PR601 High performance NFC integrated reader solution Rev. 3.3 — 10 March 2016 219333 Product data sheet COMPANY PUBLIC 1. Introduction Delivering unprecedented integration, these module combines the functionality of multiple discrete ICs in a single package and enables the development of compact, cost-effective contactless reader systems for access and industrial applications. The module includes microcontroller functionality and support of multiple contactless reader protocols based on 13.56 MHz. The package contains two dies: 1. LPC1227FBD48/301 2. CLRC66301HN1 Not all pins of the LPC1227 specified in the data sheet are available at the reader module. Please refer to Section 9 “Pinning information”. The device does not implement any interconnection inside the package. This enables easy access to all signals during system development. 2. General description 2.1 CLRC663 The CLRC663 is a highly integrated transceiver IC for contactless communication at 13.56 MHz. This transceiver IC utilizes an outstanding modulation and demodulation concept completely integrated for different kinds of contactless communication methods and protocols at 13.56 MHz. The CLRC663 transceiver ICs support following different operating modes: • • • • • • • Reader/Writer mode supporting ISO/IEC 14443A/MIFARE Reader/Writer mode supporting ISO/IEC 14443B Reader/Writer mode supporting FeliCa scheme Reader/Writer mode supporting ISO/IEC 15693 Reader/Writer mode supporting ICODE EPC UID/ EPC OTP Reader/Writer mode supporting ISO/IEC 18000-3 Mode 3 NFC P2P passive initiator The CLRC663 internal transmitter is able to drive a reader/writer antenna designed to communicate with ISO/IEC 14443A/MIFARE cards and transponders without additional active circuitry. The receiver module provides a robust and efficient implementation for PR601 NXP Semiconductors High performance NFC integrated reader solution demodulation and decoding signals from ISO 14443A/MIFARE compatible cards and transponders. The digital module manages the complete ISO 14443A framing and error detection (parity and CRC) functionality. The CLRC663 supports MIFARE 1K, MIFARE 4K, MIFARE Ultralight, MIFARE, Ultralight C, MIFARE PLUS and MIFARE DESFire products. The CLRC663 supports contactless communication and uses MIFARE higher transfer speeds up to 848 kBd in both directions. The CLRC663 supports all layers of the ISO/IEC 14443B reader/writer communication scheme, given correct implementation of additional components, like oscillator, power supply, coil etc. and provided that standardized protocols, for example, like ISO/IEC 14443-4 and/or ISO/IEC 14443B anticollision are correctly implemented. Enabled in Reader/Writer mode for FeliCa, the CLRC663 transceiver IC supports the FeliCa communication scheme. The receiver part provides a robust and efficient implementation of the demodulation and decoding circuitry for FeliCa coded signals. The digital part handles the FeliCa framing and error detection like CRC. The CLRC663 supports contactless communication using FeliCa Higher transfer speeds up to 424 kbit/s in both directions. The CLRC663 supports vicinity protocol according to ISO/IEC15693, EPC UID and ISO/IEC 18000-3 mode 3. The complete vicinity product family of NXP is supported and enable a readability for mid-ranger reader applications. The following host interfaces are provided: • Serial Peripheral Interface (SPI) • Serial UART (similar to RS232 with voltage levels dependent on pin voltage supply) • I2C-bus interface (two versions are implemented: I2C and I2CL) 2.2 LPC1227 The LPC1227 are ARM Cortex-M0-based microcontrollers for embedded applications featuring a high level of integration and low-power consumption. The ARM Cortex-M0 is a next generation core that offers system enhancements such as enhanced debug features and a higher level of support block integration. In addition to the ARM Cortex-M0, the LPC1X features an event handler API to limit the interrupt load of the ARM Cortex-M0 CPU and to allow for additional power-savings by off-loading event handling from the main CPU. The LPC1227 operates at CPU frequencies of up to 33 MHz and include up to 128 kB of flash memory and 8 kB of data memory. Not all connections of the LPC1227 product are implemented by the PR601. 3. Features and benefits PR601 Product data sheet COMPANY PUBLIC Fully compliant with ISO/IEC 14443 A and B, ISO/IEC 15693 and FeliCa Support for MIFARE technology NFC-IP1 peer-to-peer support (Passive Initiator Mode) Compatibility with all established smartcard ICs, smart tags, and label technologies Support for SAM AV 2.6 interface Integrating multiple functions in a single package Integrated LPC1227 ARM Cortex-M0 microcontroller All information provided in this document is subject to legal disclaimers. Rev. 3.3 — 10 March 2016 219333 © NXP Semiconductors N.V. 2016. All rights reserved. 2 of 14 PR601 NXP Semiconductors High performance NFC integrated reader solution Reduced PCB size for development of systems with small physical dimensions Compact, single-package: LQFP100 Fast design-in with supplied firmware 4. Applications Highly integrated access systems Industrial devices requiring high-performance RF 5. Quick reference data Table 1. Quick reference data[1] Symbol Parameter Conditions VDD(LPC1227) supply voltage LPC1227 Min Typ Max Unit 3.0 3.3 3.6 V VDD(CLRC663) supply voltage CLRC663 3.0 5.0 5.5 V Tamb ambient temperature 25 +25 +70 C [1] Refer to the specification of integrated products for quick reference data details 6. Ordering information Table 2. Ordering information Type number PR601HL/C1 Package Name Description Version LQFP100 plastic low profile quad flat package; 100 leads; body 14 14 1.4 mm SOT407-1 7. Marking Table 3. Marking codes Type number Marking code PR601HL/C1 PR601 Product data sheet COMPANY PUBLIC 1st line product type 2nd line 1st die diffusion number 3rd line weekcode 4th line 2nd and 3rd die diffusion number 5th line (optional) additional information All information provided in this document is subject to legal disclaimers. Rev. 3.3 — 10 March 2016 219333 © NXP Semiconductors N.V. 2016. All rights reserved. 3 of 14 PR601 NXP Semiconductors High performance NFC integrated reader solution 8. Block diagram interfaces and supply CLRC663 LPC1227 interfaces and supply aaa-002267 Fig 1. Block diagram 9. Pinning information 9.1 Pinning Table 4. PR601 Product data sheet COMPANY PUBLIC Pin allocation table Pin Symbol Connection 1 PIO0_10 LPC1227 2 PIO0_11 LPC1227 3 PIO0_12 LPC1227 4 nRESET/PIO0_13 LPC1227 5 PIO0_14 LPC1227 6 PIO0_15 LPC1227 7 PIO0_16 LPC1227 8 PIO0_17 LPC1227 9 PIO0_18 LPC1227 10 PIO0_30 LPC1227 11 PIO0_31 LPC1227 12 PIO1_0 LPC1227 13 PIO1_1 LPC1227 14 GND all 15 PIO1_2 LPC1227 16 PIO1_3/WAKEUP LPC1227 17 PIO1_4 LPC1227 18 PIO1_5 LPC1227 19 PIO1_6 LPC1227 20 VSS LPC1227 21 VDD(3V3) LPC1227 All information provided in this document is subject to legal disclaimers. Rev. 3.3 — 10 March 2016 219333 © NXP Semiconductors N.V. 2016. All rights reserved. 4 of 14 PR601 NXP Semiconductors High performance NFC integrated reader solution Table 4. PR601 Product data sheet COMPANY PUBLIC Pin allocation table …continued Pin Symbol Connection 22 RTCXOUT LPC1227 23 RTCXIN LPC1227 24 VDDIO LPC1227 25 VSSIO LPC1227 26 n.c. - 27 n.c. - 28 n.c. - 29 n.c. - 30 n.c. - 31 n.c. - 32 n.c. - 33 n.c. - 34 AVDD CLRC663 35 AUX1 CLRC663 36 AUX2 CLRC663 37 RXP CLRC663 38 RXN CLRC663 39 VMID CLRC663 40 TX2 CLRC663 41 TVSS CLRC663 42 GND CLRC663 43 TX1 CLRC663 44 TVDD CLRC663 45 XTAL1 CLRC663 46 n.c. - 47 XTAL2 CLRC663 48 n.c. - 49 PD CLRC663 50 n.c. - 51 CLKOUT CLRC663 52 SCL CLRC663 53 SDA CLRC663 54 PVDD CLRC663 55 IFSEL0 CLRC663 56 IFSEL1 CLRC663 57 IF0 CLRC663 58 IF1 CLRC663 59 IF2 CLRC663 60 IF3 CLRC663 61 IRQ CLRC663 62 GND CLRC663 All information provided in this document is subject to legal disclaimers. Rev. 3.3 — 10 March 2016 219333 © NXP Semiconductors N.V. 2016. All rights reserved. 5 of 14 PR601 NXP Semiconductors High performance NFC integrated reader solution Table 4. PR601 Product data sheet COMPANY PUBLIC Pin allocation table …continued Pin Symbol Connection 63 TDO CLRC663 64 TDI CLRC663 65 TMS CLRC663 66 TCK CLRC663 67 SIGIN CLRC663 68 SIGOUT CLRC663 69 DVDD CLRC663 70 VDDS CLRC663 71 n.c. - 72 n.c. - 73 n.c. - 74 n.c. - 75 n.c. - 76 XTALIN LPC1227 77 XTALOUT LPC1227 78 VREF_COMP LPC1227 79 PIO0_19 LPC1227 80 PIO0_20 LPC1227 81 PIO0_21 LPC1227 82 PIO0_22 LPC1227 83 PIO0_23 LPC1227 84 PIO0_24 LPC1227 85 PIO0_25 LPC1227 86 PIO0_26 LPC1227 87 PIO0_27 LPC1227 88 GND all 89 PIO0_28 LPC1227 90 PIO0_29 LPC1227 91 PIO0_0 LPC1227 92 PIO0_1 LPC1227 93 PIO0_2 LPC1227 94 PIO0_3 LPC1227 95 PIO0_4 LPC1227 96 PIO0_5 LPC1227 97 PIO0_6 LPC1227 98 PIO0_7 LPC1227 99 PIO0_8 LPC1227 100 PIO0_9 LPC1227 All information provided in this document is subject to legal disclaimers. Rev. 3.3 — 10 March 2016 219333 © NXP Semiconductors N.V. 2016. All rights reserved. 6 of 14 PR601 NXP Semiconductors High performance NFC integrated reader solution 9.2 Pin description For a description of the detailed pin functionality refer to the relevant product data sheet. VSS and GND refer to the same signal and need all be connected. 10. Functional description The functionality of this device is defined by the functionality of the 2chips CLRC663 and LPC1227. No internal connection of the devices had been implemented except for the GND signal. All external available GND signals need to be connected. A design making use of this device shall consider a sufficient low thermal resistance between package and environment. All pins are recommended to be connected to defined signal levels. A PCB design using the PR601 shall make use of state of the art design practices to ensure a sufficient heat dissipation. For a detailed functionality refer to the latest product specifications of the CLRC663 and LPC1227. 11. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Ptot total power dissipation ambient temperature 25 °C, package soldered on PCB - 1.5 W VESD electrostatic discharge voltage human body model; all pins 1500 - V 12. Characteristics Table 6. Characteristics[1] Symbol Parameter VDD(LPC) Conditions Min Typ Max Unit supply voltage of LPC1227 die 3.0 3.3 3.6 V VDD(CLRC) supply voltage of CLRC663 die 3.0 5.0 5.5 V Tamb ambient temperature 25 +25 +70 C fosc(RC) LPC1227 internal RC oscillator frequency 11.76 12.00 12.24 MHz IDD(TVDD) TVDD supply current - 100 200 mA [1] CLRC663 die transmitter supply current For a detailed information of the characteristics refer to the data sheets of the packaged products PR601 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.3 — 10 March 2016 219333 © NXP Semiconductors N.V. 2016. All rights reserved. 7 of 14 PR601 NXP Semiconductors High performance NFC integrated reader solution 13. Package outline LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm SOT407-1 c y X A 51 75 50 76 ZE e E HE A A2 (A 3) A1 w M θ bp Lp pin 1 index L 100 detail X 26 1 25 ZD e v M A w M bp D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e mm 1.6 0.15 0.05 1.45 1.35 0.25 0.27 0.17 0.20 0.09 14.1 13.9 14.1 13.9 0.5 HD HE 16.25 16.25 15.75 15.75 L Lp v w y 1 0.75 0.45 0.2 0.08 0.08 Z D (1) Z E (1) 1.15 0.85 1.15 0.85 θ 7o o 0 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. Fig 2. REFERENCES OUTLINE VERSION IEC JEDEC SOT407-1 136E20 MS-026 JEITA EUROPEAN PROJECTION ISSUE DATE 00-02-01 03-02-20 Package outline LQFP100 (SOT407-1) PR601 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.3 — 10 March 2016 219333 © NXP Semiconductors N.V. 2016. All rights reserved. 8 of 14 PR601 NXP Semiconductors High performance NFC integrated reader solution 14. Handling information Moisture Sensitivity Level (MSL) evaluation has been performed according to SNW-FQ-225B rev.04/07/07 (JEDEC J-STD-020C). MSL for this package is level 2 which means 260 C convection reflow temperature. Dry pack is required. 1 year out-of-pack floor life at maximum ambient temperature 30 C/ 85 % RH. 15. Packing information The straps around the package of stacked trays inside the plano-box have sufficient pre-tension to avoid loosening of the trays. strap 46 mm from corner tray ESD warning preprinted chamfer barcode label (permanent) PIN 1 barcode label (peel-off) chamfer QA seal PIN 1 Hyatt patent preprinted In the traystack (2 trays) only ONE tray type* allowed *one supplier and one revision number. printed plano box 001aaj740 Fig 3. Packing information 1 tray 16. Abbreviations Table 7. PR601 Product data sheet COMPANY PUBLIC Abbreviations Acronym Description EPC Electronic Product Code OTP One Time Programmable SPI Serial Peripheral Interface UID Unique IDentification All information provided in this document is subject to legal disclaimers. Rev. 3.3 — 10 March 2016 219333 © NXP Semiconductors N.V. 2016. All rights reserved. 9 of 14 PR601 NXP Semiconductors High performance NFC integrated reader solution 17. Glossary Die — unpackaged chip of a product 18. References 1. [1] Data sheet — CLRC663, Contactless reader IC, BU-ID Document number 1711**1 [2] Data sheet — LPC122x, 32-bit ARM Cortex-M0 microcontroller; up to 128 kB flash and 8 kB SRAM ** .. document version number PR601 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.3 — 10 March 2016 219333 © NXP Semiconductors N.V. 2016. All rights reserved. 10 of 14 PR601 NXP Semiconductors High performance NFC integrated reader solution 19. Revision history Table 8. Revision history Document ID Release date Data sheet status Change notice Supersedes PR601 v. 3.3 20160310 Product data sheet - PR601 v. 3.2 Modifications: PR601 v. 3.2 Modifications: PR601 v. 3.1 Modifications: PR601 v. 3.0 Modifications: PR601 v. 1.1 Modifications: PR601 v. 1.0 PR601 Product data sheet COMPANY PUBLIC • Table 6 20160111 • • - PR601 v. 3.1 Product data sheet - PR601 v. 3.0 - PR601 v. 1.1 Table 4 “Pin allocation table”: corrected Section 3 “Features and benefits”: updated Descriptive title changed Product data sheet Figure 1 “Block diagram”: corrected from LPC1127 into LPC1227 Data sheet status changed to “Product data sheet” 20120919 • Product data sheet Section 20.4 “Licenses”: License statement “Purchase of NXP ICs with NFC technology” updated 20121112 • • TVDD supply current values added Section 2.1 “CLRC663”: License statement updated 20141021 • • • “Characteristics[1]”: Objective data sheet - PR601 v. 1.0 - - General update 20120314 Objective data sheet All information provided in this document is subject to legal disclaimers. Rev. 3.3 — 10 March 2016 219333 © NXP Semiconductors N.V. 2016. All rights reserved. 11 of 14 PR601 NXP Semiconductors High performance NFC integrated reader solution 20. Legal information 20.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 20.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 20.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. PR601 Product data sheet COMPANY PUBLIC Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 3.3 — 10 March 2016 219333 © NXP Semiconductors N.V. 2016. All rights reserved. 12 of 14 PR601 NXP Semiconductors High performance NFC integrated reader solution Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. 20.4 Licenses Purchase of NXP ICs with NFC technology Purchase of an NXP Semiconductors IC that complies with one of the Near Field Communication (NFC) standards ISO/IEC 18092 and ISO/IEC 21481 does not convey an implied license under any patent right infringed by implementation of any of those standards. Purchase of NXP Semiconductors IC does not include a license to any NXP patent (or other IP right) covering combinations of those products with other products, whether hardware or software. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Purchase of NXP ICs with ISO/IEC 14443 type B functionality Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 20.5 Trademarks This NXP Semiconductors IC is ISO/IEC 14443 Type B software enabled and is licensed under Innovatron’s Contactless Card patents license for ISO/IEC 14443 B. The license includes the right to use the IC in systems and/or end-user equipment. RATP/Innovatron Technology Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. MIFARE — is a trademark of NXP B.V. ICODE and I-CODE — are trademarks of NXP B.V. MIFARE Plus — is a trademark of NXP B.V. MIFARE Ultralight — is a trademark of NXP B.V. DESFire — is a trademark of NXP Semiconductors N.V. I2C-bus — logo is a trademark of NXP B.V. 21. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] PR601 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.3 — 10 March 2016 219333 © NXP Semiconductors N.V. 2016. All rights reserved. 13 of 14 PR601 NXP Semiconductors High performance NFC integrated reader solution 22. Contents 1 2 2.1 2.2 3 4 5 6 7 8 9 9.1 9.2 10 11 12 13 14 15 16 17 18 19 20 20.1 20.2 20.3 20.4 20.5 21 22 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 CLRC663 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 LPC1227. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Quick reference data . . . . . . . . . . . . . . . . . . . . . 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 7 Functional description . . . . . . . . . . . . . . . . . . . 7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Handling information. . . . . . . . . . . . . . . . . . . . . 9 Packing information . . . . . . . . . . . . . . . . . . . . . 9 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Contact information. . . . . . . . . . . . . . . . . . . . . 13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2016. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 10 March 2016 219333