Data Sheet

HITAG µ
ISO 18000 transponder IC
Rev. 3.0 — 18 March 2010
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1. General description
The HITAG product line is well known and established in the contactless identification
market.
Due to the open marketing strategy of NXP Semiconductors there are various
manufacturers well established for both the transponders/cards as well as the read/write
devices. All of them supporting HITAG 1, HITAG 2 and HITAG S transponder ICs.
With the new HITAG µ family, this existing infrastructure is extended with the next
generation of ICs being substantially smaller in mechanical size, lower in cost, offering
more operation distance and speed, but still being operated with the same reader
infrastructure and transponder manufacturing equipment.
The protocol and command structure for HITAG µ ISO 18000 is design to support Reader
Talks First (RTF) operation, including anti-collision algorithm.
2. Features and benefits
2.1 Features
„ Integrated circuit for contactless identification transponders and cards
„ Integrated resonance capacitor of 210 pF with ± 3% tolerance or 280 pF with ± 5%
tolerance over full production
„ Frequency range 100 kHz to 150 kHz
2.2 Protocol
„ Modulation read/write device → transponder: 100 % ASK and binary pulse length
coding
„ Modulation transponder → read/write device: Strong ASK modulation with
anti-collision, Manchester coding
„ Fast anti-collision protocol
„ Data integrity check (CRC)
„ Reader Talks First (RTF) Mode
„ Data rate read/write device to transponder: 5.2 kbit/s
„ Data rates transponder to read/write device: 4 kbit/s
HITAG µ
NXP Semiconductors
ISO 18000 transponder IC
2.3 Memory
„
„
„
„
„
1760 bit
Up to 10 000 erase/write cycles
10 years non-volatile data retention
Memory Lock functionality
32-bit password feature
2.4 Supported standards
„ Full compliant to ISO 18000-2
2.5 Security features
„ 48-bit Unique Item Identification (UII)
2.6 Delivery types
„ Sawn, gold-bumped 8” wafer
„ HVSON2
„ SOT-1122
3. Applications
„ Industrial applications
„ Casino gambling
4. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
HTMS1301FUG/AM
Wafer
sawn, megabumped wafer, 150 µm, 8 inch, UV HITAG μ ISO 18000,
210pF
-
HTMS8301FUG/AM
Wafer
sawn, megabumped wafer, 150 µm, 8 inch, UV HITAG μ ISO 18000,
280pF
-
HTMS1301FTB/AF
XSON3
plastic extremely thin small outline package; no HITAG μ ISO 18000,
leads; 4 terminals; body 1 x 1.45 x 0.5 mm
210pF
SOT1122
HTMS8301FTB/AF
XSON3
plastic extremely thin small outline package; no HITAG μ ISO 18000,
leads; 4 terminals; body 1 x 1.45 x 0.5 mm
280pF
SOT1122
HTMS1301FTK/AF
HVSON2
plastic thermal enhanced very thin small outline HITAG μ ISO 18000,
package; no leads; 2 terminals; body 3 x 2 x
210pF
0.85 mm
SOT899-1
HTMS8301FTK/AF
HVSON2
plastic thermal enhanced very thin small outline HITAG μ ISO 18000,
package; no leads; 2 terminals; body 3 x 2 x
280pF
0.85 mm
SOT899-1
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Type
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ISO 18000 transponder IC
5. Block diagram
The HITAG µ ISO 18000 transponder IC require no external power supply. The
contactless interface generates the power supply and the system clock via the resonant
circuitry by inductive coupling to the read/write device (RWD). The interface also
demodulates data transmitted from the RWD to the HITAG µ ISO 18000 transponder IC,
and modulates the magnetic field for data transmission from the HITAG µ ISO 18000
transponder IC to the RWD.
Data are stored in a non-volatile memory (EEPROM). The EEPROM has a capacity of
1760 bit and is organized in blocks.
ANALOGUE
RF INTERFACE
DIGITAL CONTROL
EEPROM
VREG
PAD
VDD
RECT
ANTICOLLISION
DEMOD
READ/WRITE
CONTROL
data
in
TRANSPONDER
Cres
ACCESS CONTROL
MOD
data
out
EEPROM INTERFACE
CONTROL
R/W
CLK
PAD
clock
RF INTERFACE
CONTROL
SEQUENCER
CHARGE PUMP
001aai334
Fig 1.
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Block diagram of HITAG µ ISO 18000 transponder IC
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ISO 18000 transponder IC
6. Pinning information
(4)
(4)
(3)
(5)
(2)
(1)
(1)
(Y)
LA
LB
(6)
(6)
(X)
001aaj823
Fig 2.
Table 2.
HITAG µ ISO 1800 - Mega bumps bondpad locations
HITAG µ ISO 18000 - Mega bumps dimensions
Description
Dimension
(X) chip size
550 µm
(Y) chip size
550 µm
(1) pad center to chip edge
100.5 µm
(2) pad center to chip edge
48.708 µm
(3) pad center to chip edge
180.5 µm
(4) pad center to chip edge
55.5 µm
(5) pad center to chip edge
48.508 µm
(6) pad center to chip edge
165.5 µm
Bump Size:
LA, LB
294 x 164 µm
Remaining pads
60 x 60 µm
Note: All pads except LA and LB are electrically disconnected after dicing.
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ISO 18000 transponder IC
7. Mechanical specification
7.1 Wafer specification
See Ref. 2 “General specification for 8” wafer on UV-tape with electronic fail die marking”.
7.1.1 Wafer
• Designation:
each wafer is scribed with batch number and
wafer number
•
•
•
•
•
Diameter:
200 mm (8”)
Thickness:
150 μm ± 15 μm
Process:
CMOS 0.14 µm
Batch size:
25 wafers
PGDW:
91981
7.1.2 Wafer backside
• Material:
• Treatment:
• Roughness:
Si
ground and stress release
Ra max. 0.5 μm, Rt max. 5 μm
7.1.3 Chip dimensions
• Die size without scribe:
• Scribe line width:
550 μm x 550 μm = 302500 μm2
X-dimension:
15 μm (scribe line width is measured between
nitride edges)
Y-dimension:
15 μm (scribe line width is measured between
nitride edges)
• Number of pads:
5
7.1.4 Passivation on front
• Type:
• Material:
• Thickness:
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sandwich structure
PE-Nitride (on top)
1.75 μm total thickness of passivation
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ISO 18000 transponder IC
7.1.5 Au bump
•
•
•
•
•
Bump material:
> 99.9% pure Au
Bump hardness:
35 – 80 HV 0.005
Bump shear strength:
> 70 MPa
Bump height:
18 μm
Bump height uniformity:
– within a die:
± 2 μm
– within a wafer:
± 3 μm
– wafer to wafer:
± 4 μm
• Bump flatness:
• Bump size:
± 1.5 μm
– LA, LB
294 x 164 μm
– TEST, GND, VDD
60 x 60 μm
– Bump size variation:
± 5 μm
• Under bump metallization:
sputtered TiW
7.1.6 Fail die identification
No inkdots are applied to the wafer.
Electronic wafer mapping (SECS II format) covers the electrical test results and
additionally the results of mechanical/visual inspection.
See Ref. 2 “General specification for 8” wafer on UV-tape with electronic fail die marking”.
7.1.7 Map file distribution
See Ref. 2 “General specification for 8” wafer on UV-tape with electronic fail die marking”.
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8. Functional description
8.1 Memory organization
The EEPROM has a capacity of 1760 bit and is organized in blocks of 4 bytes each
(1 block = 32 bits). A block is the smallest access unit.
The HITAG µ ISO 18000 transponder IC memory organization is shown in Table 3
“Memory organization”.
For permanent lock of blocks please refer to Section 14.8 “LOCK BLOCK”.
8.1.1 Memory organization
Table 3.
Memory organization
Block address
Content
FFh
User Config
FEh
PWD
Password Access
36h
35h
...
14h
User Memory
13h
12h
bit6=0 bit5=0 R/W[2]
bit6=0 bit5=1 RO[1]
bit6=1 bit5=0 R/W(P)[3]
bit6=1 bit5=1 R/W(P)[3]
11h
10h
0Fh
0Eh
0Dh
0Ch
0Bh
0Ah
09h
User Memory
bit4=0 R/W[2]
bit4=1 RO[1]
08h
07h
06h
05h
04h
03h
02h
bit3=0 R/W[2]
bit3=1 RO[1]
01h
00h
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[1]
RO: Read without password, write with password
[2]
R/W: Read and write without password
[3]
R/W(P): Read and write with password
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ISO 18000 transponder IC
8.2 Memory configuration
The User Configuration Bock consists of one configurable byte (Byte0) and three reserved
bytes (Byte1 to Byte3)
The bits in the User Configuration Block enable a customized memory configuration of the
HITAG µ ISO 18000 transponder ICs.
Three areas (1 to 127bit, 1 to 511 bits and upper memory) can be restricted to read/write
access.
The User Configuration Block (User Config) is programmable by using WRITE SINGLE
BLOCK command at address FFh. Bits 7 to 31 (Byte1 to Byte3) are reserved for further
usage.
The user configuration block (block address FFh) and the password block (block address
FEh) can be locked with the LOCK BLOCK command.
Attention: The lock of the blocks is permanently and therefore irreversible!
Table 4.
User configuration block to Byte0
Byte0
bit6
bit5
[2]
PWD (r/w)
Bit512… Max
bit4
[1]
PWD (w)
Bit512… Max
Description
bit3
[1]
PWD (w)
Bit128… 511
[1]
PWD (w)
Bit0… 127
bit2
bit1
bit 0
RFU
RFU
RFU
Bit-no.
Value/meaning
[1]
PWD(w)=1: read without password and write with password
[2]
PWD(r/w)=1: read and write with password
9. General requirements
The HITAG μ ISO 18000 transponder IC is compatible with the ISO 18000-2 standard.
At the time a HITAG μ ISO 18000 based transponder is in the interrogator field it doesn’t
respond until it receives a request from the RWD.
All communication from reader to HITAG µ ISO 18000 transponder ICs and vice versa and
the CRC error detection bits (if applicable) are transmitted starting with LSB first.
In the case that multiple HITAG µ ISO 18000 based transponders are in the interrogation
field which cause collisions the RWD has to start the anticollision procedure as described
in this document.
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ISO 18000 transponder IC
10. HITAG μ ISO 18000 transponder IC air interface
10.1 Downlink communication signal interface - RWD to HITAG μ
ISO 18000 transponder IC
10.1.1 Modulation parameters
Communications between RWD and HITAG µ ISO 18000 transponder IC takes place
using ASK modulation with a modulation index of m > 90%.
TF1
TF2
TF3
y
a
x
b
envelope of transceiver field
Fig 3.
Table 5.
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001aaj826
Modulation details of data transmission from RWD to HITAG µ transponder IC
Modulation coding times[1][2]
Symbol
Min
Max
m = (a-b)/(a+b)
90%
100%
TF1
4 × Tc
10 × Tc
TF2
0
0.5 × TF1
TF3
0
0.5 × TFd0
x
0
0.05 × a
y
0
0.05 × a
[1]
TFd0 > TF1 + TF3 + 3 × Tc
[2]
TC...Carrier period time (1/125kHz = 8 μs nominal)
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ISO 18000 transponder IC
10.1.2 Data rate and data coding
The RWD to HITAG µ ISO 18000 transponder IC communication uses Pulse Interval
Encoding. The RWD creates pulses by switching the carrier off as described in Figure 4.
The time between the falling edges of the pulses determines either the value of the data
bit ’0’, the data bit ’1’, a code violation or a stop condition.
data "0''
TFd0
TF1
TF1
carrier on
carrier off
data "1''
TFd1
TF1
TF1
carrier on
carrier off
"code violation''
TFcv
TF1
TF1
carrier on
carrier off
"stop condition''
TFsc
TF1
carrier on
carrier off
001aaj827
Fig 4.
Reader to HITAG µ ISO 18000 transponder IC: Pulse Interval Encoding
Assuming equal distributed data bits ’0’ and ’1’, the data rate is in the range of about
5.2 kbit/s.
Table 6.
Meaning
Symbol
Min
Max
Carrier off time
TF1
4 × Tc
10 × Tc
Data “0” time
TFd0
18 × Tc
22 × Tc
Data “1” time
TFd1
26 × Tc
30 × Tc
Code violation time
TFcv
34 × Tc
38 × Tc
Stop condition time
TFsc
≥ 42 × Tc
n/a
[1]
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Data coding times [1]
TC...Carrier period time (1/125kHz = 8 μs nominal)
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ISO 18000 transponder IC
10.1.3 RWD - Start of frame pattern
A RWD request always starts with a SOF pattern for ease of synchronization. The SOF
pattern consists of an encoded data bit ’0’ and a ’code violation’.
data "0"
"code violation"
TFcv
TFd0
TF1
TF1
TF1
carrier on
carrier off
TFpSOF
001aaj828
Fig 5.
Start of frame pattern
The HITAG µ ISO 18000 transponder IC shall be ready to receive a SOF from the RWD
within 1.2 ms after having sent a response to the RWD.
The HITAG µ ISO 18000 transponder IC shall be ready to receive a SOF from the RWD
within 2.5 ms after the RWD has established the powering field.
10.1.4 RWD - End of frame pattern
For slot switching during a multi-slot anticollision sequence, the RWD request is an EOF
pattern. The EOF pattern is represented by a RWD ’Stop condition’.
"stop condition''
TFsc
TF1
carrier on
carrier off
TFpEOF
001aaj829
Fig 6.
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End of frame pattern
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ISO 18000 transponder IC
10.2 Communication signal interface - HITAG µ ISO 18000 transponder IC
to RWD
10.2.1 Data rate and data coding
The HITAG µ ISO 18000 transponder IC accepts the following data rate and encoding
scheme:
• 1/TFd Manchester coded data signal on the response to the HITAG µ ISO 18000
transponder IC
• 1/(2 ×TFd) dual pattern data coding when responding within the inventory process
TFd = 32 / fc = 32 × Tc
Remark: The slower data rate used during the inventory process allows for improving the
collision detection when several HITAG µ ISO 18000 transponder ICs are present in the
RWD field, especially if some transponder ICs are in the near field and others in the far
field.
data
element
response encoding in
INVENTORY mode
response encoding to a RWD
request in data exchange mode
TFd
data "0"
load off
load off
load on
load on
TFd
data "1"
load off
load off
load on
load on
TFd
TFd
TFd
TFd
001aaj830
Fig 7.
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HITAG µ ISO 18000 transponder IC - Load modulation coding
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ISO 18000 transponder IC
10.2.2 Start of frame pattern
The HITAG µ ISO 18000 transponder IC response always starts with a SOF pattern. The
SOF is a Manchester encoded bit sequence of ’110’.
data "1"
data "1"
data "0"
TFd
TFd
TFd
load off
load on
001aaj832
Fig 8.
Start of fame pattern
10.2.3 End of frame pattern
A specific EOF pattern is neither used nor specified for the HITAG µ ISO 18000
transponder IC response. An EOF is detected by the RWD if there is no load modulation
for more than two data bit periods (TFd).
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ISO 18000 transponder IC
11. General protocol timing specification
For requests where an EEPROM erase and/or programming operation is required, the
transponder IC returns its response when it has completed the write/lock operation. This
will be latest after 20 ms upon detection of the last falling edge of the RWD request or
after the RWD has switched off the field.
11.1 Waiting time before transmitting a response after an EOF from the
RWD
When the HITAG µ ISO 18000 transponder IC has detected an EOF of a valid RWD
request or when this EOF is in the normal sequence of a valid RWD request, it shall wait
for TFp1 before starting to transmit its response to a RWD request or when switching to the
next slot in an inventory process.
TFp1 starts from the detection of the falling edge of the EOF received from the RWD.
Remark: The synchronization on the falling edge from the RWD to the EOF of the HITAG
µ ISO 18000 transponder IC is necessary to ensure the required synchronization of the
response.
carrier on
request
request (or EOF)
transceiver
carrier off
TFp1
HITAG μ
Fig 9.
TNRT
TFp2
load off
load on
response
001aaj833
General protocol timing diagram
The minimum value of TFp1 is TFp1min = 204 × TC
The typical value of TFp1 is TFp1typ = 209 × TC
The maximum value of TFp1 is TFp1max = 213 × TC
If the HITAG µ ISO 18000 transponder IC detects a carrier modulation during this time
(TFp1), it shall reset its TFp1-timer and wait for a further time (TFp1) before starting to
transmit its response to a RWD request or to switch to the next slot when in an inventory
process.
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ISO 18000 transponder IC
11.2 RWD waiting time before sending a subsequent request
• When the RWD has received a HITAG µ ISO 18000 response to a previous request
other than inventory or quiet, it needs to wait TFp2 before sending a subsequent
request. TFp2 starts from the time the last bit has been received from the HITAG µ
ISO 18000.
• When the RWD has sent a quiet request, it needs to wait TFp2 before sending a
subsequent request. TFp2 starts from the end of the quiet request's EOF (falling edge
of EOF pulse + 42 × TC). This results in a waiting time of (150 × TC + 42 × TC) before
the next request.
The minimum value of TFp2 is TFp2min = 150 × TC ensures that the HITAG µ ISO 18000 ICs
are ready to receive a subsequent request.
Remark: The RWD needs to wait at least 2.5 ms after it has activated the electromagnetic
field before sending the first request, to ensure that the HITAG µ ISO 18000 transponder
ICs are ready to receive a request.
• When the RWD has sent an inventory request, it is in an inventory process.
11.3 RWD waiting time before switching to next inventory slot
An inventory process is started when the RWD sends an inventory request. For a detailed
explanation of the inventory process refer to Section 14.3 and Section 14.4.
To switch to the next slot, the RWD sends an EOF after waiting a time period specified in
the following sub-clauses.
11.3.1 RWD started to receive one or more HITAG µ ISO 18000 transponder IC
responses
During an inventory process, when the RWD has started to receive one or more HITAG µ
a ISO 18000 transponder IC responses (i.e. it has detected a transponder IC SOF and/or
a collision), it shall
• wait for the complete reception of the HITAG µ ISO 18000 transponder IC responses
(i.e. when a last bit has been received or when the nominal response time TNRT has
elapsed),
• wait an additional time TFp2 and then send an EOF to switch to the next slot, if a 16
slot anticollision request is processed, or send a subsequent request (which could be
again an inventory request).
TFp2 starts from the time the last bit has been received from the HITAG µ ISO 18000
transponder IC.
The minimum value of TFp2 is TFp2min = 150 × TC.
TNRT is dependant on the anticollisions current mask value and on the setting of the CRCT
flag.
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11.3.2 RWD receives no HITAG µ ISO 18000 transponder IC response
During an inventory process, when the RWD has received no HITAG µ ISO 18000
transponder IC response, it needs to wait TFp3 before sending a subsequent EOF to
switch to the next slot, if a 16 slot anticollision request is processed, or sending a
subsequent request (which could be again an inventory request).
TFp3 starts from the time the RWD has generated the falling edge of the last sent EOF.
The minimum value of TFp3 is TFp3min = TFp1max + TFpSOF.
TFpSOF is the time duration for a HITAG µ ISO 18000 transponder IC to transmit an SOF to
the RWD.
request
request (or EOF)
carrier on
reader
carrier off
TFp1MAX
HITAG μ
TFpSOF
TFp3
load off
load on
no response
001aaj834
Fig 10. Protocol timing diagram without HITAG µ ISO 18000 transponder IC response
Table 7.
Symbol
Min
Max
TFpSOF
3 × TFd
3 × TFd
TFp1
204 × TC
213 × TC
TFp2
150 × TC
-
TFp3
TFp1max + TFpSOF
-
[1]
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Overview timing parameters [1]
TC...Carrier period time (1/125kHz = 8 μs nominal)
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ISO 18000 transponder IC
12. State diagram
12.1 General description of states
RF Off
The powering magnetic field is switched off or the HITAG µ ISO 18000 transponder IC is
out of the field.
READY
The HITAG µ ISO 18000 transponder IC enters this state when it is activated by the RWD.
SELECTED
The HITAG µ ISO 18000 transponder IC enters the Selected state after receiving the
SELECT command with a matching UII. In the Selected state the respective commands
with SEL=1 are valid only for selected transponder.
Only one HITAG µ transponder IC should be in the selected state at one time. If one
transponder is selected and a second transponder receives the SELECT Command, the
first transponder will automatically change to Quiet state.
QUIET
The HITAG µ ISO 18000 transponder IC enters this state after receiving a STAY QUIET
command or when he was in selected state and receives a SELECT command addressed
to another transponder.
In this state, the HITAG µ transponder IC reacts to any request commandos where the
ADR flag is set.
Remark:
In case of an invalid command the transponder will remain in his actual state.
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12.2 State diagram HITAG µ ISO 18000
RF Off
RF on
out of field
or RF off
out of field
or RF off
out of field
or RF off
„read UII“ or
any other request
with SEL flag not set
Anticollision
„INVENTORY“
„READ MULTIPLE BLOCK
in inventory mode“
READY
„STAY QUIET“
(UII)
„SELECT“ (UII)
„SELECT“ (UII)
QUIET
any other request
with ADR flag set
SELECTED
„STAY QUIET“ or
„SELECT“ (non-matching-UII)
any other request
with ADR flag set or
SEL flag set
Fig 11. State diagram of HITAG µ ISO18000 transponder ICs
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ISO 18000 transponder IC
13. Modes
13.1 Anticollision
The RWD is the master of the communication with one or multiple transponder ICs. It
starts the anticollision sequence by issuing the inventory request (see Section 14.3).
Within the RWD command the NOS flag must be set to the desired setting (1 or 16 slots)
and add the mask length and the mask value after the command field.
The mask length n indicates the number of significant bits of the mask value. It can have
any value between 0 and 44 when 16 slots are used and any value between 0 and 48
when 1 slot is used.
The next two subsections summarize the actions done by the transponder IC during an
inventory round.
13.1.1 Anticollision with 1 slot
The transponder IC will receive one ore more inventory commands with NOS = '1'. Every
time the transponder ICs fractional or whole UII matches the mask value of RWD's
request it responses with remaining UII without mask value.
Transponder ICs responses are modulated by dual pattern data coding as described in
Section 10.2.
13.1.2 Anticollision with 16 slots
The transponder IC will receive several inventory commands with NOS = '0' defining an
amount of 16 slots. Within the request there is the mask specified by length and value
(sent LSB first).
In case of mask length = '0' the four least significant bits of transponder ICs UII become
the starting value of transponder IC's slot counter.
In case of mask length ≠ '0' the received fractional mask is compared to transponder IC's
UII. If it matches the starting value for transponder IC's slot number will be calculated.
Starting at last significant bit of the sent mask the next four less significant bits of UII are
used for this value. At the same time transponder IC's slot counter is reset to '0'.
Now the RWD begins its anticollision algorithm. Every time the transponder IC receives an
EOF it increments slot-counter. Now if mask value and slot-counter value are matching
the transponder IC responses with the remaining UII without mask value but with slot
number
In case of collision within one slot the RWD changes the mask value and starts again
running its algorithm.
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ISO 18000 transponder IC
14. Command set
The first part of this section (Section 14.1) describes the flags used in every RWD
command. The following subsections (Section 14.3 until Section 14.11) explain all
implemented commands and their suitable transponder IC responses which are done with
tables showing the command itself and suitable responses.
Within tables flags, parameter bits and parts of a response written in braces are optional.
That means if the suitable flag is set resulting transponder IC's action will be performed
according to Section 14.1.
Every command is embedded in SOF and EOF pattern. As described in Table 8 and
Table 9 sending and receiving data is done with the least significant bit of every field on
first position.
Important information:
In this document the fields (i.e. command codes) are written with most significant
bit first.
Reader - Transponder IC transmission [1][2]
Table 8.
SOF
Flags
Commands
Parameters
Data
CRC-16
EOF
-
5
6
var.
var.
(16)
-
-
LSB ... MSB
LSB ... MSB
LSB ... MSB
LSB ... MSB
LSB ... MSB
-
[1]
Values in braces are optional.
[2]
Data is sent with least significant bit first.
Table 9.
SOF
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Transponder IC - Reader transmission [1][2]
Error flag
Data/Error code
CRC-16
EOF
-
1
var.
(16)
-
-
-
LSB ... MSB
LSB ... MSB
-
[1]
Values in braces are optional.
[2]
Data is sent with least significant bit first.
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ISO 18000 transponder IC
14.1 Flags
Every request command contains five flags which are sent in order Bit 1 (LSB) to Bit 5
(MSB). The specific meaning depends on the context.
Table 10.
Command Flags
Bit Flag
Full name
Value Description
1
Protocol EXTension
0
No protocol format extension
1
RFU
2
3
PEXT
INV
INVentory
CRCT
Flag 4 and Flag 5 are ’RFU’ and ’NOS’ Flag
0
Transponder IC respond without CRC
1
Transponder IC respond contains CRC
SEL
SELect
(INV==0)
in combination with ADR (see Table 12)
5
ADR
ADdRess
(INV==0)
in combination with SEL (see Table 12)
4
AFI
Reserved for future
(INV==1) use
0
1
AFI field is not present
AFI field is present
5
NOS
(INV==1)
0
16 slots while performing anti-collision
1
1 slot while performing anti-collision
Command Flags - Bit order
MSB
bit5
bit4
bit3
bit2
LSB
bit1
INV==0
ADR
SEL
CRCT
INV
PEXT
INV==1
NOS
AFI
CRCT
INV
PEXT
Table 12.
Product data sheet
PUBLIC
Flag 4 and Flag 5 are ’SEL’ and ’ADR’ Flag
4
Table 11.
184430
CRC-Transponder
0
1
Meaning of ADR and SEL flag
ADR
SEL
Meaning
0
0
Request without UII, all transponder ICs in READY state shall respond
1
0
Request contains UII, one transponder IC (with corresponding UII) shall
respond
0
1
Request without UII, the transponder IC in SELECTED state shall respond
1
1
Reserved for future use
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ISO 18000 transponder IC
14.2 Error handling
In case an error has been occurred the transponder IC responses with the set error flag
and the three bit code ’111’ (meaning ’unknown error’).
The general response format in case of an error response is shown in Table 13 whereas
commands not supporting error responses are excluded. In case of an unsupported
command there will be no response. The format is embedded into SOF and EOF.
Table 13.
Response format in error case
Error flag
Error code
CRC-16
Description
1
3
(16)
No. of bits
1
111
SOF
Error Flag
''0''
Data
(CRC)
EOF
001aak260
Fig 12. HITAG µ ISO 18000 transponder IC response - in case of no error
SOF
Error Flag
''1''
Error Code
''111''
(CRC)
EOF
001aak262
Fig 13. HITAG µ ISO 18000 transponder IC response - in error case
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ISO 18000 transponder IC
14.3 INVENTORY
Upon reception of this command without error, all transponder ICs in the ready state shall
perform the anticollision sequence. The inventory (INV) flag shall be set to '1'. The NOS
flag determines whether 1 or 16 slots are used.
If AFI flag is set to ’1’ the transponder handles the request as error.
If a transponder IC detects any error, it shall remain silent.
Table 14.
INVENTORY - Request format (00h)
Flags
Command
Mask length
Mask value
CRC-16
Description
5
6
6
n
(16)
No. of bits
10(1)10
000000
0 ≤ n ≤ UII length
UII Mask
AC with 1
timeslot
00(1)10
000000
0 ≤ n ≤ UII length
UII Mask
AC with 16
timeslot
Table 15.
Response to a successful INVENTORY request [1][2]
Error Flag
Data
CRC-16
Description
1
48 - n
(16)
No. of bits
0
Remaining UII without mask value
[1]
Error and CRC are Manchester coded, UII is dual pattern coded.
[2]
Response within the according time slot.
Error Flag set to ’0’ indicates no error.
14.4 STAY QUIET
Upon reception of this command without error, a transponder IC in either ready state or
selected state enters the quiet state and shall not send back a response.
The STAY QUIET command with both SEL and ADR flag set to '0' or both set to '1' is not
allowed.
There is no response to the STAY QUIET request, even if the transponder detects an
error.
Table 16.
Flags
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STAY QUIET - request format(01h)
Command
Data
CRC-16
(16)
Description
5
6
(48)
01(1)00
000001
-
without UII
10(1)00
000001
UII
with UII
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ISO 18000 transponder IC
14.5 READ UII
Upon reception of this command without error all transponder ICs in the ready state are
sending their UII.
The addressed (ADR), the select (SEL), the inventory (INV) and the (PEXT) flag are set to
'0'.
Table 17.
READ UII - request format (02h)
Flags
Command
CRC-16
Description
5
6
(16)
No. of bits
00(1)00
000010
Table 18.
Response to a successful READ UII request
Error flag
Data
CRC-16
Description
1
48
(16)
No. of bits
0
UII
Error flag set to ’0’ indicates no error.
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ISO 18000 transponder IC
14.6 READ MULTIPLE BLOCK
Upon reception of this command without error, the transponder reads the requested
block(s) and sends back their value in the response. The blocks are numbered from 0 to
255.
The number of blocks in the request is one less than the number of blocks that the
transponder returns in its response i.e. a value of '6' in the ’Number of blocks’ field
requests to read 7 blocks. A value '0' requests to read a single block.
Table 19.
READ MULTIPLE BLOCKS - request format (12h)
Flags
Command
Data 1
Data 2
Data 3
CRC-16
Description
5
6
(48)
8
8
(16)
No. of bits
00(1)00
010010
-
First block
number
Number of
blocks
without UII
in READY
state
10(1)00
010010
UII
First block
number
Number of
blocks
with UII
01(1)00
010010
-
First block
number
Number of
blocks
without UII
in
SELECTED
state
Table 20.
Response to a successful READ MULTIPLE BLOCKS request
Error Flag
Data
CRC-16
Description
1
32 x Number of blocks
(16)
No. of bits
0
User memory block data
Error Flag set to ’0’ indicates no error.
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ISO 18000 transponder IC
14.6.1 READ MULTIPLE BLOCKS in INVENTORY mode
The READ MULTIPLE BLOCK command can also be sent in inventory mode (which is
marked by INV-Flag = '1' within the request). Here request and response will change as
shown in following tables.
If the transponder detects an error during the inventory sequence, it shall remain silent.
Table 21.
READ MULTIPLE BLOCKS - request format (12h)
Flags
Command Mask
length
Mask
value
Parameter 1 Parameter 2 CRC-16 Description
5
6
n
8
8
6
(16)
No. of bits
10(1)10 010010
0 ≤ n ≤ UID
length
First block
number
Number of
blocks
AC with 1
timeslot
00(1)10 010010
0 ≤ n ≤ UID
length
First block
number
Number of
blocks
AC with 16
timeslot
After receiving RWD's command without error the transponder IC transmits the remaining
section of the UID in dual pattern code. The following data (Error Flag, Data 2, optional
CRC in no error case; Error Flag, Error Code, optional CRC in error case) is transmitted in
Manchester Code.
Table 22.
Error Flag Data 1
Data 2
CRC-16 Description
1
48 - n
32 x number of blocks
(16)
0
Remaining section of UID
(without mask value)
User memory block data
[1]
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READ MULTIPLE BLOCKS in INVENTORY mode Response format [1]
No.of bits
Error, CRC and Data are Manchester coded, UID is dual pattern coded.
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ISO 18000 transponder IC
14.7 WRITE SINGLE BLOCK
Upon reception of this command without error, the transponder IC writes 32-bit of data into
the requested user memory block and report the success of the operation in the response.
Table 23.
WRITE SINGLE BLOCK - request format (14h)
Flags
Command
Data 1
Data 2
Data 3
CRC-16
Description
5
6
(48)
8
32
(16)
No. of bits
00(1)00
010100
-
block number block data
without UII
in READY
state
10(1)00
010100
UII
block number block data
with UII
01(1)00
010100
-
block number block data
without UII
in
SELECTED
state
Table 24.
Response to a successful WRITE SINGLE BLOCK request
Error Flag
CRC-16
Description
1
(16)
No. of bits
0
Error Flag set to ’0’ indicates no error.
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ISO 18000 transponder IC
14.8 LOCK BLOCK
Upon reception of this command without error, the transponder IC is write locking the
requested block (block size = 32-bit) permanently.
Blocks within the block address range from 00h to 18h as well as FEh and FFh can be
locked individually.
A LOCK BLOCK command with a block number value between 19h to 36h will lock all
blocks within the block address range 19h to 36h.
In case a password is applied to the memory a lock is only possible after a successful
login.
Table 25.
LOCK BLOCK - request format (16h)
Flags
Command
Data 1
Data 2
CRC-16
Description
5
6
(48)
8
(16)
No. of bits
00(1)00
010110
-
block number
without UII
in READY
state
10(1)00
010110
UII
block number
with UII
01(1)00
010110
-
block number
without UII
in
SELECTED
state
Table 26.
Response to a successful LOCK BLOCK request
Error flag
CRC-16
Description
1
(16)
No. of bits
0
Error Flag set to ’0’ indicates no error.
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ISO 18000 transponder IC
14.9 SELECT
The SELECT command is always be executed with SEL flag set to '0' and ADR flag set to
'1'. There are several possibilities upon reception of this command without error:
• If the UII, received by the transponder IC, is equal to its own UII, the transponder IC
enters the Selected state and shall send a response.
• If the received UII is different there are two possibilities
– A transponder IC in a non-selected state (QUIET or READY) is keeping its state
and not sending a response.
– The transponder IC in the Selected state enters the Quiet state and does not send
a response.
Table 27.
Flags
SELECT - request format (18h)
Command
Data 1
CRC-16
Description
5
6
48
(16)
No. of bits
10(1)00
011000
UII
Error flag
CRC-16
Description
1
(16-bit)
No. of bits
Table 28.
Response to a successful SELECT request
0
Error Flag set to ’0’ indicates no error.
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ISO 18000 transponder IC
14.10 GET SYSTEM INFORMATION
Upon reception of this command without error, the transponder IC reads the requested
system memory block(s) and sends back their values in the response.
Table 29.
GET SYSTEM INFORMATION - request format (17h)
Flags
Command
Data 1
CRC-16
Description
5
6
(48)
(16)
No. of bits
00(1)00
010111
10(1)00
010111
Table 30.
UII
with UII
GET SYSTEM INFORMATION - response format
Error
flag
Data
1
40
0
without UII
8
8
8
8
8
8
8
8
0
0
CRC-16
Description
(16)
No. of bits
system memory block data
MSN MFC ICR 0
0
0
0
Error Flag set to ’0’ indicates no error.
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ISO 18000 transponder IC
14.11 LOGIN
Upon reception of this command without error, the transponder IC compares received
password with PWD in memory block (FEh) and if correct it permits write (opt. read)
access to the protected memory area (defined in User config, see Table 4) and reports the
success of the operation in the response. In case a wrong password is issued in a further
login request no access to protected memory blocks will be granted.
Default password: FFFFFFFFh
Table 31.
LOGIN - request format
Flags
Command
IC MFC
Parameter 1
Password
CRC-16
Description
5
6
8
(48)
32
(16)
No. of bits
00(1)00
101000
MFC
-
password
without UII in
READY state
10(1)00
101000
MFC
UII
password
with UII
01(1)00
101000
MFC
-
password
without UII in
SELECTED
state
Table 32.
Response to a successful LOGIN request
Error flag
CRC-16
Description
1
(16)
No. of bits
0
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ISO 18000 transponder IC
15. Data integrity/calculation of CRC
The following explanations show the features of the HITAG µ protocol to protect read and
write access to transponders from undetected errors. The CRC is an 16-bit CRC
according to ISO 11784/11785.
15.1 Data transmission: RWD to HITAG µ ISO 18000 transponder IC
Data stream transmitted by the RWD to the HITAG µ ISO 18000 transponder may include
an optional 16-bit Cyclic Redundancy Check (CRC-16).
The data stream is first verified for data errors by the HITAG µ ISO 18000 transponder IC
and then executed.
The generator polynomial for the CRC-16 is:
u16 + u12 + u5+ 1 = 1021h
The CRC pre set value is: 0000h
15.2 Data transmission: HITAG µ ISO 18000 transponder IC to RWD
The HITAG µ ISO 18000 transponder IC calculates the CRC on all received bits of the
request. Whether the HITAG µ ISO 18000 transponder IC calculated CRC is appended to
the response depends on the setting of the CRCT flag.
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ISO 18000 transponder IC
16. Limiting values
Table 33. Limiting values[1][2]
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
Tstg
storage temperature
−55
+125
°C
VESD
electrostatic discharge voltage
JEDEC JESD 22-A114-AB
Human Body Model
±2
-
kV
Ii(max)
maximum input current
IN1-IN2
−
±20
mApeak
Tj
junction temperature
−40
+85
°C
[1]
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any conditions other than those described in the Operating Conditions and Electrical
Characteristics section of this specification is not implied.
[2]
This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static
charge. Nonetheless, it is suggested that conventional precautions should be taken to avoid applying values greater than the rated
maxima
17. Characteristics
Table 34.
Characteristics
Symbol
Parameter
Conditions
foper
operating frequency
VIN1-IN2
input voltage
II
input current
IN1-IN2
Ci
input capacitance between
IN1-IN2
VIN1-IN2 = 0.5 Vrms
Ci
input capacitance between
IN1-IN2
VIN1-IN2 = 0.5 Vrms
Min
Typ
Max
Unit
100
125
150
kHz
4
5
6
Vpeak
-
-
±10
mApeak
[2][3]
203.7
210
216.3
pF
[2][4]
266
280
294
pF
[1]
Typical ratings are not guaranteed. Values are at 25 °C.
[2]
Measured with an HP4285A LCR meter at 125 kHz/room temperature (25 °C)
[3]
Integrated Resonance Capacitor: 210pF ±3%
[4]
Integrated Resonance Capacitor: 280pF ±5%
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ISO 18000 transponder IC
18. Marking
18.1 Marking SOT1122
Table 35.
Marking SOT1122
Type
Type code
HTMS1301FTB/AF
13
HTMS8301FTB/AF
83
Table 36.
Pin description SOT1122
Pin
Description
1
IN 1
2
IN 2
3
n.c not connected
18.2 Marking HVSON2
Only two lines are available for marking (Figure 14).
A:5
B: 4
0
3
Fig 14. Marking overview
First line consists on five digits and contains the diffusion lot number. Second line consists
on four digits and describes the product type, HTSH5601ETK or HTSH4801ETK (see
example in Table 37).
Table 37.
Marking example
Line
Marking
A
70960
5 digits, Diffusion Lot Number, First letter truncated
B
HM10
4 digits, Type: Table 38 “Marking HVSON2”
Table 38.
Description
Marking HVSON2
Type
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Type code
HTMS1301FTK/AF
HM13
HTMS8301FTK/AF
HM82
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ISO 18000 transponder IC
19. Package outline
b
b1
1
4×
(2)
L1
3
L
e
2
e1
e1
4×
A
(2)
A1
D
type code
E
terminal 1
index area
pin 1 indication
0
1
scale
mensions
Unit
m
2 mm
A(1)
max 0.50
nom
min
A1
b
b1
D
E
0.04
0.45
0.40
0.37
0.55
0.50
0.47
1.50
1.45
1.40
1.05
1.00
0.95
e
e1
L
0.35
0.55 0.425 0.30
0.27
L1
0.30
0.25
0.22
tes
Dimension A is including plating thickness.
Can be visible in some manufacturing processes.
Outline
version
sot1122
References
IEC
JEDEC
JEITA
European
projection
Issue date
Fig 15. Package outline SOT1122
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ISO 18000 transponder IC
HVSON2: plastic thermal enhanced very thin small outline package; no leads;
2 terminals; body 3 × 2 × 0.85 mm
D
SOT899-1
A
B
A
E
A1
detail X
terminal 1
index area
C
∅v
∅w
b
terminal 1
index area
M
M
y
y1 C
C A B
C
1
L
e
Eh
2
X
Dh
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max
A1
b
D
Dh
E
Eh
e
L
v
w
y
y1
mm
1
0.05
0
0.9
0.7
2.1
1.9
1.35
1.05
3.1
2.9
1.35
1.05
2.5
0.5
0.3
0.1
0.05
0.05
0.1
Note
1. Plastic or metal protrusions of 0.75 mm maximum per side are not included
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
05-02-25
05-05-09
SOT899-1
Fig 16. Package outline HVSON2
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HITAG µ
NXP Semiconductors
ISO 18000 transponder IC
20. Abbreviations
Table 39.
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Abbreviations
Abbreviation
Definition
AC
Anticollision Code
AFI
Application Family Identifier
ASK
Amplitude Shift Keying
BC
Bi-phase Code
BPLC
Binary Pulse Length Coding
CRC
Cyclic Redundancy Check
DSFID
Data Storage Format Identifier
EEPROM
Electrically Erasable Programmable Memory
EOF
End Of Frame
ICR
Integrated Circuit Reference number
LSB
Least Significant Bit
LSByte
Least Significant Byte
m
Modulation Index
MC
Manchester Code
MFC
integrated circuit Manufacturer Code
MSB
Most Significant Bit
MSByte
Most Significant Byte
MSN
Manufacturer Serial Number
NA
No Access
NOB
Number Of Block
NOP
Number Of Pages
NOS
Number Of Slots
NSS
Number Of Sensors
OTP
One Time Programmable
PID
Product Identifier
PWD
Password
RFU
Reserved for Future Use
RND
Random Number
RO
Read Only
RTF
Reader Talks First
R/W
Read/Write
RWD
Read/Write Device
SOF
Start of Frame
UII
Unique Item Identifier
All information provided in this document is subject to legal disclaimers.
Rev. 3.0 — 18 March 2010
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HITAG µ
NXP Semiconductors
ISO 18000 transponder IC
21. References
1.
[1]
Application note — AN10214, HITAG Coil Design Guide, Transponder IC
BL-ID Doc.No.: 0814**1
[2]
General specification for 8” wafer on UV-tape with electronic fail die
marking — Delivery type description, BL-ID Doc.No.: 1093**1
** ... document version number
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NXP Semiconductors
ISO 18000 transponder IC
22. Revision history
Table 40:
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
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Product data sheet
-
-
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NXP Semiconductors
ISO 18000 transponder IC
23. Legal information
23.1 Data sheet status
Document status[1][2]
Product status[3]
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
Definition
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
23.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
23.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
184430
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malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on a weakness or default in the
customer application/use or the application/use of customer’s third party
customer(s) (hereinafter both referred to as “Application”). It is customer’s
sole responsibility to check whether the NXP Semiconductors product is
suitable and fit for the Application planned. Customer has to do all necessary
testing for the Application in order to avoid a default of the Application and the
product. NXP Semiconductors does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
All information provided in this document is subject to legal disclaimers.
Rev. 3.0 — 18 March 2010
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NXP Semiconductors
ISO 18000 transponder IC
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
23.4 Licenses
ICs with HITAG functionality
NXP Semiconductors owns a worldwide perpetual license for the patents
US 5214409, US 5499017, US 5235326 and for any foreign counterparts
or equivalents of these patents. The license is granted for the Field-of-Use
covering: (a) all non-animal applications, and (b) any application for animals
raised for human consumption (including but not limited to dairy animals),
including without limitation livestock and fish.
Please note that the license does not include rights outside the specified
Field-of-Use, and that NXP Semiconductors does not provide indemnity for
the foregoing patents outside the Field-of-Use.
23.5 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
HITAG — is a trademark of NXP B.V.
24. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
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NXP Semiconductors
ISO 18000 transponder IC
25. Tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Ordering information . . . . . . . . . . . . . . . . . . . . . .2
HITAG µ ISO 18000 - Mega bumps dimensions.4
Memory organization . . . . . . . . . . . . . . . . . . . . .7
User configuration block to Byte0 . . . . . . . . . . . .8
Modulation coding times[1][2] . . . . . . . . . . . . . . . .9
Data coding times [1] . . . . . . . . . . . . . . . . . . . . .10
Overview timing parameters [1] . . . . . . . . . . . . .16
Reader - Transponder IC transmission [1][2] . . .20
Transponder IC - Reader transmission [1][2] . . .20
Command Flags . . . . . . . . . . . . . . . . . . . . . . . .21
Command Flags - Bit order. . . . . . . . . . . . . . . .21
Meaning of ADR and SEL flag . . . . . . . . . . . . .21
Response format in error case . . . . . . . . . . . . .22
INVENTORY - Request format (00h) . . . . . . . .23
Response to a successful INVENTORY request
[1][2] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
STAY QUIET - request format(01h) . . . . . . . . .23
READ UII - request format (02h) . . . . . . . . . . .24
Response to a successful READ UII request .24
READ MULTIPLE BLOCKS - request format
(12h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
Response to a successful READ MULTIPLE
BLOCKS request . . . . . . . . . . . . . . . . . . . . . . .25
READ MULTIPLE BLOCKS - request format
(12h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
Table 22. READ MULTIPLE BLOCKS in INVENTORY mode
Response format [1] . . . . . . . . . . . . . . . . . . . . . 26
Table 23. WRITE SINGLE BLOCK - request format
(14h). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 24. Response to a successful WRITE SINGLE
BLOCK request . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 25. LOCK BLOCK - request format (16h) . . . . . . . 28
Table 26. Response to a successful LOCK BLOCK
request . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 27. SELECT - request format (18h) . . . . . . . . . . . . 29
Table 28. Response to a successful SELECT request . . 29
Table 29. GET SYSTEM INFORMATION - request format
(17h). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 30. GET SYSTEM INFORMATION - response
format. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 31. LOGIN - request format . . . . . . . . . . . . . . . . . . 31
Table 32. Response to a successful LOGIN request. . . . 31
Table 33. Limiting values[1][2] . . . . . . . . . . . . . . . . . . . . . . 33
Table 34. Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 33
Table 35. Marking SOT1122 . . . . . . . . . . . . . . . . . . . . . . 34
Table 36. Pin description SOT1122 . . . . . . . . . . . . . . . . . 34
Table 37. Marking example . . . . . . . . . . . . . . . . . . . . . . . 34
Table 38. Marking HVSON2 . . . . . . . . . . . . . . . . . . . . . . 34
Table 39. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 40: Revision history . . . . . . . . . . . . . . . . . . . . . . . . 39
26. Figures
Fig 1.
Fig 2.
Fig 3.
Fig 4.
Fig 5.
Fig 6.
Fig 7.
Fig 8.
Fig 9.
Fig 10.
Fig 11.
Fig 12.
Fig 13.
Fig 14.
Fig 15.
Fig 16.
Block diagram of HITAG µ ISO 18000 transponder
IC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
HITAG µ ISO 1800 - Mega bumps bondpad
locations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Modulation details of data transmission from RWD
to HITAG µ transponder IC . . . . . . . . . . . . . . . . . .9
Reader to HITAG µ ISO 18000 transponder IC:
Pulse Interval Encoding . . . . . . . . . . . . . . . . . . . .10
Start of frame pattern . . . . . . . . . . . . . . . . . . . . . . 11
End of frame pattern . . . . . . . . . . . . . . . . . . . . . . 11
HITAG µ ISO 18000 transponder IC - Load
modulation coding . . . . . . . . . . . . . . . . . . . . . . . .12
Start of fame pattern . . . . . . . . . . . . . . . . . . . . . .13
General protocol timing diagram . . . . . . . . . . . . .14
Protocol timing diagram without HITAG µ ISO 18000
transponder IC response . . . . . . . . . . . . . . . . . . .16
State diagram of HITAG µ ISO18000 transponder
ICs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
HITAG µ ISO 18000 transponder IC response - in
case of no error . . . . . . . . . . . . . . . . . . . . . . . . . .22
HITAG µ ISO 18000 transponder IC response - in
error case. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
Marking overview . . . . . . . . . . . . . . . . . . . . . . . . .34
Package outline SOT1122 . . . . . . . . . . . . . . . . . .35
Package outline HVSON2 . . . . . . . . . . . . . . . . . .36
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HITAG µ
NXP Semiconductors
ISO 18000 transponder IC
27. Contents
1
2
2.1
2.2
2.3
2.4
2.5
2.6
3
4
5
6
7
7.1
7.1.1
7.1.2
7.1.3
7.1.4
7.1.5
7.1.6
7.1.7
8
8.1
8.1.1
8.2
9
10
10.1
10.1.1
10.1.2
10.1.3
10.1.4
10.2
10.2.1
10.2.2
10.2.3
11
11.1
11.2
11.3
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Supported standards . . . . . . . . . . . . . . . . . . . . 2
Security features. . . . . . . . . . . . . . . . . . . . . . . . 2
Delivery types . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Mechanical specification . . . . . . . . . . . . . . . . . 5
Wafer specification . . . . . . . . . . . . . . . . . . . . . . 5
Wafer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Wafer backside . . . . . . . . . . . . . . . . . . . . . . . . . 5
Chip dimensions . . . . . . . . . . . . . . . . . . . . . . . . 5
Passivation on front . . . . . . . . . . . . . . . . . . . . . 5
Au bump . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Fail die identification . . . . . . . . . . . . . . . . . . . . 6
Map file distribution. . . . . . . . . . . . . . . . . . . . . . 6
Functional description . . . . . . . . . . . . . . . . . . . 7
Memory organization . . . . . . . . . . . . . . . . . . . . 7
Memory organization . . . . . . . . . . . . . . . . . . . . 7
Memory configuration . . . . . . . . . . . . . . . . . . . . 8
General requirements . . . . . . . . . . . . . . . . . . . . 8
HITAG m ISO 18000 transponder IC air
interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Downlink communication signal interface - RWD
to HITAG m ISO 18000 transponder IC . . . . . . 9
Modulation parameters . . . . . . . . . . . . . . . . . . . 9
Data rate and data coding . . . . . . . . . . . . . . . 10
RWD - Start of frame pattern . . . . . . . . . . . . . 11
RWD - End of frame pattern . . . . . . . . . . . . . . 11
Communication signal interface HITAG µ ISO 18000 transponder IC to RWD . 12
Data rate and data coding . . . . . . . . . . . . . . . 12
Start of frame pattern . . . . . . . . . . . . . . . . . . . 13
End of frame pattern . . . . . . . . . . . . . . . . . . . . 13
General protocol timing specification . . . . . . 14
Waiting time before transmitting a response after
an EOF from the RWD . . . . . . . . . . . . . . . . . . 14
RWD waiting time before sending a subsequent
request . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
RWD waiting time before switching to next
inventory slot . . . . . . . . . . . . . . . . . . . . . . . . . 15
11.3.1
RWD started to receive one or more HITAG µ
ISO 18000 transponder IC responses . . . . . . 15
11.3.2
RWD receives no HITAG µ ISO 18000
transponder IC response . . . . . . . . . . . . . . . . 16
12
State diagram. . . . . . . . . . . . . . . . . . . . . . . . . . 17
12.1
General description of states . . . . . . . . . . . . . 17
12.2
State diagram HITAG µ ISO 18000 . . . . . . . . 18
13
Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
13.1
Anticollision . . . . . . . . . . . . . . . . . . . . . . . . . . 19
13.1.1
Anticollision with 1 slot . . . . . . . . . . . . . . . . . . 19
13.1.2
Anticollision with 16 slots . . . . . . . . . . . . . . . . 19
14
Command set . . . . . . . . . . . . . . . . . . . . . . . . . 20
14.1
Flags . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
14.2
Error handling . . . . . . . . . . . . . . . . . . . . . . . . 22
14.3
INVENTORY . . . . . . . . . . . . . . . . . . . . . . . . . 23
14.4
STAY QUIET . . . . . . . . . . . . . . . . . . . . . . . . . 23
14.5
READ UII . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
14.6
READ MULTIPLE BLOCK . . . . . . . . . . . . . . . 25
14.6.1
READ MULTIPLE BLOCKS in INVENTORY
mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
14.7
WRITE SINGLE BLOCK . . . . . . . . . . . . . . . . 27
14.8
LOCK BLOCK . . . . . . . . . . . . . . . . . . . . . . . . 28
14.9
SELECT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
14.10
GET SYSTEM INFORMATION . . . . . . . . . . . 30
14.11
LOGIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
15
Data integrity/calculation of CRC . . . . . . . . . 32
15.1
Data transmission: RWD to HITAG µ ISO 18000
transponder IC . . . . . . . . . . . . . . . . . . . . . . . . 32
15.2
Data transmission: HITAG µ ISO 18000
transponder IC to RWD . . . . . . . . . . . . . . . . . 32
16
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 33
17
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 33
18
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
18.1
Marking SOT1122 . . . . . . . . . . . . . . . . . . . . . 34
18.2
Marking HVSON2 . . . . . . . . . . . . . . . . . . . . . 34
19
Package outline. . . . . . . . . . . . . . . . . . . . . . . . 35
20
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 37
21
References. . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
22
Revision history . . . . . . . . . . . . . . . . . . . . . . . 39
23
Legal information . . . . . . . . . . . . . . . . . . . . . . 40
23.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 40
23.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
23.3
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 40
23.4
Licenses. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
23.5
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 41
continued >>
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Product data sheet
PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.0 — 18 March 2010
184430
© NXP B.V. 2010. All rights reserved.
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HITAG µ
NXP Semiconductors
ISO 18000 transponder IC
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Contact information. . . . . . . . . . . . . . . . . . . . .
Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 18 March 2010
184430
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