN11717
KMA22x; KMA32x handling information
Rev. 1 — 21 October 2015
Application note
Document information
Info
Content
Keywords
KMA220, KMA221, KMA321, KMA322, package, handling, assembly
Abstract
This document describes the limitations to package handling and
precautions for safe assembly.
AN11717
NXP Semiconductors
KMA22x; KMA32x handling information
Revision history
Rev
Date
Description
1.0
20151021
initial version
Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
AN11717
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 21 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
2 of 13
AN11717
NXP Semiconductors
KMA22x; KMA32x handling information
1. Introduction
1.1 General
NXP Semiconductors is not the owner of customer processes and cannot test them under
all conditions. Therefore, the information below is a general guideline for product handling
and package assembly.
It does not replace the process development and release by the customer.
1.2 Package information
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$
The products KMA22x and KMA32x use the package SOT1188. It is fit for soldering and
welding. The leads can be bent according to customer requirements. The products require
gentle handling as especially the leads can bend unintentionally due to their small cross
section and length.
DDD
Fig 1.
KMA220 device in SOT1188 package
2. Storage
2.1 Store conditions
Secure and clean store areas must be provided to isolate and protect the products.
Conditions in the store areas shall be such that the quality of the products does not
deteriorate due to, among others, harmful gasses or electrical fields.
Storage conditions:
• Temperature
– Min. +8 C
– Max. +45 C
• Humidity
– Min. 25 %
– Max. 75 %
– No condensation is allowed under any condition
• Light intensity
– No direct sunlight
AN11717
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 21 October 2015
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KMA22x; KMA32x handling information
2.2 Shelf life
The shelf life for packed products is 4 years after the date code.
3. Precautions
3.1 Stress to sensor head
As all MagnetoResistive (MR) sensors, KMA22x and KMA32x react on severe mechanical
stress. It can compromise the accuracy of the device. Prevent bending (warping) of the
sensor head as that applies enormous stress to the sensor chip.
DDD
Fig 2.
Straight and warped sensor head
Often the sensor is attached to a substrate (e.g. a throttle body cover). The sensor should
be decoupled as much as possible from the substrate, e.g. by using a soft silicone glue to
fix the sensor.
3.2 Stress to sensor leads
Caused by differences in thermal expansion of sensor and environment (socket), high
amount of stress can be generated. To reduce that stress, bend the sensor or external
leads to prepare a flexible region. Bending recommendations see Section 5.2.
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Fig 3.
Stress reduction by lead bending
4. Product handling
4.1 ESD protection
Despite the KMA22x and KMA32x devices being equipped with capacitors to increase the
ESD robustness, apply the usual ESD protection measures.
AN11717
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 21 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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AN11717
NXP Semiconductors
KMA22x; KMA32x handling information
4.2 Forces on body
Forces on the plastic body during general handling should not exceed 10 N. Apply forces
via flat surfaces, parallel to the sensor surface. Avoid stress concentrations at smaller
areas.
4.3 Forces along leads
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Maximum pull force along leads is limited to 10 N per lead. Forces in other directions
should be prevented as the leads tend to bend easily. Pushing of leads can cause
caving-in.
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DDD
Fig 4.
Pull force along lead
4.4 Forces at fin
Maximum pull force is limited to 15 N. Forces perpendicular to the fin should be prevented
as the fin tends to bend easily.
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$
)
DDD
Fig 5.
AN11717
Application note
Pull force at fin
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 21 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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AN11717
NXP Semiconductors
KMA22x; KMA32x handling information
4.5 Product picking out of tape
Products should be picked by either a flat or cavity type sucker.
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DDD
Fig 6.
KMA22x; KMA32x in tape
5. Product assembly
5.1 Product alignment
5.1.1 Package features for alignment
Blue areas are preferred for alignment in socket.
Red areas should not be used for alignment due to uncontrolled package outline caused
by gate remains or potential mold compound flash.
Other areas can be used for alignment.
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Fig 7.
AN11717
Application note
DDD
Package alignment areas
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 21 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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AN11717
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KMA22x; KMA32x handling information
5.1.2 Reading point alignment
Best reference for the Reading Point (RP) is the Lead Frame (LF) as the die is attached to
the LF.
• As the fin is part of the lead frame, it is the preferred alignment feature.
• The RP has a tolerance of 0.1 mm regarding the fin.
• The lead frame formed the rim (mold compound flowed to the lead frame edge,
forming the rim). Therefore, it has the same tolerance of 0.1 mm.
.
0
$
ULP
ILQ
DDD
Fig 8.
Reading point alignment features
5.1.3 Pin alignment
Just aligning the package at the sensor head may not be sufficient to ensure proper
positioning of the pins to their external counterparts.
Align the product at the rim. It is also possible to align at the leads itself.
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Fig 9.
AN11717
Application note
Align pins to external leads at lower body
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 21 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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AN11717
NXP Semiconductors
KMA22x; KMA32x handling information
5.2 Lead bending
To adapt the packages to customer requirements, the leads can be bent as shown in
Figure 10 and Figure 11.
It is not recommended to bend the dambar (and fin) region (see Figure note 1 of
Figure 11) as the lead geometry in those areas can compromise the bending result.
Instead, bending is recommended at the straight parts of the leads.
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$
To prevent lead pull forces at the entrance to the plastic body, use proper clamping at the
leads in between the bending position and the plastic body.
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Fig 10. Bending position
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DDD
Dimensions in mm
(1) No bending allowed.
(2) Plastic body and interface plastic body - leads: application of bending forces not allowed.
Fig 11. Lead bending sketch
AN11717
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 21 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
8 of 13
AN11717
NXP Semiconductors
KMA22x; KMA32x handling information
5.2.1 Lead bend control
After intentional or unintentional lead bending or twisting, verify that the products are not
mechanically damaged.
Smooth bending without buckling in bending zone, inner radius > 250 m.
DDD
Fig 12. Smooth bending
DDD
Fig 13. Kink in bending zone, reject
No exposed Cu (Sn layer cracked, Cu core material exposed) allowed.
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$
Leads just in front of package entrance not bent, no gaps at lead entrance all around
leads.
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Fig 14. Lead entrance to body check
5.3 Soldering
The solderability qualification is according to AEC-Q100 Rev-G. Recommended soldering
process for leaded devices is wave soldering. The maximum soldering temperature is
260 C for maximum 5 s.
Alternatively, the device can be reflow soldered.
AN11717
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 21 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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AN11717
NXP Semiconductors
KMA22x; KMA32x handling information
5.4 Welding
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$
During electrowelding, a heat wave travels along the leads causing high stress to the
sensor product. To limit the stress, control the heat by verifying that the Sn reflow zone
does stop in front of plastic body (at body entrance).
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DDD
Fig 15. Welding information
AN11717
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 21 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
10 of 13
AN11717
NXP Semiconductors
KMA22x; KMA32x handling information
6. Legal information
6.1
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
6.2
Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
AN11717
Application note
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
6.3
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 21 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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AN11717
NXP Semiconductors
KMA22x; KMA32x handling information
7. Figures
Fig 1.
Fig 2.
Fig 3.
Fig 4.
Fig 5.
Fig 6.
Fig 7.
Fig 8.
Fig 9.
Fig 10.
Fig 11.
Fig 12.
Fig 13.
Fig 14.
Fig 15.
KMA220 device in SOT1188 package . . . . . . . . . .3
Straight and warped sensor head . . . . . . . . . . . . .4
Stress reduction by lead bending. . . . . . . . . . . . . .4
Pull force along lead . . . . . . . . . . . . . . . . . . . . . . .5
Pull force at fin . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
KMA22x; KMA32x in tape . . . . . . . . . . . . . . . . . . .6
Package alignment areas . . . . . . . . . . . . . . . . . . .6
Reading point alignment features . . . . . . . . . . . . .7
Align pins to external leads at lower body . . . . . . .7
Bending position . . . . . . . . . . . . . . . . . . . . . . . . . .8
Lead bending sketch . . . . . . . . . . . . . . . . . . . . . . .8
Smooth bending. . . . . . . . . . . . . . . . . . . . . . . . . . .9
Kink in bending zone, reject. . . . . . . . . . . . . . . . . .9
Lead entrance to body check. . . . . . . . . . . . . . . . .9
Welding information . . . . . . . . . . . . . . . . . . . . . . .10
AN11717
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 21 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
12 of 13
AN11717
NXP Semiconductors
KMA22x; KMA32x handling information
8. Contents
1
1.1
1.2
2
2.1
2.2
3
3.1
3.2
4
4.1
4.2
4.3
4.4
4.5
5
5.1
5.1.1
5.1.2
5.1.3
5.2
5.2.1
5.3
5.4
6
6.1
6.2
6.3
7
8
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Package information . . . . . . . . . . . . . . . . . . . . . 3
Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Store conditions . . . . . . . . . . . . . . . . . . . . . . . . 3
Shelf life . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Stress to sensor head. . . . . . . . . . . . . . . . . . . . 4
Stress to sensor leads . . . . . . . . . . . . . . . . . . . 4
Product handling . . . . . . . . . . . . . . . . . . . . . . . . 4
ESD protection . . . . . . . . . . . . . . . . . . . . . . . . . 4
Forces on body. . . . . . . . . . . . . . . . . . . . . . . . . 5
Forces along leads . . . . . . . . . . . . . . . . . . . . . . 5
Forces at fin . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Product picking out of tape . . . . . . . . . . . . . . . . 6
Product assembly . . . . . . . . . . . . . . . . . . . . . . . 6
Product alignment. . . . . . . . . . . . . . . . . . . . . . . 6
Package features for alignment . . . . . . . . . . . . 6
Reading point alignment . . . . . . . . . . . . . . . . . . 7
Pin alignment . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Lead bending . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Lead bend control . . . . . . . . . . . . . . . . . . . . . . . 9
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Welding. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2015.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 21 October 2015
Document identifier: AN11717
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