Data Sheet

KMI23/2; KMI23/4
High performance rotational speed sensor
62
7
(
Rev. 1 — 28 April 2016
Product data sheet
1. Product profile
1.1 General description
Based on the Anisotropic MagnetoResistive (AMR) effect, the KMI23/2 and the KMI23/4
detect the rotational speed of target wheels. The KMI23/2 is used with active target
wheels (multipole encoders) and the KMI23/4 is used with passive target wheels
(ferromagnetic gear wheels). This design delivers secure speed information over a wide
range of speed, air gap and temperature. It delivers the speed information via a current
protocol at the supply pins.
CAUTION
Do not press two or more products together against their magnetic forces and do not let them
collide with each other.
1.2 Features and benefits









System in package
Two wire current interface
Square wave output signal (standard protocol)
Large range of air gap
Large range of operating terminal voltage
Wide temperature range
High ElectroStatic Discharge (ESD) protection
Very low jitter
Automotive qualified in accordance with AEC-Q100 Rev-G (grade 0)
KMI23/2; KMI23/4
NXP Semiconductors
High performance rotational speed sensor
1.3 Quick reference data
Table 1.
Quick reference data
Symbol Parameter
Conditions
Min
Typ
Max
Unit
-
16
V
VCC
supply voltage
normal operation mode; Tamb  170 C;
referred to pin GND
6.8
Tamb
ambient temperature
normal operation mode
40
-
+150
C
ICCL
LOW-level supply current
5.88
7.0
8.4
mA
ICCH
HIGH-level supply current
11.7
14.0
16.8
mA
fH
magnetic field strength
frequency
0
-
2.5
kHz
HM
peak magnetic field
strength
KMI23/2
150
-
-
A/m
KMI23/4
190
-
-
A/m
after power-on; speed pulses latest after Ncy(H)
magnetic cycles; see characteristics in Table 6
2. Pinning information
Table 2.
Pin
Pinning
Symbol
Description
Simplified outline
KMI23/2
1
VCC
supply pin
2
GND
ground pin
KMI23/4
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name
Description
Version
KMI23/2
SIP2
plastic single-ended multi-chip package; magnetized ferrite magnet
(3.8  2  0.8 mm); 4 interconnections; 2 in-line leads
SOT453A
KMI23/4
SIP2
plastic single-ended multi-chip package; magnetized ferrite magnet
(4.25  5.2  3 mm); 4 interconnections; 2 in-line leads
SOT453E
KMI23_2_4
Product data sheet
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Rev. 1 — 28 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
2 of 20
KMI23/2; KMI23/4
NXP Semiconductors
High performance rotational speed sensor
4. Functional diagram
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Fig 1.
Functional diagram
5. Functional description
The KMI23/2 and the KMI23/4 are high performance AMR speed sensors, which are
dedicated to ABS applications. The difference between both product versions is the
stimulating element in the application, which is a magnetized multipole encoder (KMI23/2)
or a ferromagnetic gear wheel (KMI23/4).
5.1 System architecture
The functional principles of KMI23/2 and KMI23/4 are shown in Figure 2 and Figure 3,
respectively. For the KMI23/2, the magnetic poles lead to different magnetic stimuli at the
AMR bridge. For the KMI23/4, flux bending at the gear wheel teeth generates different
magnetic stimuli at the AMR bridge. In both cases, the electrical output voltage of the
AMR bridge depends on the position of the sensor relative to the encoder. As a
consequence, a rotating encoder generates a periodic output signal at the AMR bridge.
The KMI23/2 and the KMI23/4 are sensitive to movement in the y direction in front of the
sensor only. For definition of the coordinate axes, see Figure 4.
KMI23_2_4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
3 of 20
KMI23/2; KMI23/4
NXP Semiconductors
High performance rotational speed sensor
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Fig 2.
Functional principle of KMI23/2
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Functional principle of KMI23/4
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Fig 4.
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Definition of coordinate system
The KMI23/2 and the KMI23/4 each comprise an AMR sensor chip, a Position Detector IC
(PDIC) and a Line Driver IC (LDIC). The PDIC comprises the signal conditioning circuits,
whereas the LDIC comprises the external interface and the supply for PDIC and AMR
bridge (see Figure 1). The AMR sensor chip carries four MR elements arranged as a
Wheatstone bridge. The AMR bridge converts the magnetic field, generated by the
encoder rotation, into an electrical output signal. This signal is nearly sinusoidally with
time.
KMI23_2_4
Product data sheet
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Rev. 1 — 28 April 2016
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4 of 20
KMI23/2; KMI23/4
NXP Semiconductors
High performance rotational speed sensor
The LDIC chip is fabricated using a robust high-voltage process. This measure shields the
other two dies from the harsh electrical environment on the supply line VCC. The constant
current source IL provides the LOW-level output signal of typically 7 mA and delivers the
supply current for the whole sensor system. Thus from IL the supply voltages for the PDIC,
the AMR bridge and the current source block IH are derived. The switchable current
source IH also delivers typically 7 mA. Hence, if IH is active, the total supply current is at its
HIGH level of typically 14 mA. With this current interface, safe sensor signal transport to
the Electronic Control Unit (ECU) using only a two-wire cable is provided.
Within the PDIC, the differential output voltage of the AMR sensor bridge leads as speed
signal into an analog signal chain. It comprises an amplifier with adjustable gain, followed
by an offset cancelation stage and finally, a smart comparator having adjustable
hysteresis levels. The latter converts the sinusoidal sensor signal into a rectangular output
signal, which controls the switchable current source IH. Hence, the supply current
switches between its LOW and HIGH values of typically 7 mA and 14 mA at the magnetic
field strength frequency. Thus, the supply current as an output signal allows measuring
the rotational speed of the encoder wheel.
A peak detector within the digital control unit on the PDIC measures the amplitude and the
offset of the sensor signal. The peak detector has a resolution of 8 bit. This feature allows
the digital control unit on one hand, to eliminate the signal offset. This function is realized
with a dedicated Digital-to-Analog Converter (DAC). The DAC has a resolution of 12 bits.
On the other hand, it allows the digital control unit to optimize amplifier gain and
comparator hysteresis settings according to the actual signal amplitude. Due to these
measures, the sensor system can handle a wide amplitude range. This amplitude range in
turn allows the KMI25/2 and KMI25/4 to handle a wide range of air gaps between sensor
and encoder. The hysteresis of the smart comparator prevents erroneous multiple
switching due to mechanical vibrations of the encoder wheel. A further important feature
of the smart comparator is, that it switches its output level always at the zero-crossing of
its input signal. Thus, the phase of its rectangular output signal is independent of its
hysteresis setting and independent of the gain setting at the amplifier. For this reason,
adjustments of gain and hysteresis in the signal chain avoid the introduction of jitter into
the sensor output signal. The whole signal chain works even under DC conditions,
therefore having true zero Hertz capability.
5.2 Speed signal conditioning algorithm
The digital control unit (see Figure 1) controls the speed signal conditioning algorithm.
The general purpose is, to control the analog blocks in the signal channel to optimize
signal conditions at the analog comparator input. Therefore, the algorithm characterizes
the sensor input signal, as observed within the digital domain. As a result, the algorithm
adjusts the amplifier gain, cancels the signal offset and sets the comparator hysteresis. To
fulfill this task, the digital control unit provides switching between different operating
modes. Depending on frequency and amplitude of the input signal, one of the following
modes is selected:
•
•
•
•
KMI23_2_4
Product data sheet
Start-up mode
Adaptation mode
Normal mode
Low-speed mode
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Rev. 1 — 28 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
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KMI23/2; KMI23/4
NXP Semiconductors
High performance rotational speed sensor
Figure 5 depicts a flow chart summarizing the most important features of each mode and
the conditions for switching between modes. For each transition, all of the listed
conditions must be satisfied (logical AND), unless the notation ‘or’ is used. The latter
indicates a logical OR connection. In this case, the transition is performed if any of the
listed conditions is satisfied.
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Fig 5.
Flow chart
The following sections describe the implemented measurement functions for offset,
amplitude and frequency as well as each operation mode.
5.2.1 Peak detector
The peak detector is part of the digital control unit. It samples the AMR input signal with a
resolution of 8 bits and detects the positive and negative peak values. From these values,
it calculates the signal offset and the signal amplitude. The offset is calculated as half of
KMI23_2_4
Product data sheet
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Rev. 1 — 28 April 2016
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KMI23/2; KMI23/4
NXP Semiconductors
High performance rotational speed sensor
the sum of opposite signal peaks. The amplitude is calculated as difference of opposite
signal peaks. Principally, a peak is detected, where the difference between succeeding
signal samples switches its sign. In order to cope with superimposed noise and spurious
spikes, the peak detector uses dedicated filter algorithms.
5.2.2 Frequency measurement
As pointed out above, the peak detector calculates the signal offset. This offset level is the
‘zero level’ of the sensor signal. Whenever the sensor signal crosses this ‘zero level’, the
comparator switches its state.
If a zero-crossing with a falling edge is detected first, then frequency measurements are
always made between falling edges. If a zero-crossing with a rising edge is detected first,
then frequency measurements are always made between rising edges. Thus always a
complete signal period is used and the result is independent of any duty cycle shifts.
The frequencies occurring in start-up mode and low-speed mode are very low. Thus, an
indirect frequency measurement is done here by counting the number of signal peaks
within 2 seconds.
5.2.3 Start-up mode
Usually the system enters this mode after power-on reset. At power-on, nothing is known
about the input signal properties. The function of the speed control algorithm in start-up
mode is to characterize the input signal and produce estimates of its amplitude, offset and
frequency. Therefore, once the sensor element has been supplied with voltage, all circuit
parts are set into defined initial conditions. These conditions comprise fixed amplifier gain
and fixed (but temperature-dependent) comparator hysteresis. Furthermore, there is still
no offset cancelation. This procedure may take up to 1 ms. These initial conditions are
used to process the sensor bridge signal in the first instant. Thereafter the system is ready
to react on the input voltage.
If the first speed signal samples are near the positive or negative signal range limit, a large
offset is assumed. In this case, an initial offset correction with a predefined level is
executed. This function is applied to speed up the signal recognition in case of small
signals superimposed on a large offset.
Generally, the ‘start-up’ performance strongly depends on the signal amplitude and its
offset. Because of the possibility of missing the second zero-crossing, the first
zero-crossing of the input signal is not used. So under normal conditions (offset is
relatively small w.r.t. amplitude), the sensor issues the first speed pulse at its output with
the second zero-crossing of the analog input signal. As there is no offset regulation during
start-up mode, the speed pulses issued during this mode may be shifted in time w.r.t. the
zero-crossings of the sensor signal. As a consequence, the duty cycle of the output signal
may not yet fulfill the specification, if an external magnetic offset is present. For small
amplitudes and large offsets, no zero-crossings may be detected during start-up mode
until offset compensation is performed in adaptation mode.
If the peak detector has found 8 signal peaks within 4 seconds, start-up mode is left and
adaptation mode is entered. However, if start-up mode has been entered coming from
adaptation mode, then 4 signal peaks within 2 seconds cause reentering adaptation
mode.
KMI23_2_4
Product data sheet
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Rev. 1 — 28 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
7 of 20
KMI23/2; KMI23/4
NXP Semiconductors
High performance rotational speed sensor
5.2.4 Adaptation mode
The main purpose of adaptation mode is to optimize the signal conditions by adjusting
gain and offset, based on the estimates made in start-up mode. After standstill or in a
sudden change of signal offset, adaptation mode is entered as well.
In adaptation mode, offset compensation and gain setting are applied once per signal
cycle. Offset compensation first takes place in correcting 7⁄8 of the calculated offset per
step. It continues until the residual offset is below a threshold of 2 Least Significant Bit
(LSB). An exception occurs, if the remaining offset is larger than five times the signal
amplitude. In this case, the correction of that step is limited to the remaining offset level.
In order to avoid the generation of erroneous additional zero-crossings, the activity of the
offset compensation depends on the previous signal slope. Therefore, a positive offset is
only corrected after a falling slope and a negative offset is only corrected after a rising
slope.
If necessary, the amplifier gain is doubled or halfed, until the digital signal amplitude is
between 25 % and 75 % of its range. The temperature-dependent hysteresis level at the
comparator input is kept at the same percentage level w.r.t. to the signal range as in the
previous mode.
The number of steps required for the adaptation process depends on the relation between
offset and signal amplitude. Small amplitudes coming with a large offset require a
maximum number of steps. In such cases, the first zero-crossing may not be detected in
start-up mode, but in adaptation mode. As in start-up mode the second zero-crossing
could be missed under certain conditions also in adaptation mode. Therefore, in order to
ensure an uninterrupted pulse train, also in adaptation mode the first detected
zero-crossing is not used. Hence under normal conditions, the first output signal is issued
at the second detected zero-crossing.
The goal of the adaptations is a signal amplitude of 25 % to 75 % and an offset of maximal
2 LSB. If the frequency is greater than 1 Hz, the system then switches from adaptation
mode to normal mode. If the frequency falls below 1 Hz, the previous mode is entered
again (start-up mode or low-speed mode).
5.2.5 Normal mode
Normal mode is entered when the necessary adjustments to the gain and offset have
been completed in adaptation mode. The goal of the normal mode is, to keep duty cycle
and jitter of the output signal within specification.
During normal mode, amplifier gain is still adapted proportional to signal amplitude as in
adaptation mode. Thus, the input signal amplitude is between 25 % and 75 % of the signal
range. The hysteresis control, which in start-up mode and adaptation mode is carried out
depending on temperature, is now carried out depending on signal amplitude. Applied
hysteresis levels are at 23 % to 52 % of the amplitude. Due to this measure, the
hysteresis levels are high enough to provide a high level of immunity to noise and signal
disturbances. On the other hand, the hysteresis is small enough to maintain continued
comparator switching, even when offset jumps occur. For very small amplitudes, the
hysteresis is not set below a fixed minimum level and the ratio hysteresis/amplitude can
become greater than 52 %.
KMI23_2_4
Product data sheet
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Rev. 1 — 28 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
8 of 20
KMI23/2; KMI23/4
NXP Semiconductors
High performance rotational speed sensor
In adaptation mode, the offset has been reduced down to maximum 2 LSB using few
coarse compensation steps. In normal mode however, the goal is to reach and maintain
zero offset by using a slow offset correction. For this purpose, the offset compensation
level is changed at a limited rate versus time, as long as a residual offset is detected. Due
to this slow offset correction, duty cycle deviations and jitter of succeeding output pulses
are minimized. If however offset changes at a faster rate than the slow correction can
compensate, an increasing residual offset occurs. The residual offset causes a shift of the
duty cycle o at the output signal. In order to prevent o from leaving the specified window
(see characteristics in Table 6) or even loss of signal, the system switches back to
adaptation mode. If the residual offset has become greater than 50 % of the amplitude,
the system switches to adaptation mode. In adaptation mode, the remaining offset is
minimized again, as described in Section 5.2.4.
If the signal frequency drops below 1 Hz, the system also leaves normal mode and enters
low-speed mode.
5.2.6 Low-speed mode
If during adaptation mode or normal mode, the frequency drops below 1 Hz low-speed
mode is entered. If the vehicle is stationary, no signal peaks can be detected in order to
calculate amplitude and offset. Thus, the algorithms for offset compensation and
adaptation of gain and hysteresis cannot be applied. Therefore, low-speed mode acts as a
standby mode. In this mode, some of the normal functions of the algorithms are
suspended until the frequency returns above 1 Hz.
The previously calculated offset and gain setting are maintained, until the system returns
to adaptation mode. The hysteresis thresholds of the comparator are lowered to 55 % of
their previous value (if not the lowest hysteresis was already present). This measure
allows an amplitude reduction up to 44 % without loss of comparator switching.
A special case is ‘signal clipping’ during low-speed mode. Signal clipping means, that the
sensor signal reaches the positive or negative edge of the signal range. In this case, slow
offset compensation, similar to normal mode is applied. The goal of this measure is to
prevent, that the offset drift moves the full signal outside of the signal range.
The system leaves low-speed mode and enters adaptation mode as soon as the peak
detector has found four signal peaks within two seconds. As an additional condition, the
signal amplitude must be greater than 37.5 % of the value measured when entering
low-speed mode.
5.3 Output signal
5.3.1 Physical representation of output signal
The output signal is shown in Figure 6. Whenever there is a zero-crossing of the magnetic
input field (falling or rising) the output current changes from 7 mA to 14 mA or vice versa.
Between the detected zero-crossing and the respective edge of the output current, there
is a delay time of td (see characteristics in Table 6).
KMI23_2_4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
9 of 20
KMI23/2; KMI23/4
NXP Semiconductors
High performance rotational speed sensor
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Fig 6.
Timing of output signal to input signal and definition of duty cycle o
6. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referred to
pin GND.
Symbol Parameter
VCC
Conditions
supply voltage
Min
Max
Unit
40 C < Tamb < +60 C;
t < 2 minutes
-
24
V
40 C < Tamb < +60 C
-
18
V
40 C < Tamb < +150 C
-
16
V
150 C < Tamb < 175 C;
10  10 minutes during total
life time; none destructive
but no functionality granted
-
16
V
normal operation mode
VCC and GND incidentally
swapped
Tamb
KMI23_2_4
Product data sheet
16.5 -
V
40
+150 C
for 10  10 minutes during total
life time; VCC < 16 V
40
+175 C
ambient temperature
Tstg
storage temperature
no voltage applied
50
+150 C
Tsld
soldering temperature
for maximum 5 s
-
260
C
Hext
external magnetic field strength
-
30
kA/m
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KMI23/2; KMI23/4
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High performance rotational speed sensor
7. Recommended operating conditions
Table 5.
Operating conditions
Voltages are referred to pin GND.
Symbol
Parameter
Conditions
Min
Max
Unit
VCC
supply voltage
normal operation mode; Tamb  175 C
6.8
16
V
-
50

normal operation mode
40
+150
C
0
2.5
kHz
KMI23/2
150
-
A/m
KMI23/4
190
-
A/m
KMI23/2
-
528
A/m
KMI23/4
-
911
A/m
non-recurring changes
40
+100
%
periodic changes
10
+10
%
RL
load resistance
Tamb
ambient temperature
fH
magnetic field strength frequency
HM
peak magnetic field strength
Hoffset(ext)
HM
after power-on; speed pulses latest
after Ncy(H) magnetic cycles; see
characteristics in Table 6
external magnetic field strength
offset (absolute value)
peak magnetic field strength
variation
to allow correct start-up after power-on
allowable sudden change of magnetic
signal peak level without loss of speed
pulses
8. Characteristics
Table 6.
Characteristics
Characteristics are valid for the operating conditions specified in Section 7; voltages are referred to pin GND; unless
otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
6.3
6.8
V
Supply voltage and current
switch-on supply voltage
[1]
5.8
td(on)
turn-on delay time
[2]
-
-
1
ms
VCC(swoff)
switch-off supply voltage
[1]
4.0
4.5
5.0
V
VCC(hys)
supply voltage hysteresis
switch-on/switch-off
1.6
1.8
2.8
V
ICC(swoff)
switch-off supply current
VCC < 4 V
1.0
3.0
3.8
mA
VCC(swon)
ICCL
LOW-level supply current
5.88
7.0
8.4
mA
ICCH
HIGH-level supply current
11.7
14.0
16.8
mA
ICCH/ICCL
HIGH-level supply current to
LOW-level supply current ratio
1.8
2.0
-
-
dICC/dt
rate of change of supply current
6
-
28
mA/s
KMI23_2_4
Product data sheet
ICCL to ICCH and ICCL to
ICCM (10 % to 90 %
and 90 % to 10 %)
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Rev. 1 — 28 April 2016
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KMI23/2; KMI23/4
NXP Semiconductors
High performance rotational speed sensor
Table 6.
Characteristics …continued
Characteristics are valid for the operating conditions specified in Section 7; voltages are referred to pin GND; unless
otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Timing parameters
td
delay time
delay between
magnetic zero-crossing
and output switching;
see Figure 6
70
-
121
s
(T)
period jitter
one-sigma value;
required peak level of
magnetic signal:
HM = 280 A/m
(KMI23/2)
HM = 398 A/m
(KMI23/4)
0.1
-
+0.1
%
one-sigma value;
required peak level of
magnetic signal:
HM = 55 A/m (KMI23/2)
HM = 78 A/m (KMI23/4)
0.5
-
+0.5
%
o
output duty cycle
required peak level of
magnetic signal:
HM = 55 A/m (KMI23/2)
HM = 78 A/m (KMI23/4)
[3]
30
-
70
%
required peak level of
magnetic signal:
HM = 75 A/m (KMI23/2)
HM = 107 A/m
(KMI23/4)
[3]
40
-
60
%
Start-up performance after power-on, if magnetic field amplitude > minimum value of HM and fH > 1 Hz
Ncy(H)
number of magnetic field cycles
no external magnetic
offset; duty cycle within
specification
-
-
15
-
maximum allowed
external magnetic
offset; duty cycle within
specification
-
-
23
-
[1]
Once VCC has exceeded VCC(swon), the sensor switches on and current levels and current ratios are maintained until VCC falls below
VCC(swoff).
[2]
After supplying more than VCC(swon) to the device, it needs a turn-on delay time of td(on) to reach stable operation. A stable supply current
indicates stable operation.
[3]
During normal mode; for definition of duty cycle see Figure 6.
KMI23_2_4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
12 of 20
KMI23/2; KMI23/4
NXP Semiconductors
High performance rotational speed sensor
9. Electromagnetic compatibility
The following tests by an independent and certified test laboratory have verified EMC:
9.1 Emission
• CISPR 25 (2008, third edition), Chapter 6.2: conducted emission, voltage method
• CISPR 25 (2002, second edition), Chapter 6.4: radiated emission, Absorber-Lined
Shielded Enclosure (ALSE) method
9.2 Immunity to electrical transients
Tests were carried out with external protection circuit.
• ISO 7637-3: electrical transient transmission by capacitive coupling
9.3 Immunity to radiated disturbances
• ISO 11452-2: antenna in ALSE, including radar pulses
• ISO 11452-4: Bulk Current Injection (BCI)
– Substitution method
• ISO 11452-5: strip line
10. ElectroStatic Discharge (ESD)
The following tests have verified ESD:
10.1 Human body model (AEC-Q100-002)
8 kV at external pins (VCC and GND)
500 V at internal AMR bridge pins
10.2 Machine model (AEC-Q100-003)
400 V at external pins (VCC and GND)
100 V at internal AMR bridge pins
10.3 Charged-device model (AEC-Q100-011)
1 kV at external pins (VCC and GND)
500 V at internal AMR bridge pins
KMI23_2_4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
13 of 20
KMI23/2; KMI23/4
NXP Semiconductors
High performance rotational speed sensor
11. Application information
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12. Test information
12.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q100 Rev-G (grade 0) - Failure mechanism based stress test qualification
for integrated circuits, and is suitable for use in automotive applications.
13. Marking
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KMI23_2_4
Product data sheet
b. KMI23/4
Marking
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
14 of 20
KMI23/2; KMI23/4
NXP Semiconductors
High performance rotational speed sensor
14. Package outline
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KMI23_2_4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
15 of 20
KMI23/2; KMI23/4
NXP Semiconductors
High performance rotational speed sensor
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KMI23_2_4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
16 of 20
KMI23/2; KMI23/4
NXP Semiconductors
High performance rotational speed sensor
15. Handling information
5PLQ
DDD
Dimensions in mm
(1) No bending allowed.
(2) Plastic body and interface plastic body - leads: application of bending forces not allowed.
Fig 11. Bending recommendation
16. Solderability information
The solderability qualification is according to AEC-Q100 Rev-G. Recommended soldering
process for leaded devices is wave soldering. The maximum soldering temperature is
260 C for maximum 5 s. Device terminals are compatible with laser and electrical
welding. The device is reflow capable.
17. Revision history
Table 7.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
KMI23_2_4 v.1
20160428
Product data sheet
-
-
KMI23_2_4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
17 of 20
KMI23/2; KMI23/4
NXP Semiconductors
High performance rotational speed sensor
18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
KMI23_2_4
Product data sheet
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
18 of 20
KMI23/2; KMI23/4
NXP Semiconductors
High performance rotational speed sensor
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
18.4 Trademarks
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
KMI23_2_4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
19 of 20
NXP Semiconductors
KMI23/2; KMI23/4
High performance rotational speed sensor
20. Contents
1
1.1
1.2
1.3
2
3
4
5
5.1
5.2
5.2.1
5.2.2
5.2.3
5.2.4
5.2.5
5.2.6
5.3
5.3.1
6
7
8
9
9.1
9.2
9.3
10
10.1
10.2
10.3
11
12
12.1
13
14
15
16
17
18
18.1
18.2
18.3
18.4
19
20
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 3
System architecture . . . . . . . . . . . . . . . . . . . . . 3
Speed signal conditioning algorithm . . . . . . . . . 5
Peak detector . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Frequency measurement . . . . . . . . . . . . . . . . . 7
Start-up mode . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Adaptation mode. . . . . . . . . . . . . . . . . . . . . . . . 8
Normal mode . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Low-speed mode . . . . . . . . . . . . . . . . . . . . . . . 9
Output signal . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Physical representation of output signal . . . . . . 9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 10
Recommended operating conditions. . . . . . . 11
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 11
Electromagnetic compatibility . . . . . . . . . . . . 13
Emission . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Immunity to electrical transients . . . . . . . . . . . 13
Immunity to radiated disturbances . . . . . . . . . 13
ElectroStatic Discharge (ESD) . . . . . . . . . . . . 13
Human body model (AEC-Q100-002). . . . . . . 13
Machine model (AEC-Q100-003) . . . . . . . . . . 13
Charged-device model (AEC-Q100-011) . . . . 13
Application information. . . . . . . . . . . . . . . . . . 14
Test information . . . . . . . . . . . . . . . . . . . . . . . . 14
Quality information . . . . . . . . . . . . . . . . . . . . . 14
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15
Handling information. . . . . . . . . . . . . . . . . . . . 17
Solderability information. . . . . . . . . . . . . . . . . 17
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 17
Legal information. . . . . . . . . . . . . . . . . . . . . . . 18
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Contact information. . . . . . . . . . . . . . . . . . . . . 19
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2016.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 28 April 2016
Document identifier: KMI23_2_4
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