Data Sheet

SO
8
KMZ60
Angle sensor with integrated amplifier
Rev. 2 — 7 February 2014
Product data sheet
1. Product profile
1.1 General description
The MagnetoResistive (MR) sensor with integrated amplifier is designed for angular
control applications and BrushLess DC (BLDC) motors with even-numbered pole pairs.
It consists of two microchips within one package, an angle sensor and an amplifier
Integrated Circuit (IC). The circuit delivers cosine and sine output signals related to the
angle of a rotating magnetic field. The output voltage range is ratiometric related to the
supply voltage. The Temperature Coefficient (TC) of the sensor amplitude can be
compensated. A ratiometric output voltage linear to the temperature is delivered.
A Power-down mode is implemented.
1.2 Features and benefits









High precision sensor for magnetic angle measurement
Single-ended cosine and sine outputs
Ratiometric output voltages
Tamb = 40 C to +150 C
Temperature compensated output signal amplitude
Temperature related ratiometric reference voltage
Power-down mode to enable or disable the device
Single package angle sensor with integrated instrumentation amplifier
RoHS compliant and free of halogen and antimony (Dark Green compliant)
1.3 Applications
The KMZ60 angle sensor is dedicated for rotor position detection for BLDC motors.
Beyond that the KMZ60 is applicable for Electronic Power Steering (EPS) applications,
steering angle measurement, window wiper position detection and general contactless
angular measurement (e.g. throttle valves or actuators). The KMZ60 is fully automotive
qualified as well as applicable for industrial and consumer applications.
Typical applications:
 BLDC motor (e.g. EPS)
 Window wiper position detection
 Steering angle measurement
 General contactless angular measurement (e.g. throttle valves or actuators)
 Automotive, industrial and consumer applications
KMZ60
NXP Semiconductors
Angle sensor with integrated amplifier
1.4 Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
VCC
Conditions
Min
Typ
Max
Unit
supply voltage
2.7
-
5.5
V
nH
magnetic field rotational
frequency
0
-
25000
r/min
Hext
external magnetic field
strength
[1]
25
-
-
kA/m

angular inaccuracy
[2]
0.1
-
+0.1
deg
Cblock(ext)
external blocking
capacitance
[3]
100
-
-
nF
RL(o)ext
external output load
resistance
[4]
5
-

k
CL(o)ext
external output load
capacitance
[5]
0.5
-
10
nF
within a static
field
on pin VOUT1
and pin VOUT2
[1]
Induced voltage from a rotating strong magnetic field may impact the performance but without damage.
[2]
Value calculated only with third and fifth harmonic of the spectrum of output signal amplitude Vo(VOUT1) and
Vo(VOUT2) by ideal homogeneous field.
[3]
Between pin VCC and pin GND, soldered close to the package.
[4]
Operating as sink or source.
[5]
Between pin VOUT1 and pin VCC or pin GND and between pin VOUT2 and pin VCC or pin GND.
2. Pinning information
Table 2.
Pinning
Pin Symbol
Description
1
TCC_EN
temperature coefficient compensation enable
2
VOUT1
cosine channel output
3
GND
ground
4
VOUT2
sine channel output
5
VTEMP
temperature reference output voltage
6
GND
ground
7
VCC
supply voltage
8
POWERDOWN_EN
Power-down mode enable
Simplified outline
8
5
1
4
3. Ordering information
Table 3.
KMZ60
Product data sheet
Ordering information
Type number
Package
Name Description
Version
KMZ60
SO8
SOT96-1
plastic small outline package; 8 leads; body width 3.9 mm
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 February 2014
© NXP B.V. 2014. All rights reserved.
2 of 30
KMZ60
NXP Semiconductors
Angle sensor with integrated amplifier
4. Functional diagram
VCC
VCC
TCC_EN
FUNCTIONAL
CONTROL
R1
POWERDOWN_EN
VDDS
BROKEN
BOND WIRE
DETECTION
BUFFER
R2
U/I
VDDS
IV = f(VCC)
ITC_comp
IT = f(Tamb)
VIN1P
RB
Vcos
VIN1N
I = f(VCC, Tamb, R2)
CURRENT
MULTIPLIER
TC comp
enable
GAIN = 7
VCC / 2
VIN2P
RB
VOUT2
Vsin
VIN2N
IPTAT
VOUT1
GAIN = 6
R3
C3
PTAT
REF Iconst
GAIN = 7
GAIN = 6
MR
SENSOR
GNDS
TEMPERATURE
SENSOR
VTEMP
GND
001aan885
Fig 1.
Functional diagram with sensor bridge
5. Functional description
Figure 1 shows the complete circuit consisting of the MR sensor element realized by two
interleaved Wheatstone bridges for cosine and sine signals. Also the supporting functions
for control circuit and signal amplification are included. A Proportional To Absolute
Temperature (PTAT) reference current, a voltage-to-current converter and a current
multiplier are generating the reference current which is supply voltage, temperature and
resistor dependent. This reference current controls the supply voltage of both sensor
bridges to compensate their TC via a supply buffer. For noise and ElectroMagnetic
Compatibility (EMC) suppression low-pass filtering of the bridge supply is implemented.
The bridge output voltages are amplified by a constant factor and fed to the rail-to-rail
output buffers. The single-ended outputs are capable to drive inputs e.g. of an external
Analog-to-Digital Converter (ADC) referenced to VCC. For an optimal use of the ADC input
range the cosine and sine output voltages are tracking ratiometric with the supply voltage.
To achieve good signal performance, both signals are matched in amplitude and phase.
The amplifier bandwidth is sufficient for low phase delay at maximum specified speed of
rotation. Pin TCC_EN is used to enable the temperature compensation. Two modes are
defined. The TC of the MR sensor signal amplitude is largely compensated by the
amplifier if pin TCC_EN is connected to VCC. The amplified sensor signal, which has
a negative TC, is available at the output pins VOUT1 and VOUT2 if pin TCC_EN is
KMZ60
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 February 2014
© NXP B.V. 2014. All rights reserved.
3 of 30
KMZ60
NXP Semiconductors
Angle sensor with integrated amplifier
connected to ground. Pin VTEMP delivers a temperature dependent output voltage
VO(TEMP) in both cases, which is tracking ratiometric with the supply voltage. It uses the
internal PTAT reference and can be left open or connected to ground or preferably to VCC
if not used. The pin POWERDOWN_EN input switches the device into Power-down mode
and sets the pin VOUT1 and pin VOUT2 output to high impedance and disables
pin VTEMP. It must be connected to ground if not used. An implemented broken bond
wire detection for all internal connections to the MR sensor is drawing the output voltages
Vo(VOUT1) and Vo(VOUT2) to the ground level in case of a failure. Both outputs are
short-circuit proof.
The integrated MR sensor element is a sensitive magnetic field sensor, employing the MR
effect of thin film permalloy. The sensor contains two parallel supplied Wheatstone
bridges, which enclose a sensitive angle of 45 degrees. A rotating magnetic field in the
surface parallel to the chip (x-y plane) will deliver two independent sinusoidal output
signals, one following a cos(2) and the second following a sin(2) function.  is the
mechanical angle between sensor and field direction.
The definition of the output signal amplitude Vo(VOUT1) and Vo(VOUT2) and the output offset
voltage Voffset(VOUT1) and Voffset(VOUT2) of KMZ60 for a mechanical angle of 360 degrees is
shown in Figure 2.
93 %
VCC
Vo(VOUT1) +
Voffset(VOUT1)(1)
Vo(VOUT1)
Voffset(VOUT1)
50 %
VCC
Voffset(VOUT2)
Vo(VOUT2)
Vo(VOUT2) +
Voffset(VOUT2)(2)
7%
VCC
0
90
180
270
(deg)
360
001aan886
(1) Offset positive
(2) Offset negative
Fig 2.
KMZ60
Product data sheet
Definition of output signal amplitude and offset voltage
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 February 2014
© NXP B.V. 2014. All rights reserved.
4 of 30
KMZ60
NXP Semiconductors
Angle sensor with integrated amplifier
6. Internal circuitry
Table 4.
Internal circuits for each pin
Symbol
Pin
TCC_EN
1
Equivalent circuit
VCC
TCC_EN
GND
001aan719
VOUT1
2
GND
3 and 6
VOUT2
4
VCC
100 Ω
VOUT1
GND
GND
VCC
VOUT2
100 Ω
GND
001aan720
KMZ60
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 February 2014
© NXP B.V. 2014. All rights reserved.
5 of 30
KMZ60
NXP Semiconductors
Angle sensor with integrated amplifier
Table 4.
Internal circuits for each pin …continued
Symbol
Pin
VTEMP
5
Equivalent circuit
VCC
VTEMP
GND
GND
001aan723
7
VCC
VCC
GND
001aan722
POWERDOWN_EN
8
VCC
POWERDOWN_EN
GND
001aan721
7. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VCC
supply voltage
VI
input voltage
on pins TCC_EN and POWERDOWN_EN
VO
output voltage
on pins VOUT1, VOUT2 and VTEMP
Tamb
ambient temperature
40
KMZ60
Product data sheet
Conditions
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 February 2014
Min
Max
Unit
0.3
+6
V
0.3
VCC + 0.3
V
0.3
VCC + 0.3
V
+160
C
© NXP B.V. 2014. All rights reserved.
6 of 30
KMZ60
NXP Semiconductors
Angle sensor with integrated amplifier
8. Recommended operating conditions
Table 6.
Operating conditions
Symbol
Parameter
VCC
Tamb
Conditions
Min
Max
Unit
supply voltage
2.7
5.5
V
ambient temperature
40
+150
C
9. Characteristics
Table 7.
Characteristics
Tamb = 25 C; angle accuracies referred to homogeneous excitation magnetic fields of Hext = 25 kA/m directed parallel to MR
sensor surface; all voltages are related to ground potential of pin GND; the signal outputs and offset voltages on pin VOUT1
and pin VOUT2 are related to the common mode level of VCC / 2; unless otherwise specified.
Symbol
Parameter
VCC
supply voltage
ICC
supply current
Conditions
Min
Typ
Max
Unit
2.7
-
5.5
V
under normal condition
dependent on VCC, RL(o)ext and
rotation frequency;
no short-circuit of outputs
2.0
6.0
10.0
mA
Power-down mode;
VCC on pin POWERDOWN_EN;
VCC or ground on pin TCC_EN
-
-
16
A
5
-
0.3
A
Ipu
pull-up current
pin TCC_EN to ground
VCC on pin POWERDOWN_EN
Ipd
pull-down current
Cblock(ext)
external blocking
capacitance
Rsc
short-circuit resistance
Ro
output resistance
RL(o)ext
CL(o)ext
external output load
resistance
external output load
capacitance
0.01
-
3
A
100
-
-
nF
pin TCC_EN to VCC or ground
-
-
10

on pin VOUT1, pin VOUT2 and
pin VTEMP
50
-
150

on pin VOUT1 and pin VOUT2;
VCC on pin POWERDOWN_EN
500
-
-
k
pin VTEMP to ground; VCC on
pin POWERDOWN_EN
35
-
85
k
5
-

k
20
-
100
k
[1]
on pin VOUT1 and pin VOUT2
[2]
pin VTEMP to ground
on pin VOUT1 and pin VOUT2
[3]
0.5
-
10
nF
on pin VTEMP
22
33
39
nF
Vo
output voltage
on pin VOUT1 and pin VOUT2;
without signal clipping;
RL(o)ext = 5 k
0.07VCC
-
0.93VCC
V
VOL
LOW-level output voltage
on pin VOUT1 and pin VOUT2;
broken bond wire detected;
RL(o)ext = 5 k to ground
-
-
0.05VCC
V
on pin VOUT1 and pin VOUT2;
broken bond wire detected;
RL(o)ext = 5 k to VCC
-
-
0.06VCC
V
KMZ60
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 February 2014
© NXP B.V. 2014. All rights reserved.
7 of 30
KMZ60
NXP Semiconductors
Angle sensor with integrated amplifier
Table 7.
Characteristics …continued
Tamb = 25 C; angle accuracies referred to homogeneous excitation magnetic fields of Hext = 25 kA/m directed parallel to MR
sensor surface; all voltages are related to ground potential of pin GND; the signal outputs and offset voltages on pin VOUT1
and pin VOUT2 are related to the common mode level of VCC / 2; unless otherwise specified.
Symbol
Isc
Parameter
short-circuit current
Conditions
Min
Typ
Max
Unit
to ground; on pin VOUT1 and
pin VOUT2
[4]
6
-
-
mA
to ground; on pin VTEMP
[4]
2
-
-
mA
to VCC; on pin VOUT1 and
pin VOUT2
[5]
-
-
6
mA
to VCC; on pin VTEMP
[5]
-
-
2
mA
CL(i)ext
external input load
capacitance
on pin POWERDOWN_EN for
ElectroMagnetic Interference
(EMI) reason
100
-
-
nF
VIL
LOW-level input voltage
on pin POWERDOWN_EN
-
-
0.6
V
VIH
HIGH-level input voltage
on pin POWERDOWN_EN
VCC  0.6
-
-
V
tstartup
start-up time
to 98 % of Vo(VOUT1) or
Vo(VOUT2) end level after
minimum VCC was reached
-
-
110
s
from power-down to 98 % of
Vo(VOUT1) or Vo(VOUT2) end level
-
-
110
s
Hext
external magnetic field
strength
[6]
25
-
-
kA/m
err
reference position angle
error
[7]
2
-
+2
deg
startup
start-up angle error
Tamb = 40 C; RL(o)ext = 5 k
10
-
+10
deg
Tamb = 25 C; RL(o)ext = 5 k
10
-
+10
deg
Tamb = 85 C; RL(o)ext = 5 k
13
-
+13
deg
Tamb = 105 C; RL(o)ext = 5 k
14.5
-
+14.5
deg
Tamb = 150 C; RL(o)ext = 5 k
19
-
+19
deg
0
-
25000
r/min
Dynamic characteristics for angular accuracy calculations
nH
magnetic field rotational
frequency
k
amplitude synchronism
[8]
98
-
102
%
err
phase error
[9]
-
-
1.5
deg

angular inaccuracy
0.1
-
+0.1
deg
PSRR
power supply rejection ratio fripple = 500 kHz
12
-
-
dB
-
-
500
V
Tamb = 40 C
0.057VCC
-
0.147VCC
V
Tamb = 25 C
0.248VCC
-
0.351VCC
V
Tamb = 85 C
0.445VCC
-
0.559VCC
V
Tamb = 105 C
0.515VCC
-
0.631VCC
V
Tamb = 150 C
0.655VCC
-
0.786VCC
V
Vn(o)(RMS)
RMS output noise voltage
within a static field
on pin VOUT1, pin VOUT2 and
pin VTEMP; no magnetic signal
[10]
[11]
Temperature dependency of output on pin VTEMP
VO
output voltage
KMZ60
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 February 2014
© NXP B.V. 2014. All rights reserved.
8 of 30
KMZ60
NXP Semiconductors
Angle sensor with integrated amplifier
Table 7.
Characteristics …continued
Tamb = 25 C; angle accuracies referred to homogeneous excitation magnetic fields of Hext = 25 kA/m directed parallel to MR
sensor surface; all voltages are related to ground potential of pin GND; the signal outputs and offset voltages on pin VOUT1
and pin VOUT2 are related to the common mode level of VCC / 2; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Temperature dependency of signal outputs with TC compensation (VCC on pin TCC_EN)
Vo
output voltage
peak-to-peak value;
on pin VOUT1; RL(o)ext = 5 k
Tamb = 40 C
0.42VCC
0.56VCC 0.70VCC
V
Tamb = 25 C
0.46VCC
0.56VCC 0.70VCC
V
Tamb = 85 C
0.42VCC
0.53VCC 0.70VCC
V
Tamb = 105 C
0.395VCC
0.51VCC 0.695VCC
V
Tamb = 150 C
0.35VCC
0.48VCC 0.68VCC
V
Tamb = 40 C
0.42VCC
0.56VCC 0.70VCC
V
Tamb = 25 C
0.46VCC
0.56VCC 0.70VCC
V
Tamb = 85 C
0.42VCC
0.53VCC 0.70VCC
V
Tamb = 105 C
0.395VCC
0.51VCC 0.695VCC
V
Tamb = 150 C
0.35VCC
0.48VCC 0.68VCC
V
Tamb = 40 C
0.08VCC
-
+0.08VCC
V
Tamb = 25 C
0.08VCC
-
+0.08VCC
V
Tamb = 85 C
0.09VCC
-
+0.09VCC
V
Tamb = 105 C
0.095VCC -
+0.095VCC V
Tamb = 150 C
0.11VCC
-
+0.11VCC
V
Tamb = 40 C
0.08VCC
-
+0.08VCC
V
Tamb = 25 C
0.08VCC
-
+0.08VCC
V
Tamb = 85 C
0.09VCC
-
+0.09VCC
V
Tamb = 105 C
0.095VCC -
+0.095VCC V
Tamb = 150 C
0.11VCC
+0.11VCC
peak-to-peak value;
on pin VOUT2; RL(o)ext = 5 k
Voffset
offset voltage
on pin VOUT1; RL(o)ext = 5 k
on pin VOUT2; RL(o)ext = 5 k
KMZ60
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 February 2014
-
V
© NXP B.V. 2014. All rights reserved.
9 of 30
KMZ60
NXP Semiconductors
Angle sensor with integrated amplifier
Table 7.
Characteristics …continued
Tamb = 25 C; angle accuracies referred to homogeneous excitation magnetic fields of Hext = 25 kA/m directed parallel to MR
sensor surface; all voltages are related to ground potential of pin GND; the signal outputs and offset voltages on pin VOUT1
and pin VOUT2 are related to the common mode level of VCC / 2; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Temperature dependency of signal outputs without TC compensation (pin TCC_EN to ground)
output voltage
Vo
peak-to-peak value;
on pin VOUT1; RL(o)ext = 5 k
Tamb = 40 C
0.54VCC
0.66VCC 0.76VCC
V
Tamb = 25 C
0.41VCC
0.49VCC 0.57VCC
V
Tamb = 85 C
0.31VCC
0.37VCC 0.45VCC
V
Tamb = 105 C
0.275VCC
0.34VCC 0.425VCC
V
Tamb = 150 C
0.21VCC
0.27VCC 0.36VCC
V
Tamb = 40 C
0.54VCC
0.66VCC 0.76VCC
V
Tamb = 25 C
0.41VCC
0.49VCC 0.57VCC
V
Tamb = 85 C
0.31VCC
0.37VCC 0.45VCC
V
Tamb = 105 C
0.275VCC
0.34VCC 0.425VCC
V
Tamb = 150 C
0.21VCC
0.27VCC 0.36VCC
V
Tamb = 40 C
0.07VCC
-
+0.07VCC
V
Tamb = 25 C
0.07VCC
-
+0.07VCC
V
Tamb = 85 C
0.07VCC
-
+0.07VCC
V
Tamb = 105 C
0.075VCC -
+0.075VCC V
Tamb = 150 C
0.08VCC
-
+0.08VCC
V
Tamb = 40 C
0.07VCC
-
+0.07VCC
V
Tamb = 25 C
0.07VCC
-
+0.07VCC
V
Tamb = 85 C
0.07VCC
-
+0.07VCC
V
Tamb = 105 C
0.075VCC -
+0.075VCC V
Tamb = 150 C
0.08VCC
+0.08VCC
peak-to-peak value;
on pin VOUT2; RL(o)ext = 5 k
Voffset
offset voltage
on pin VOUT1; RL(o)ext = 5 k
on pin VOUT2; RL(o)ext = 5 k
[1]
Between pin VCC and pin GND, soldered close to the package.
[2]
Operating as sink or source.
[3]
Between pin VOUT1 and pin VCC or pin GND and between pin VOUT2 and pin VCC or pin GND.
-
[4]
Short-circuit to pin GND within a time limit of 10 minutes.
[5]
Short-circuit to pin VCC within a time limit of 10 minutes.
[6]
Induced voltage from a rotating strong magnetic field may impact the performance but without damage.
[7]
Angle error due to reference position defined by the leadframe, sample based controlled at assembly line.
[8]
By calculation of peak-to-peak amplitude relation k = 100  Vo(VOUT1) / Vo(VOUT2).
[9]
Rotation frequency dependent phase error, after offset correction, amplitude calibration and arctangent calculation.
V
[10] Value calculated only with third and fifth harmonic of the spectrum of output signal amplitude Vo(VOUT1) and Vo(VOUT2) by ideal
homogeneous field.
[11] Maximum limit is valid with external first order filter of 80 kHz.
KMZ60
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 February 2014
© NXP B.V. 2014. All rights reserved.
10 of 30
KMZ60
NXP Semiconductors
Angle sensor with integrated amplifier
10. Definitions of errors
10.1 Reference position angle error
The reference position angle error err is defined as absolute mounting position deviation
of the MR sensor in a homogeneous excitation magnetic field related to the reference
position0 defined by the leadframe. Marking position for angle0 = 0 degree and Y = 0
position is referred parallel to the straight connection line of the 2nd and 7th package pin.
The X = 0 position is referred to the middle distance of the package top (see Figure 3).
Y
X
Фerr
Ф0
Ф
sensor
die
001aan887
Fig 3.
Phase error caused by mounting tolerances
10.2 Output amplitude matching error
The output amplitude matching error k is defined as the relation between both output
channel amplitudes at continuously rotating magnetic excitation of the MR sensor.
k = 100  Vo(VOUT1) (p-p) / Vo(VOUT2) (p-p) (the angle error can be derived from Figure 4)
KMZ60
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 February 2014
© NXP B.V. 2014. All rights reserved.
11 of 30
KMZ60
NXP Semiconductors
Angle sensor with integrated amplifier
001aan888
0.3
αerr
(deg)
0.2
0.1
0
98
99
100
101
102
k (%)
Fig 4.
Angle error caused by output amplitude synchronism
10.3 Output signal amplitude
The peak-to-peak output signal amplitude of Vo(VOUT1) and Vo(VOUT2) is related to VCC.
Figure 5 and Figure 6 show the specified amplitude range over temperature within its
minimum and maximum limits.
001aan889
0.8
Vo / VCC
(V / V)
0.6
0.4
0.2
-40
0
40
80
120
160
Tamb (°C)
TC compensation on
Fig 5.
KMZ60
Product data sheet
Output signal peak-to-peak amplitude with pin TCC_EN connected to VCC
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 February 2014
© NXP B.V. 2014. All rights reserved.
12 of 30
KMZ60
NXP Semiconductors
Angle sensor with integrated amplifier
001aan890
0.8
Vo / VCC
(V / V)
0.6
0.4
0.2
-40
0
40
80
120
160
Tamb (°C)
TC compensation off
Fig 6.
Output signal peak-to-peak amplitude with pin TCC_EN connected to ground
10.4 TC of output signal amplitude
The TC of the peak-to-peak output signal amplitude of Vo(VOUT1) and Vo(VOUT2) is related
to VCC. Figure 7 and Figure 8 show the specified TC range of the amplitude over
temperature within its minimum and maximum limits. The limits were calculated from
single MR sensor measurements and circuit measurements.
aaa-001506
2
TCV(o) / VCC
(mV / V) / K
1
0
-1
-2
-40
0
40
80
120
160
Tamb (°C)
TC compensation on
Fig 7.
KMZ60
Product data sheet
TC of output signal peak-to-peak amplitude with pin TCC_EN connected to VCC
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 February 2014
© NXP B.V. 2014. All rights reserved.
13 of 30
KMZ60
NXP Semiconductors
Angle sensor with integrated amplifier
aaa-001507
0
TCV(o) / VCC
(mV / V) / K
-1
-2
-3
-4
-40
0
40
80
120
160
Tamb (°C)
TC compensation off
Fig 8.
TC of output signal peak-to-peak amplitude with pin TCC_EN connected to
ground
10.5 TC of output signal offset
The TC of the output signal offset of Voffset(VOUT1) and Voffset(VOUT2) is related to VCC.
Figure 9 and Figure 10 show the specified TC range of the offset over temperature within
its minimum and maximum limits. The limits were calculated from single MR sensor
measurements and circuit measurements.
aaa-001508
0.6
TCV(offset) / VCC
(mV / V) / K
0.2
-0.2
-0.6
-40
0
40
80
120
160
Tamb (°C)
TC compensation on
Fig 9.
KMZ60
Product data sheet
TC of output signal offset with pin TCC_EN connected to VCC
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 February 2014
© NXP B.V. 2014. All rights reserved.
14 of 30
KMZ60
NXP Semiconductors
Angle sensor with integrated amplifier
aaa-001509
0.3
TCV(offset) / VCC
(mV / V) / K
0.1
-0.1
-0.3
-40
0
40
80
120
160
Tamb (°C)
TC compensation off
Fig 10. TC of output signal offset with pin TCC_EN connected to ground
10.6 Start-up angle error
The start-up angle error is defined as maximum deviation by calculating the angle from
the offset voltages Voffset(VOUT1) and Voffset(VOUT2) and the peak-to-peak signal amplitudes
Vo(VOUT1) and Vo(VOUT2).
Figure 11 and Figure 12 show the maximum start-up angular error related to 180 degree
angular range of the MR sensor after one point calibration at 25 C (from worst case
simulations).
001aan891
7
start-up error
(deg)
6
5
4
3
2
1
0
-40
0
40
80
120
160
Tamb (°C)
TC compensation on
Fig 11. Start-up angle error after calibration with pin TCC_EN connected to VCC
KMZ60
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 February 2014
© NXP B.V. 2014. All rights reserved.
15 of 30
KMZ60
NXP Semiconductors
Angle sensor with integrated amplifier
001aan892
2.0
start-up error
(deg)
1.6
1.2
0.8
0.4
0
-40
0
40
80
120
160
Tamb (°C)
TC compensation off
Fig 12. Start-up angle error after calibration with pin TCC_EN connected to ground
10.7 Phase error
The phase error err is defined as a rotation frequency dependent error due to bandwidth
limitation of the operational amplifiers. Vo(VOUT1) and Vo(VOUT2) are retarded by the device
propagation delay, referred to the actual angle direction of the rotating magnetic field
(see Figure 13). The typical characteristics value can be used for a 1st order
compensation of this error on very high rotations per minute. For low rotational speed
systems this error component is negligible.
KMZ60
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 February 2014
© NXP B.V. 2014. All rights reserved.
16 of 30
KMZ60
NXP Semiconductors
Angle sensor with integrated amplifier
φerr
1
(1)
Vo / VCC
(V / V)
(2)
0
-1
0
50
100
150
200
250
300
350
reference (deg)
250
300
350
reference (deg)
180
delay
(deg)
120
φerr
60
0
0
50
100
150
200
001aan893
(1) VOUT1
(2) VOUT2
Fig 13. Angle error caused by amplifier bandwidth
10.8 Temperature behavior of pin VTEMP output
The temperature dependent VO(TEMP) reference voltage with its specified tolerances is
shown in Figure 14. The output level is related to ground and tracking ratiometric with
VCC. Stability is guaranteed at the specified output load.
KMZ60
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 February 2014
© NXP B.V. 2014. All rights reserved.
17 of 30
KMZ60
NXP Semiconductors
Angle sensor with integrated amplifier
001aan894
0.8
Vo(VTEMP) / VCC
(V / V)
0.6
0.4
max
0.2
min
0
-40
0
40
80
120
160
Tamb (°C)
Fig 14. Temperature behavior of pin VTEMP output
11. Electromagnetic compatibility
11.1 Emission (IEC 61967-4)
EMC tests carried out according to IEC 61967-4, part 4 under typical specification
conditions at VCC = 5 V without rotational field excitation. Pin TCC_EN connected to VCC
or ground.
Direct coupling method: 150 , 6.8 nF, frequency band 150 kHz to 1 GHz
Test severity limit: Class III local with level 10-K
Test ensured on pins: VOUT1, VOUT2, VTEMP, VCC and POWERDOWN_EN related to
ground with specified load capacitors
11.2 Immunity (IEC 62132-4)
EMC tests carried out according to IEC 62132-4, under typical specification conditions at
VCC = 3.3 V with different constant field orientations. Pin TCC_EN connected to VCC or
ground.
Direct power injection: 150 , 6.8 nF, frequency band 150 kHz to 1 GHz
Test severity limit: 12 dBm
Test ensured on pins: VOUT1, VOUT2, VTEMP, VCC and POWERDOWN_EN related to
ground with specified load capacitors
The mathematically calculated mechanical angular error can be derived from measured
output signals on pin VOUT1 and pin VOUT2. It will not deviate more than 1.8 degrees
during the EMC immunity test.
The deviation of output voltage VO(TEMP) is less than 0.009VCC which equals with an
additional error less than 2.5 C.
KMZ60
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 February 2014
© NXP B.V. 2014. All rights reserved.
18 of 30
KMZ60
NXP Semiconductors
Angle sensor with integrated amplifier
12. ElectroStatic Discharge (ESD)
12.1 Human body model
The KMZ60 is protected against 4 kV, according to the human body model at 100 pF and
1.5 k. The test is according to AEC-Q100, REV-G, method 002.
12.2 Machine model
The KMZ60 is protected against 400 V, according to the machine model. The test is
according to AEC-Q100, REV-G, method 003.
12.3 Charged-device model
The KMZ60 is protected against 500 V of direct charge injection with the 4 pF verification
model, according to the charged-device model. The test is according to AEC-Q100,
REV-G, method 011.
12.4 Latch-up protection
The KMZ60 is latch-up protected against 110 mA at maximum ambient temperature.
The test is according to AEC-Q100, REV-G, method 004.
13. Application information
The MR sensor is designed for applications with a separate Electronic Control Unit (ECU)
containing an ADC with its references connected to the supply voltage. With the ADC
input resolution related to VCC in the same way as the MR sensor output voltage range
(ratiometric), the signal dependency on supply voltage changes is minimized.
3&%ZLWK.0=DQGDGGLWLRQDOFRPSRQHQWV
9&&
9&&
9&&
WR9&&
&/LH[W
3&%
RU*1'
&/RH[W
7&&B(1
9287
32:(5'2:1B(1
&EORFNH[W
),/7(5
(&8
$'&
.0=
97(03
5/RH[W
5/RH[W
&/RH[W
9287
),/7(5
&/RH[W
*1'
*1'
5/RH[W
*1'
DDQ
Fig 15. Application diagram of KMZ60 with separate ECU on Printed-Circuit Board (PCB)
13.1 Connection to ECU
Long connections on the PCB should be avoided due to the limited driving capability of
both amplifier outputs. Shielding of the signal lines is recommended. The load capacitors
and resistors should be matched for best angular accuracy.
KMZ60
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 February 2014
© NXP B.V. 2014. All rights reserved.
19 of 30
KMZ60
NXP Semiconductors
Angle sensor with integrated amplifier
In front of the ADC inputs bandwidth limitation filters should be implemented related to the
used sampling frequency of the system to reduce the noise bandwidth (see Figure 15).
The load resistors RL(o)ext are representing the input load of the filter application and the
ADC.
The ECU may be used for arctan and offset calculation, offset storage and calibration.
13.2 EMI
A blocking capacitor Cblock(ext) and the load capacitors CL(o)ext for the signal outputs are
necessary to fulfill the EMI requirements. They should be soldered close to the related IC
pins.
To protect the output stages VOUT1 and VOUT2 an internal resistance is implemented.
It works like a voltage divider together with the load resistance RL(o)ext.
Capacitor CL(o)ext is required on pin VTEMP for output stability. The pin can be soldered
directly to ground or preferably to VCC on the PCB if it is not used.
Capacitor CL(i)ext is required on pin POWERDOWN_EN to fulfill the EMI demands.
The pin may be soldered directly to ground on the PCB if it is not used.
13.3 Power consumption
The power consumption is dependent on VCC, temperature, load resistance RL(o)ext,
load capacitance CL(o)ext and frequency of the rotating magnetic field. It is recommended
to refer the load resistance RL(o)ext and the load capacitance CL(o)ext to ground although a
connection to VCC is likewise possible. VO(TEMP) is related to ground via the external load
resistance RL(o)ext on pin VTEMP.
The output voltages Vo(VOUT1), Vo(VOUT2) and VO(TEMP) are protected against short-circuit
to VCC or ground by current limitation within the given time duration.
Placing the device 180 degrees rotated into the socket may lead to damages, if the supply
current is not limited to 100 mA.
13.4 TC compensation
KMZ60 can be used as specified with TC compensation of the MR sensor signal.
Pin TCC_EN has to be connected to VCC.
The pin TCC_EN has to be connected to ground if no TC compensation is required.
The output signal amplitude will decrease with increasing temperature related to the TC of
the MR sensor. The angle accuracy might be slightly reduced due to the limited resolution
of the used ADC.
13.5 Offset of signal outputs on pin VOUT1 and pin VOUT2
The single-ended output signals are referenced to VCC / 2 generated internally on chip.
Offsets are originated from matching inaccuracies of the production process. For a good
accuracy matching of the external load is additionally required.
For ESD and EMC protection the outputs are containing a series resistance.
The influence of this series resistance is minimized with a large output load resistance.
KMZ60
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 February 2014
© NXP B.V. 2014. All rights reserved.
20 of 30
KMZ60
NXP Semiconductors
Angle sensor with integrated amplifier
13.6 Temperature reference output
On pin VTEMP a temperature dependent reference voltage VO(TEMP) is available.
This voltage is derived from an internal PTAT reference. For measurement with the
proposed ADC the voltage is tracking ratiometric with VCC. The reference can be used for
a temperature dependent offset and angular error calibration.
The output can be left open or connected to ground or preferably to VCC if not used.
13.7 Switching into Power-down mode
The Power-down mode can be activated by switching pin POWERDOWN_EN to VCC.
Within this mode the output pin VOUT1 and pin VOUT2 are set to high impedance to
avoid current consumption across the load resistors.
Pin VTEMP will be drawn to the ground level via an internal resistance.
The Power-down mode can be entered if pin TCC_EN is connected to VCC or ground.
13.8 Circuit behavior in case of broken bond wires
The output voltages Vo(VOUT1) and Vo(VOUT2) will be drawn to the ground level if the
implemented broken bond wire detection for all internal connections to the MR sensor is
activated.
With a broken bond wire on pin TCC_EN the pad will be drawn internally to VCC.
This activates the TC compensation for both signal outputs on pin VOUT1 and
pin VOUT2.
A broken bond wire on pin VTEMP will interrupt the output signal on pin VTEMP.
A broken bond wire on pin POWERDOWN_EN will disable the Power-down mode and
keep the device active via an internal pull-down.
13.9 Signal dependence on air-gap distance
KMZ60 measures the direction of the external magnetic field within its x-y plane.
The result is widely independent of the field strength as far as it is above the specified
minimum value. Within a homogeneous field in x-y direction the result is independent of its
placement in z direction (air-gap).
The nominal z distance of the internal x-y plane to the top surface of the plastic package is
405 m.
14. Test information
14.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q100 Rev-G - Failure mechanism based stress test qualification for
integrated circuits, and is suitable for use in automotive applications.
KMZ60
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 February 2014
© NXP B.V. 2014. All rights reserved.
21 of 30
KMZ60
NXP Semiconductors
Angle sensor with integrated amplifier
15. Package information
15.1 Sensor reference position
Definition of angle reference related to the edges of pin 2 and pin 7 is shown in Figure 16.
Distance of sensor plane related to plastic top of the package is shown in Figure 17.
The nominal distance is 405 m (minimum 290 m and maximum 513 m).
0°
+
A
B
all leads
all leads
0.2 A
0.5 B
2° max
pin 1
001aan792
Fig 16. Definition of angle reference position
SDFNDJHWRSWKLFNQHVV
PP“PP
GLHWKLFNQHVV
P
PD[PP
QRPPP
PLQPP
PP“PP
GRZQVHWPP“PP
PP“PP
JOXHOLQHWKLFNQHVVa PQRPLQDO
DDQ
Fig 17. Distance between the MR top surface and the package top surface
Distance between MR top surface and package top surface = (package top
thickness + downset)  (die thickness + glue line thickness).
15.2 Note
The package outline SOT96-1 (see Figure 18) allows a general wide tolerance for the
lead frame thickness and the lead width. The actual reference for KMZ60 is:
c = 0.203 mm  0.008 mm; bp = 0.380 mm  0.020 mm and e value does not vary
KMZ60
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 February 2014
© NXP B.V. 2014. All rights reserved.
22 of 30
KMZ60
NXP Semiconductors
Angle sensor with integrated amplifier
16. Package outline
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
c
y
HE
v M A
Z
5
8
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
4
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
inches
0.069
0.010 0.057
0.004 0.049
0.01
0.019 0.0100
0.014 0.0075
0.20
0.19
0.16
0.15
0.05
0.01
0.01
0.004
0.028
0.012
0.244
0.039 0.028
0.041
0.228
0.016 0.024
θ
8o
o
0
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT96-1
076E03
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Fig 18. Package outline SOT96-1 (SO8)
KMZ60
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 February 2014
© NXP B.V. 2014. All rights reserved.
23 of 30
KMZ60
NXP Semiconductors
Angle sensor with integrated amplifier
17. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
17.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
17.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
17.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
KMZ60
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 February 2014
© NXP B.V. 2014. All rights reserved.
24 of 30
KMZ60
NXP Semiconductors
Angle sensor with integrated amplifier
17.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 19) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 8 and 9
Table 8.
SnPb eutectic process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
 350
< 2.5
235
220
 2.5
220
220
Table 9.
Lead-free process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 19.
KMZ60
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 February 2014
© NXP B.V. 2014. All rights reserved.
25 of 30
KMZ60
NXP Semiconductors
Angle sensor with integrated amplifier
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 19. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
18. Abbreviations
Table 10.
KMZ60
Product data sheet
Abbreviations
Acronym
Description
ADC
Analog-to-Digital Converter
BLDC
BrushLess DC
ECU
Electronic Control Unit
EMC
ElectroMagnetic Compatibility
EMI
ElectroMagnetic Interference
EPS
Electronic Power Steering
ESD
ElectroStatic Discharge
IC
Integrated Circuit
MR
MagnetoResistive
PCB
Printed-Circuit Board
PTAT
Proportional To Absolute Temperature
RoHS
Restriction of Hazardous Substances
TC
Temperature Coefficient
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 February 2014
© NXP B.V. 2014. All rights reserved.
26 of 30
KMZ60
NXP Semiconductors
Angle sensor with integrated amplifier
19. Revision history
Table 11.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
KMZ60 v.2
20140207
Product data sheet
-
KMZ60 v.1
-
-
Modifications:
KMZ60 v.1
KMZ60
Product data sheet
•
•
Figure 15: update
Section 15.1: update of tolerances
20111122
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 February 2014
© NXP B.V. 2014. All rights reserved.
27 of 30
KMZ60
NXP Semiconductors
Angle sensor with integrated amplifier
20. Legal information
20.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
20.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
20.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
KMZ60
Product data sheet
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 February 2014
© NXP B.V. 2014. All rights reserved.
28 of 30
KMZ60
NXP Semiconductors
Angle sensor with integrated amplifier
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
20.4 Trademarks
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
21. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
KMZ60
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 February 2014
© NXP B.V. 2014. All rights reserved.
29 of 30
KMZ60
NXP Semiconductors
Angle sensor with integrated amplifier
22. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
10.1
10.2
10.3
10.4
10.5
10.6
10.7
10.8
11
11.1
11.2
12
12.1
12.2
12.3
12.4
13
13.1
13.2
13.3
13.4
13.5
13.6
13.7
13.8
13.9
14
14.1
15
15.1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 3
Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . . 5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
Recommended operating conditions. . . . . . . . 7
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Definitions of errors. . . . . . . . . . . . . . . . . . . . . 11
Reference position angle error . . . . . . . . . . . . 11
Output amplitude matching error . . . . . . . . . . 11
Output signal amplitude . . . . . . . . . . . . . . . . . 12
TC of output signal amplitude . . . . . . . . . . . . . 13
TC of output signal offset . . . . . . . . . . . . . . . . 14
Start-up angle error. . . . . . . . . . . . . . . . . . . . . 15
Phase error . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Temperature behavior of pin VTEMP output. . 17
Electromagnetic compatibility . . . . . . . . . . . . 18
Emission (IEC 61967-4) . . . . . . . . . . . . . . . . . 18
Immunity (IEC 62132-4) . . . . . . . . . . . . . . . . . 18
ElectroStatic Discharge (ESD) . . . . . . . . . . . . 19
Human body model . . . . . . . . . . . . . . . . . . . . 19
Machine model . . . . . . . . . . . . . . . . . . . . . . . . 19
Charged-device model . . . . . . . . . . . . . . . . . . 19
Latch-up protection . . . . . . . . . . . . . . . . . . . . . 19
Application information. . . . . . . . . . . . . . . . . . 19
Connection to ECU . . . . . . . . . . . . . . . . . . . . . 19
EMI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Power consumption . . . . . . . . . . . . . . . . . . . . 20
TC compensation . . . . . . . . . . . . . . . . . . . . . . 20
Offset of signal outputs on pin VOUT1 and
pin VOUT2 . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Temperature reference output . . . . . . . . . . . . 21
Switching into Power-down mode. . . . . . . . . . 21
Circuit behavior in case of broken bond wires 21
Signal dependence on air-gap distance . . . . . 21
Test information . . . . . . . . . . . . . . . . . . . . . . . . 21
Quality information . . . . . . . . . . . . . . . . . . . . . 21
Package information . . . . . . . . . . . . . . . . . . . . 22
Sensor reference position. . . . . . . . . . . . . . . . 22
15.2
16
17
17.1
17.2
17.3
17.4
18
19
20
20.1
20.2
20.3
20.4
21
22
Note . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package outline. . . . . . . . . . . . . . . . . . . . . . . .
Soldering of SMD packages . . . . . . . . . . . . . .
Introduction to soldering. . . . . . . . . . . . . . . . .
Wave and reflow soldering. . . . . . . . . . . . . . .
Wave soldering . . . . . . . . . . . . . . . . . . . . . . .
Reflow soldering . . . . . . . . . . . . . . . . . . . . . .
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . .
Legal information . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information . . . . . . . . . . . . . . . . . . . .
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
22
23
24
24
24
24
25
26
27
28
28
28
28
29
29
30
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2014.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 7 February 2014
Document identifier: KMZ60
Similar pages