±16.5kV ESD Protected, +125°C, 1.8V to 3.6V, Low Power, SOT-23, RS-485/RS-422 Transmitters ISL32613E, ISL32614E Features The Intersil ISL32613E and ISL32614E are ±16.5kV HBM ESD Protected (7kV IEC61000 contact), 1.8V powered, single transmitters for differential communication. These drivers have very low bus currents (±40µA), so they present less than a “1/8 unit load” to the bus. This allows more than 256 transmitters on the network, without violating the RS-485 specification’s 32 unit load maximum and without using repeaters. • Wide Supply Voltage Range . . . . . . . . . . . . . . . . . 1.8V to 3.6V • Low Quiescent Supply Current . . . . . . . . . . . . . . . 80µA (Max) - Very Low Shutdown Supply Current . . . . . . . . . . 2µA (Max) Hot Plug circuitry ensures that the Tx outputs remain in a high impedance state while the power supply stabilizes. • High ESD Protection on RS-485 Outputs . . . . ±16.5kV HBM - Class 3 ESD Level on All Other Pins. . . . . . . . . . >8kV HBM • Specified for +125°C Operation • Hot Plug - Tx Outputs Remain Three-state During Power-up • Low Tx Leakage Allows >256 Devices on the Bus Both ICs utilize slew rate limited drivers, which reduce EMI and minimize reflections from improperly terminated transmission lines or unterminated stubs in multidrop and multipoint applications. The ISL32613E is more slew rate limited for data rates up to 128kbps, while the less limited ISL32614E is useful for data rates up to 256kbps. • Slew Rate Limited for Data Rates Up to 256kbps For companion low power single RS-485 receivers, please see the ISL32610E data sheet. Applications • Current Limiting and Thermal Shutdown for Driver Overload Protection • 5V Tolerant Logic Inputs • Pb-Free (RoHS Compliant) • Industrial/Process Control Networks • Space-constrained Systems • Factory Automation • Building Environmental Control/Lighting Systems 10m Truth Table RD = ∞, CD = 50pF TRANSMITTING INPUTS DYNAMIC (128kbps) ICC (A) 1m STATIC 100µ OUTPUTS DE (Note 9) DI Z Y 1 1 0 1 1 0 1 0 0 X High-Z * High-Z * NOTE: *Shutdown Mode 10µ 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 VCC (V) FIGURE 1. VCC 1.8V TO 3.6V ISL32613E with VCC = 1.8V Reduces Operating ICC by a Factor of 177 Compared with ICC at VCC = 3.6V August 30, 2011 FN7906.0 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2011. All Rights Reserved Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners. ISL32613E, ISL32614E Pin Configuration Pin Descriptions ISL32613E, ISL32614E (6 LD SOT-23) TOP VIEW DI 1 VCC 2 D DE 3 SOT-23 SYMBOL FUNCTION 1 DI Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low. 6 Y 2 VCC System power supply input (1.8V to 3.6V). 5 GND 3 DE Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high, and are high impedance when DE is low. If the driver enable function is not needed, connect DE to VCC through a 1kΩ to 2kΩ resistor. 4 Z 5 GND 6 Y 4 Z ±16.5kV HBM, ±7kV IEC61000 (contact method) ESD Protected inverting differential transmitter output. Ground connection. ±16.5kV HBM, ±7kV IEC61000 (contact method) ESD Protected noninverting differential transmitter output. TABLE 1. SUMMARY OF FEATURES AT VCC = 1.8V PART NUMBER FUNCTION DATA RATE (kbps) SLEW-RATE LIMITED? HOT PLUG? TX ENABLE? (Note 9) MAXIMUM QUIESCENT ICC (µA) LOW POWER SHUTDOWN? PIN COUNT ISL32613E 1 Tx 128 Yes Yes Yes 80 Yes 6 Ld SOT ISL32614E 1 Tx 256 Yes Yes Yes 80 Yes 6 Ld SOT Ordering Information PART MARKING (Note 4) PART NUMBER (Notes 1, 2) TEMP. RANGE (°C) PACKAGE (Tape and Reel) (Pb-Free) PKG. DWG. # ISL32613EFHZ-T 613F -40 to +125 6 Ld SOT-23 P6.064 ISL32614EFHZ-T 614F -40 to +125 6 Ld SOT-23 P6.064 NOTES: 1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 2. Please refer to TB347 for details on reel specifications. 3. For Moisture Sensitivity Level (MSL), please see device information page for ISL32613E, ISL32614E. For more information on MSL please see techbrief TB363. 4. SOT-23 “PART MARKING” is branded on the bottom side. 2 FN7906.0 August 30, 2011 ISL32613E, ISL32614E Typical Operating Circuits NETWORK WITH ENABLES +1.8V + 1 0.1µF +1.8V 0.1µF + 2 VCC 3 RO VCC R D 5 RE B 4 4 Z A 6 6 Y ISL32611E DE 3 ISL3261XE GND GND 2 5 NETWORK WITHOUT ENABLES +1.8V + 1 VCC 3 RO 0.1µF 0.1µF +1.8V 1kΩ TO 2kΩ (Note 9) + 2 3 DE VCC R D ISL32610E GND 2 3 DI 1 B 4 4 Z A 5 6 Y DI 1 ISL3261XE GND 5 FN7906.0 August 30, 2011 ISL32613E, ISL32614E Absolute Maximum Ratings Thermal Information VCC to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V Input Voltages DI, DE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V Output Voltages Y, Z (VCC = 0V or ≥ 2.7V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +13V Y, Z (VCC = 1.8V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +3V Short Circuit Duration Y, Z. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Indefinite ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . see “Electrical Specifications” Latch-up (per JESD78, Level 2, Class A) . . . . . . . . . . . . . . . . . . . . . . +125°C Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W) 6 Ld SOT-23 Package (Notes 5, 6). . . . . . . . 177 95 Maximum Junction Temperature (Plastic Package) . . . . . . . . . . . +150°C Maximum Storage Temperature Range . . . . . . . . . . . . . -65°C to +150°C Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp Recommended Operating Conditions Supply Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.8V to 3.3V Common Mode Range; VCC = 1.8V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±2V VCC ≥ 2.7V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -7V to +12V Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +125°C RD; VCC = 1.8V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ≥10kΩ VCC ≥ 2.7V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ≥60Ω CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 5. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 6. For θJC, the “case temp” location is taken at the package top center. Electrical Specifications VCC = 1.8V; typicals are at TA = +25°C; unless otherwise specified. Boldface limits apply over the operating temperature range, -40°C to +125°C. (Note 7) PARAMETER SYMBOL TEST CONDITIONS TEMP MIN (°C) (Note 10) TYP MAX (Note 10) UNITS DC CHARACTERISTICS Driver Differential VOUT VOD VCC = 1.8V Full 0.8 0.92 - V VCC ≥ 3.15V Full 2 - - V RL = 54Ω (Figure 2), VCC ≥ 3V Full 1.5 - - V No Load Full 1.1 1.45 VCC V ΔVOD Change in Magnitude of Driver Differential VOUT for Complementary Output States RL = 100Ω (Figure 2) Full - 0.01 0.2 V Driver Common-Mode VOUT V0C RL = 100Ω (Figure 2) Full - 1.1 1.4 V Change in Magnitude of Driver Common-Mode VOUT for Complementary Output States ΔVOC RL = 100Ω (Figure 2) Full - 0.01 0.2 V Logic Input High Voltage (DI, DE) VIH VCC = 1.8V Full 1.26 - - V 2.7V ≤ VCC ≤ 3.6V Full 2.2 - - V VCC = 1.8V Full - - 0.4 V 2.7V ≤ VCC ≤ 3.6V Full - - 0.8 V Logic Input Low Voltage (DI, DE) VIL RL = 100Ω (Figure 2) Logic Input Current IIN DI = DE = 0V or VCC (Note 9) Full -2 - 2 µA Output Leakage Current (Y, Z, Note 9) IOZ DE = 0V, VCC = 0V or 1.8V, or 3.6V VO = 7V at VCC = 1.8V Full - 0.1 30 µA VO = 12V at VCC = 3.6V Full - 0.1 40 µA VO = -7V Full -40 -8 - µA VCC = 1.8V, DE = VCC, -2V ≤ VO ≤ 2V Full - - ±250 mA VCC ≥ 2.7V, DE = VCC, -7V ≤ VO ≤ 12V Full - ±150 - mA Driver Short-Circuit Current, VO = High or Low (Note 8) IOS 4 FN7906.0 August 30, 2011 ISL32613E, ISL32614E Electrical Specifications VCC = 1.8V; typicals are at TA = +25°C; unless otherwise specified. Boldface limits apply over the operating temperature range, -40°C to +125°C. (Note 7) (Continued) PARAMETER SYMBOL TEST CONDITIONS TEMP MIN (°C) (Note 10) TYP MAX (Note 10) UNITS SUPPLY CURRENT No-Load Supply Current ICC Shutdown Supply Current ISHDN DE = VCC = 1.8V, DI = 0V or VCC Full - 20 80 µA DE = VCC, 2.7V ≤ VCC ≤ 3.6V, DI = 0V or VCC Full - 100 150 µA 1.8V ≤ VCC ≤ 3.6V, DE = 0V, DI = 0V or VCC Full - 0.01 2 µA Human Body Model, from bus pins to GND 25 - ±16.5 - kV IEC61000 Contact, from bus pins to GND 25 - ±7 - kV HBM, per MIL-STD-883 Method 3015 25 - ±8 - kV Machine Model 25 - ±400 - V VCC = 1.8V Full 128 - - kbps 3V ≤ VCC ≤ 3.6V Full 256 - - kbps VCC = 1.8V Full - 1700 2600 ns 3V ≤ VCC ≤ 3.6V Full - 1100 1500 ns VCC = 1.8V Full - 30 200 ns 3V ≤ VCC ≤ 3.6V Full - 2 30 ns VCC = 1.8V Full - 1600 2600 ns 3V ≤ VCC ≤ 3.6V Full 400 960 1500 ns ESD PERFORMANCE RS-485 Pins (Y, Z) All Pins DRIVER SWITCHING CHARACTERISTICS (ISL32613E, 128kbps Version) Maximum Data Rate fMAX Driver Differential Output Delay tDD Driver Differential Output Skew tDSK Driver Differential Rise or Fall Time tR, tF CD = 50pF (Figure 3) CD = 50pF (Figure 3) CD = 50pF (Figure 3) Driver Enable to Output High tZH RL = 500Ω, CL = 50pF, SW = GND (Figure 4) Full - 460 800 ns Driver Enable to Output Low tZL RL = 500Ω, CL = 50pF, SW = VCC (Figure 4) Full - 460 800 ns Driver Disable from Output High tHZ RL = 500Ω, CL = 50pF, SW = GND (Figure 4) Full - 60 250 ns Driver Disable from Output Low tLZ RL = 500Ω, CL = 50pF, SW = VCC (Figure 4) Full - 60 250 ns VCC = 1.8V Full 256 - - kbps 3V ≤ VCC ≤ 3.6V Full 500 - - kbps VCC = 1.8V Full - 700 2000 ns 3V ≤ VCC ≤ 3.6V Full - 350 500 ns VCC = 1.8V Full - 30 200 ns 3V ≤ VCC ≤ 3.6V Full - 2 30 ns VCC = 1.8V Full - 1700 2600 ns 3V ≤ VCC ≤ 3.6V Full 200 350 800 ns DRIVER SWITCHING CHARACTERISTICS (ISL32614E, 256kbps Version) Maximum Data Rate fMAX Driver Differential Output Delay tDD Driver Differential Output Skew tDSK Driver Differential Rise or Fall Time tR, tF RD = ∞, CD = 50pF RD = ∞, CD = 50pF (Figure 3) RD = ∞, CD = 50pF (Figure 3) RD = ∞, CD = 50pF (Figure 3) Driver Enable to Output High tZH RL = 500Ω, CL = 50pF, SW = GND (Figure 4) Full - 460 800 ns Driver Enable to Output Low tZL RL = 500Ω, CL = 50pF, SW = VCC (Figure 4) Full - 460 800 ns Driver Disable from Output High tHZ RL = 500Ω, CL = 50pF, SW = GND (Figure 4) Full - 60 250 ns Driver Disable from Output Low tLZ RL = 500Ω, CL = 50pF, SW = VCC (Figure 4) Full - 60 250 ns NOTES: 7. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. 8. Applies to peak current. See “Typical Performance Curves” on page 8 for more information. 9. If the Driver Enable function is not needed, connect DE to VCC through a 1kΩ to 2kΩ resistor. 10. Compliance to data sheet limits is assured by one or more methods: production test, characterization and/or design. 5 FN7906.0 August 30, 2011 ISL32613E, ISL32614E Test Circuits and Waveforms VCC RL/2 DE Z DI VOD D Y RL/2 VOC FIGURE 2. DC DRIVER TEST CIRCUITS VCC DI 50% 50% 0V tSD2 tSD1 DE VCC Z DI VOH OUT (Z) RD D 50% CD 50% VOL OUT (Y) Y tDDHL tDDLH SIGNAL GENERATOR DIFF OUT (Y - Z) 90% 50% 10% tR -VOD tF tDSK = |tDDLH - tDDHL| tSSK = |tSD1(Y) - tSD2(Y)| OR |tSD1(Z) - tSD2(Z)| FIGURE 3A. TEST CIRCUIT +VOD 90% 50% 10% FIGURE 3B. MEASUREMENT POINTS FIGURE 3. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES DE VCC Z DI 500Ω D SIGNAL GENERATOR VCC SW Y DE 50% 50% 0V GND 50pF tZH tHZ OUTPUT HIGH PARAMETER OUTPUT DI SW tHZ Y/Z 1/0 GND tLZ Y/Z 0/1 VCC tZH Y/Z 1/0 GND tZL Y/Z 0/1 FIGURE 4A. TEST CIRCUIT VOH - 0.25V 50% OUT (Y, Z) VOH 0V tZL tLZ VCC OUT (Y, Z) 50% OUTPUT LOW VCC VOL + 0.25V V OL FIGURE 4B. MEASUREMENT POINTS FIGURE 4. DRIVER ENABLE AND DISABLE TIMES 6 FN7906.0 August 30, 2011 ISL32613E, ISL32614E Application Information Driver Features ESD Protection These transmitters are differential output devices that operate with VCC as low as 1.8V, and up to 3.6V. Devices are RS-485 compliant with VCC ≥ 3V, but significant power savings are obtained by operating at VCC = 1.8V. All pins on these devices include class 3 (8kV) Human Body Model (HBM) ESD protection structures, but the driver outputs incorporate advanced structures that allow them to survive ESD events in excess of ±16.5kV HBM and ±7kV to the IEC61000 contact test method. The RS-485 pins are particularly vulnerable to ESD damage because they typically connect to an exposed port on the exterior of the finished product. Simply touching the port pins, or connecting a cable, can cause an ESD event that might destroy unprotected ICs. These new ESD structures protect the device whether it is powered up or not, and without degrading the common mode range. This built-in ESD protection eliminates the need for board-level protection structures (e.g., transient suppression diodes) and the associated, undesirable capacitive load they present. The transmitter outputs are tri-statable via the active high DE input. If the Tx enable function is not needed, tie DE to VCC through a 1kΩ to 2kΩ resistor. Outputs are slew rate limited to minimize EMI, and to reduce reflections in unterminated or improperly terminated networks. 1.8V Operation The ISL32613E and ISL32614E operate with VCC as low as 1.8V. When coupled with the ISL32610E or ISL32611E 1.8V receivers, they provide a differential communication link optimized for very low power, and for slow data rates. Figures 7 and 8 illustrate the static and dynamic power savings from using these transmitters at low supply voltages. With VCC = 1.8V rather than 3.3V, using the ISL32613E at 128kbps reduces the operating supply current from 9.9mA to 56µA (a factor of 177)! 5.5V Tolerant Logic Pins Logic input pins (DI, DE) contain no ESD or parasitic diodes to VCC, so they withstand input voltages exceeding 5.5V, regardless of the VCC voltage. Hot Plug Function When a piece of equipment powers up, there is a period of time during which the processor or ASIC driving the RS-485 control line (DE) is unable to ensure that the RS-485 Tx outputs are kept disabled. If the equipment is connected to the bus, a driver activating prematurely during power-up may crash the bus. To avoid this scenario, these transmitters incorporate a “Hot Plug” function. During power-up, circuitry monitoring VCC ensures that the Tx outputs remain disabled for a period of time, regardless of the state of DE. This gives the processor/ASIC a chance to stabilize and drive the control lines to the proper states. 7 Driver Overload Protection The driver output stages incorporate short-circuit, current-limiting circuitry, which ensures that the output current never exceeds the RS-485 specification over a ±2V (-7V to +12V for VCC ≥ 2.7V) common mode voltage range. In the event of a major short-circuit condition, the device also includes a thermal shutdown feature that disables the drivers whenever the die temperature becomes excessive. This eliminates power dissipation, allowing the die to cool. The drivers automatically re-enable after the die temperature drops by about +20°C. If the condition persists, the thermal shutdown/re-enable cycle repeats until the fault is cleared. Low Power Shutdown Mode This BiCMOS transmitter uses a fraction of the power required by its bipolar counterparts, but it also includes a shutdown feature that reduces the already low quiescent ICC to a 10nA trickle. This device enters shutdown whenever the driver disables (DE = GND). FN7906.0 August 30, 2011 ISL32613E, ISL32614E Typical Performance Curves VCC = 1.8V, TA = +25°C; Unless Otherwise Specified. 60 DE = VCC 16 +25°C 50 +85°C 14 12 40 RD = 120Ω 10 ICC (µA) DRIVER OUTPUT CURRENT (mA) 18 8 30 20 6 4 +125°C +25°C 2 10 RD = 1kΩ 0 -40 0 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 -15 10 FIGURE 5. DRIVER OUTPUT CURRENT vs DIFFERENTIAL OUTPUT VOLTAGE 10m 35 10m 256kbps 128kbps 1m 56kbps ICC (A) 56kbps ICC (A) 110 125 RD = ∞, CD = 50pF 128kbps 9.6kbps 9.6kbps 100µ 100µ 10µ 1.8 85 FIGURE 6. STATIC SUPPLY CURRENT vs TEMPERATURE RD = ∞, CD = 50pF 1m 60 TEMPERATURE (°C) DIFFERENTIAL OUTPUT VOLTAGE (V) 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 10µ 1.8 2 2.2 2.4 VCC (V) FIGURE 7. ISL32613E DYNAMIC SUPPLY CURRENT vs SUPPLY VOLTAGE AT DIFFERENT DATA RATES 2.8 3 3.2 3.4 3.6 FIGURE 8. ISL32614E DYNAMIC SUPPLY CURRENT vs SUPPLY VOLTAGE AT DIFFERENT DATA RATES 100 -40°C 80 OUTPUT CURRENT (mA) 2.6 VCC (V) +25°C 60 +125°C 40 20 Y OR Z = LOW 0 +125°C Y OR Z = HIGH -20 -2.0 -1.5 -1.0 -0.5 0 0.5 OUTPUT VOLTAGE (V) 1.0 -40°C 1.5 2.0 FIGURE 9. DRIVER OUTPUT CURRENT vs SHORT CIRCUIT VOLTAGE 8 FN7906.0 August 30, 2011 ISL32613E, ISL32614E DI 1.5 1.5 1 1 0.5 Y-Z 0 -0.5 -1 -1.5 -0.5 -1 0 DRIVER INPUT (V) 2 DI 1.5 1.5 1 1 0.5 Y-Z 0 -0.5 -1 -1.5 TIME (400ns/DIV) FIGURE 12. ISL32614E DRIVER WAVEFORMS, LOW TO HIGH TIME (1µs/DIV) RD = 10kΩ, CD = 50pF DRIVER OUTPUT (V) DRIVER OUTPUT (V) DI Y-Z 0 FIGURE 11. ISL32614E DRIVER WAVEFORMS, HIGH TO LOW FIGURE 10. ISL32613E DRIVER WAVEFORMS, LOW TO HIGH RD = 10kΩ, CD = 50pF 0 0.5 -1.5 TIME (1µs/DIV) 2 DRIVER INPUT (V) 0 RD = 10kΩ, CD = 50pF DRIVER OUTPUT (V) DRIVER OUTPUT (V) DI 2 2 0 DRIVER INPUT (V) RD = 10kΩ, CD = 50pF VCC = 1.8V, TA = +25°C; Unless Otherwise Specified. (Continued) DRIVER INPUT (V) Typical Performance Curves 0.5 Y-Z 0 -0.5 -1 -1.5 TIME (400ns/DIV) FIGURE 13. ISL32614E DRIVER WAVEFORMS, HIGH TO LOW Die Characteristics SUBSTRATE POTENTIAL (POWERED UP): GND PROCESS: Si Gate BiCMOS 9 FN7906.0 August 30, 2011 ISL32613E, ISL32614E Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you have the latest revision. DATE REVISION August 30, 2011 FN7906.0 CHANGE Initial Release Products Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks. Intersil's product families address power management and analog signal processing functions. Go to www.intersil.com/products for a complete list of Intersil product families. For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device information page on intersil.com: ISL32613E, ISL32614E To report errors or suggestions for this datasheet, please go to: ww‘‘‘‘w.intersil.com/askourstaff FITs are available from our website at: http://rel.intersil.com/reports/search.php For additional products, see www.intersil.com/product_tree Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted in the quality certifications found at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 10 FN7906.0 August 30, 2011 ISL32613E, ISL32614E Package Outline Drawing P6.064 6 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE Rev 4, 2/10 0-8° 1.90 0.95 0.08-0.22 D A 6 5 4 2.80 PIN 1 INDEX AREA 1.60 +0.15/-0.10 3 3 (0.60) 1 2 3 0.20 C 2x 0.40 ±0.10 B SEE DETAIL X 3 0.20 M C A-B D END VIEW TOP VIEW 10° TYP (2 PLCS) 2.90 ±0.10 3 1.15 +0.15/-0.25 C 0.10 C SEATING PLANE 0.00-0.15 SIDE VIEW (0.25) GAUGE PLANE 1.45 MAX DETAIL "X" 0.45±0.1 4 (0.95) (0.60) (1.20) (2.40) NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5M-1994. 3. Dimension is exclusive of mold flash, protrusions or gate burrs. 4. Foot length is measured at reference to gauge plane. 5. Package conforms to JEDEC MO-178AB. TYPICAL RECOMMENDED LAND PATTERN 11 FN7906.0 August 30, 2011