UM5204/5304EEAF Rev.01 Reliability Report FOR UM5204/5304EEAF November 16, 2006 UNION SEMICONDUCTOR, INC. Written by Approved by Liming Ge Quality Assurance Engineer Tina Liu Quality Assurance Manager Conclusion The UM5204/5304EEAF successfully meets the quality and reliability standards required of all Union products. In addition, Union’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Union’s quality and reliability standards. Table of Contents I. ........Device Description II. ........Manufacturing Information III. ........Packaging Information IV. ........Die Information V. ............Reliability Evaluation I. Device Description A. General UM5204/UM5304 are surge rated diode arrays designed to protect high speed data interfaces. This series has been specifically designed to protect sensitive components which are connected to data and transmission lines from over-voltage caused by ESD (electrostatic discharge). The unique design incorporates surge rated, low capacitance steering diodes and a TVS diode in a single package. During transient conditions, the steering diodes direct the transient to either the positive side of the power supply line or to ground. The internal TVS diode prevents over-voltage on the power line, protecting any downstream components. The low capacitance array configuration allows the user to protect four high-speed data or transmission lines. The low inductance construction minimizes voltage overshoot during high current surges. They may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4. B. Absolute Maximum Ratings Peak Pulse Power (tp = 8/20us) (Ppk ) 150 Watts Lead Soldering Temperature (TL) 260°C (10 sec.) Operating Temperature (TA) -55 to +125 °C Storage Temperature ( TSTG) -55 to +150 °C Maximum Junction Temperature TJMAX 150 °C II. Manufacturing Information A. Process: Bipolar B. Wafer Type: UM1005 C. Fabrication Location: P.R.China D. Assembly Location: P.R.China III. Packaging Information A. Package Type: SC70-6/SC88/SOT363 B. Lead Frame: Copper C. Lead Finish: Solder Plate D. Die Attach: N/A E. Bondwire: Gold (1.0 mil dia.) F. Mold Material: Epoxy with silica filler G. Flammability Rating: Class UL94-V0 I. Classification of Moisture Sensitivity per JEDEC standard JESD22-A113: Level 1 IV. Die Information A. Dimensions: 0.50 x 0.40 mm2 B. Passivation: Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) C. Interconnect: Al/Si/Cu D. Backside Metallization: Au E. Minimum Metal Width: Metal 1 .2microns F. Minimum Metal Spacing: Metal 1 .2 microns G. Bondpad Dimensions: 90 x 90 mm2 H. Isolation Dielectric: SiO2 I. Die Separation Method: Wafer Saw V. Reliability Evaluation A. Accelerated Life Test Sample Size Conditions Pass Failure 80 Tj=125℃,168hr 80 0 Test Circuit UM5204/5304EEAF B. Reliability evaluation test Test Item Test Condition Failure Package Identifi-cation Sample Number Size of Failure Precondition -65-150ºC,Dewell=15Min, Electrical JESD22-A113-D 5 Cycle; 125ºC,24h; parameters & 85ºC/85%RH, 168h; functionality SC70-6 100 0 SC70-6 25 0 240ºC, 3 Times TEMP. Cycle -65-150ºC,Dewell=15Min, Electrical JESD22-A104-B 5 Cycle， 1000 Cycles parameters & functionality Pressure Cooker 121ºC, 100%RH, 2atm, Electrical JESD22-A102-C 336h parameters & SC70-6 25 0 SC70-6 25 0 SC70-6 25 0 functionality Temp. & Humi. 85ºC/85%RH, 1000h JESD22-A101-B Electrical parameters & functionality High Temp. Storage 150ºC, 1000h JESD22-A103-B Electrical parameters & functionality C. ESD The UM5204/5304EEAF die type has been found to have all pins able to withstand a transient pulse of ± 15KV (Air) and 8 KV (Contact), per IEC 61000-4-2, level 4. (reference following ESD Test Circuit). Terminal A: Each pin individually connected to terminal A except Pin 2 with the other pins floating. Terminal B: Pin 2 connected to terminal B. A B