Data Sheet

DISCRETE SEMICONDUCTORS
DATA SHEET
M3D391
KMI16/1
Integrated rotational speed sensor
Product specification
Supersedes data of 1998 May 15
2000 Sep 05
Philips Semiconductors
Product specification
Integrated rotational speed sensor
KMI16/1
DESCRIPTION
PINNING
The KMI16/1 sensor detects rotational speed of ferrous
gear wheels and reference marks.
PIN
The sensor consists of a magnetoresistive sensor
element, a signal conditioning integrated circuit in bipolar
technology and a ferrite magnet.
SYMBOL
DESCRIPTION
1
VCC
DC supply voltage
2
Vout
open collector output
3
GND
ground
The frequency of the digital current output signal is
proportional to the rotational speed of the target wheel.
handbook, halfpage
The open collector (OC) output allows for a high degree of
flexibility in the design of subsequent conditioning
electronics.
CAUTION
Do not press two or more products together against their
magnetic forces. Do not expose products to strong
magnetic fields of more than 30 kA/m.
1
2
3
MBK766
Fig.1 Simplified outline (SOT477B).
QUICK REFERENCE DATA
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNIT
VCC
DC supply voltage
4.5
5
16
V
ICC
DC supply current (pin 1)
4
10
14
mA
VCEsat
OC saturation voltage
−
−
1
V
dmax
maximum sensing distance
2.4
2.9
−
mm
ft
operating tooth frequency
0
−
25000
Hz
Tamb
ambient operating temperature
−40
−
+150
°C
2000 Sep 05
2
Philips Semiconductors
Product specification
Integrated rotational speed sensor
KMI16/1
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134)
SYMBOL
PARAMETER
CONDITIONS
DC operating supply voltage
Tamb = −40 to +150 °C
voltage pin 1
Vout
VCC
MIN.
4.5
MAX.
UNIT
16
V
Tamb = −40 to +150 °C; no wrong polarity −0.5
protection
+16
V
OC output voltage
Tamb = −40 to +150 °C; no wrong polarity −0.5
protection; see Fig.5
+16
V
Vout(max)
peak OC output voltage
Tamb = −40 to +40 °C; no wrong polarity
protection; see Fig.5
−0.5
+26.5
V
Iout(max)
OC output current
Tamb = −40 to +150 °C
−
20
mA
Iout(off)
OC output leakage current
Tamb = −40 to +150 °C
−
100
µA
Ptot
total power dissipation
Tamb = −40 to +150 °C
−
200
mW
Tsld
soldering temperature
t ≤ 10 s
−
260
°C
Tstg
storage temperature
−65
+150
°C
Tamb
ambient operating temperature
−40
+150
°C
CHARACTERISTICS
Tamb = 25 °C; VCC = 5 V; d = 1.9 mm; ft = 2 kHz; test circuit see Fig.5; gear wheel: module 2.08 mm; material
9SMnPb28k; see Fig.6; centred sensor position; see notes 1, 2 and 3; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
ICC
supply current (pin 1)
Tamb = −40 to +150 °C
Vout (high)
OC output voltage high
OC = off state; Tamb = −40 to +150 °C 4.7
VCE sat
OC saturation voltage
OC = on state; Iout = 20 mA
tr
output signal rise time
10% to 90%
tf
output signal fall time
4
TYP.
MAX.
UNIT
10
14
mA
4.9
−
V
−
0.4
1
V
5
12
20
µs
10% to 90%
0.1
0.4
10
µs
δ
duty cycle
Tamb = −40 to +150 °C
30
50
70
%
dmin
minimum sensing distance
Tamb = −40 to +150 °C
−
0.3
0.5
mm
dmax
maximum sensing distance Tamb = −40 to +150 °C
2.4
2.9
−
mm
Notes
1. High rotational wheel speeds reduce the maximum sensing distance because of eddy currents, depending on target
wheel dimensions and materials used.
2. Output pins are designed for electrostatic sensitivity for more than 2000 V according to Human Body Model (HBM);
MIL-STD-883; method 3015.
3. EMC behaviour depends greatly on design of application circuit.
2000 Sep 05
3
Philips Semiconductors
Product specification
Integrated rotational speed sensor
KMI16/1
FUNCTIONAL DESCRIPTION
The KMI16/1 sensor is sensitive to the motion of ferrous
gear wheels or reference marks. The functional principle is
shown in Fig.3. Due to the effect of flux bending, the
different directions of magnetic field lines in the
magnetoresistive sensor element will cause an electrical
signal. Because of the chosen sensor orientation and the
direction of ferrite magnetization, the KMI16/1 is sensitive
to movement in the ‘y’ direction in front of the sensor only
(see Fig.2).
handbook, halfpage
x
x
magnet with
direction of
magnetization
y
The magnetoresistive sensor element signal is amplified,
temperature compensated and passed to a Schmitt trigger
in the conditioning integrated circuit (see Fig.4). The digital
output signal level is independent of the sensing distance
within the measuring range (see Fig.10). A (3-wire) output
current enables safe transfer of the sensor signal to the
detecting circuit (see Fig.5). The integrated circuit housing
is separated from the sensor element housing to optimize
the sensor behaviour at high temperatures.
z
sensor
IC
MBK767
Fig.2 Component detail of the KMI16/1.
gear wheel
handbook, full pagewidth
magnet
z
direction
of
motion
magnetic
field lines
y
sensor
MRA957
(a)
(b)
(c)
Fig.3 Functional principle.
2000 Sep 05
4
(d)
Philips Semiconductors
Product specification
Integrated rotational speed sensor
KMI16/1
handbook, full pagewidth
VCC
VOLTAGE CONTROL
SENSOR
SCHMITT
TRIGGER
AMPLIFIER
Vout
open collector
output
GND
MGL348
Fig.4 Block diagram.
VCC
handbook, halfpage
2.7 kΩ
10 kΩ
SENSOR
Vout
2.2 nF
ICC
MGL347
Fig.5 Test and application circuit.
2000 Sep 05
5
Philips Semiconductors
Product specification
Integrated rotational speed sensor
KMI16/1
APPLICATION INFORMATION
Gear Wheel Dimensions
Mounting conditions
SYMBOL
The recommended sensor position in front of a gear wheel
is shown in Fig.11. The distance ‘d’ is measured between
the sensor front and the tip of a gear wheel tooth. The
KMI16/1 senses ferrous indicators like gear wheels in the
‘y’ direction only (no rotational symmetry of the sensor);
see Fig.2. The effect of incorrect mounting positions on
sensing distance is shown in Figs 7, 8 and 9. The
symmetrical reference axis of the sensor corresponds to
the axis of the ferrite magnet.
German DIN
UNIT
z
number of teeth
−
d
diameter
mm
m
module m = d/z
mm
p
pitch p = π × m
mm
PD
pitch diameter (d in inch)
inch
DP
diametric pitch DP = z/PD
inch−1
CP
circular pitch CP = π/DP
inch
ASA; note 1
Environmental conditions
Due to eddy current effects the sensing distance depends
on the tooth frequency (see Fig.13). The influence of the
gear wheel module on the sensing distance is shown in
Fig.12.
handbook, full pagewidth
DESCRIPTION
Note
1. For conversion from ASA to DIN: m = 25.4 mm/DP;
p = 25.4 mm × CP.
10.00
2.080 ± 0.01
8.00
6.535 ± 0.01
3.50
M3
see detail Z
∅ 8H7 ∅ 32
0.5 × 45 o
∅1
04
A
±0
.05
10 o
−0.1
0.5 × 45 o
0.1 A
2.08 ± 0.1
R 0.5
0.5 × 45 o
0.05 A
detail Z
0.5 × 45 o
Fig.6 Gear wheel dimensions.
2000 Sep 05
6
MBL242
Philips Semiconductors
Product specification
Integrated rotational speed sensor
KMI16/1
MRA998
4
MRA999
4
handbook, halfpage
handbook, halfpage
d
(mm)
d
(mm)
3
3
2
2
Θ
y
d
d
1
1
0
0
1
2
3
0
0
4
1
2
3
Θ (deg)
4
y (mm)
VCC = 12 V; ft = 2 kHz; module = 2 mm; pitch diameter = 100 mm.
VCC = 12 V; ft = 2 kHz; module = 2 mm.
Fig.7 Sensing distance as a function of positional
tolerance in the y-axis; typical values.
Fig.8
MRA982
4
Sensing distance as a function of positional
tolerance; typical values.
MRA962
4
handbook, halfpage
handbook, halfpage
d
(mm)
d
(mm)
3
3
x
2
2
d
d
1
1
10 mm
0
−6
−4
−2
0
2
4
0
−50
6
x (mm)
0
50
100
150
200
Tamb (oC)
VCC = 12 V; ft = 2 kHz; module = 2 mm.
VCC = 12 V; ft = 2 kHz; module = 2 mm.
Fig.9
Fig.10 Sensing distance as a function of ambient
temperature; typical values.
Sensing distance as a function of positional
tolerance in the x-axis; typical values.
2000 Sep 05
7
Philips Semiconductors
Product specification
Integrated rotational speed sensor
KMI16/1
MRA966
1.5
handbook, halfpage
d
d0
1
sensor
handbook, halfpage
d
d
0.5
gear wheel
0
MRA963
0
1
2
3
4
5
module m (mm)
do = measuring distance for a gear wheel with module m = 2 mm.
Fig.12 Normalized maximum sensing distance as
a function of gear wheel module; typical
values.
Fig.11 Sensor positioning.
MRA965
4
handbook, halfpage
d
(mm)
3
2
tooth
frequency
d
ft
1
0
0
1
2
3
4
f (kHz)
VCC = 12 V; module = 2 mm.
Fig.13 Sensing distance as a function of tooth
frequency; typical values.
2000 Sep 05
8
Philips Semiconductors
Product specification
Integrated rotational speed sensor
KMI16/1
PACKAGE OUTLINE
Plastic single-ended multi-chip package;
magnetized ferrite magnet (8 x 8 x 4.5 mm); 4 interconnections; 3 in-line leads
M1
SOT477B
v M A B
HE1
K
B
A
Q
E
A
L1
M2
bp1
D
L
v M A B
E1
M3
HE
SENSOR DIE POSITION
centre of reading point
D1
*
L2
1
2
e1
3
bp
c
0
2.5
5 mm
e
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A(1)
bp
bp1
c
D(2)
mm
1.7
1.4
0.8
0.7
1.57
1.47
0.3
0.24
4.1
3.9
D1(2) E(2)
5.7
5.5
4.5
4.3
E1(2)
e
e1
HE
HE1
K
max.
L
L1
L2
M1
M2
M3(1)
Q
v
5.7
5.5
4.6
4.4
2.35
2.15
18.2
17.8
5.6
5.5
5.37
7.55
7.25
1.2
0.9
3.9
3.5
8.15
7.85
8.15
7.85
4.7
4.3
0.75
0.65
0.25
Notes
1. Glue thickness not included.
2. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
99-09-23
00-08-31
SOT477B
2000 Sep 05
EUROPEAN
PROJECTION
9
Philips Semiconductors
Product specification
Integrated rotational speed sensor
KMI16/1
DATA SHEET STATUS
DATA SHEET STATUS
PRODUCT
STATUS
DEFINITIONS (1)
Objective specification
Development
This data sheet contains the design target or goal specifications for
product development. Specification may change in any manner without
notice.
Preliminary specification
Qualification
This data sheet contains preliminary data, and supplementary data will be
published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.
Product specification
Production
This data sheet contains final specifications. Philips Semiconductors
reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
Note
1. Please consult the most recently issued data sheet before initiating or completing a design.
DEFINITIONS
DISCLAIMERS
Short-form specification  The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes  Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2000 Sep 05
10
Philips Semiconductors
Product specification
Integrated rotational speed sensor
KMI16/1
NOTES
2000 Sep 05
11
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SCA 70
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613520/02/pp12
Date of release: 2000
Sep 05
Document order number:
9397 750 07248
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