Data Sheet

MF3D(H)x2
MIFARE DESFire EV2 contactless multi-application IC
Rev. 2.0 — 24 February 2016
364220
Preliminary short data sheet
COMPANY PUBLIC
1. General description
1.1 Introduction
MIFARE DESFire EV2 (MF3D(H)x2) is the latest addition to the MIFARE DESFire product
family introducing new features along with enhanced performance for best user
experience. The MIFARE DESFire EV2 is Common Criteria EAL5+ security certified
which is the same security certification level as demanded for smart card IC products
used e.g. for banking cards or electronic passports. It fully complies with the requirements
for fast and highly secure data transmission and flexible application management. This
makes it the ideal product for service providers and service operators who want to offer an
easy, convenient and secure access to a wide variety of different services.
MIFARE DESFire EV2 offers best flexibility when creating multi-application schemes and
features such as MIsmartApp with multiple key sets and Transaction MAC are supporting
new business models. Smart Cities services for example could be utilized with only one
MIFARE DESFire EV2 card by combining services such as public transportation, car or
bike sharing, access to city attractions with citizen services, closed-loop e-payment
applications and local loyalty programs.
MIFARE DESFire EV2 is based on global open standards for both air interface and
cryptographic methods. It is compliant to all levels of ISO/IEC 14443A and supports
optional ISO/IEC 7816-4 commands (APDU and file structure supported) and is fully
interoperable with existing MIFARE reader infrastructure.
Featuring an on-chip backup management system and the mutual three pass
authentication, a MIFARE DESFire EV2 card can hold as many applications as the
memory can accommodate. Each application can hold up to 32 files with various data
configurations. The size of each file is defined at the moment of its creation, making
MIFARE DESFire EV2 a truly flexible and convenient product. An automatic anti-tear
mechanism is available for all file types, guaranteeing transaction oriented data integrity.
The main characteristics of this device are denoted by its name “DESFire”: DES indicates
the high level of security using a 3DES or AES hardware cryptographic engine for
confidentiality and integrity protection of the transmission data. Fire indicates its
outstanding position as a Fast, Innovative, Reliable and sEcure IC in the contactless
proximity transaction market.
MIFARE DESFire EV2 delivers the perfect balance of speed, performance and cost
efficiency. Its open concept allows seamless future integration of other ticketing media
such as smart paper tickets, banking convergence card, and mobile ticketing based on
Near Field Communication (NFC) technology. It is also fully compatible with the existing
MIFARE reader hardware platform. MIFARE DESFire EV2 is your ticket to secure
contactless systems worldwide.
MF3D(H)x2
NXP Semiconductors
MIFARE DESFire EV2 contactless multi-application IC
1.2 Evolution of MIFARE DESFire products family
MIFARE DESFire has evolved over time, enhancing its security properties to protect
against current and future security threats, and adding new features to better suit into new
user requirements.
MIFARE DESFire EV2 is the third generation of the MIFARE DESFire products family
succeeding MIFARE DESFire EV1. It is functionally backward compatible with both
MIFARE DESFire EV1 and MIFARE DESFire D40 (MF3ICD40).
Figure 1 shows the relationship between the three generations of MIFARE DESFire
products. The latest generation encompasses the features from the older generation(s).
Therefore, allowing existing users of the older products to adopt the latest product with
minimum or no changes to their infrastructures.
MIFARE DESFire EV2 can be used as a MIFARE DESFire EV1 in its default delivery
configuration. Every new features would required an activation and/or the use of new
commands.
CC EAL5+ on HW and SW
2 KB, 4 KB or 8 KB EEPROM
Unlimited Applications, 32 files
6 file types - new Transaction MAC file
17 pF or 70 pF
Secure messaging (EV2):
AES128
Improved ISO7816-4 APDU and cmds
Configurable ATS with FSCI setting
up to 128 bytes transfer buffer
MIsmartApp
Transaction MAC
Multiple Key Sets
Multiple keys per access rights
Shared application management
Update Record command
Virtual Card Architecture
Proximity Check
Originality Check
CC EAL4+ on HW and SW
2 KB, 4 KB or 8 KB EEPROM
28 Applications, 32 files
5 file types
17 pF or 70 pF
4 KB EEPROM
28 Applications, 16 files
5 file types
17 pF
Secure messaging (D40):
2KTDEA and Single DES
ISO7816-4 APDU and cmds (3)
Automatic backup mechanism
1 PICC key, 14 keys per App
Higher baudrate (up to 848 kbps)
Secure messaging (EV1):
2KTDEA and 3KTDEA and AES128
Random ID
ISO7816-4 APDU and cmds (8)
ISO7816-4 file structure support
Configurable ATS
aaa-022074
Fig 1. Evolution of MIFARE DESFire
MF3Dx2_MF3DHx2_SDS
Preliminary short data sheet
COMPANY PUBLIC
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2. Features and benefits
2.1 Features overview
2.1.1 RF interface: ISO/IEC 14443 Type A
 Contactless interface compliant with ISO/IEC 14443-2/3 A
 Low Hmin enabling operating distance up to 100 mm (depending on power provided
by the PCD and antenna geometry)
 Fast data transfer: 106 kbit/s, 212 kbit/s, 424 kbit/s, 848 kbit/s
 7 bytes unique identifier (option for Random ID)
 Uses ISO/IEC 14443-4 transmission protocol
 Configurable FSCI to support up to 128 bytes frame size (new)
2.1.2 Non-volatile memory




2 kB, 4 kB or 8 kB EEPROM
Data retention of 25 years
Write endurance typical 500 000 cycles
Fast programming cycles (erase/write) 1 ms
2.1.3 NV-memory organization
 Flexible file system: user can freely define application structures on PICC
 Virtually no limitation on number of applications per PICC (new)
 Up to 32 files in each application (6 file types available: Standard Data file, Back-up
Data file, Value file, Linear Record file, Cyclic Record file and Transaction MAC file)
 File size is determined during creation (not for Transaction MAC file)
2.1.4 Security














MF3Dx2_MF3DHx2_SDS
Preliminary short data sheet
COMPANY PUBLIC
Common Criteria certification: EAL5+ (Hardware and Software)
Unique 7 bytes serial number for each device
Optional “RANDOM” ID for enhance security and privacy
Mutual three pass authentication
Mutual authentication according to ISO/IEC 7816-4
Flexible key management: 1 card master key and up to 14 keys per application
Hardware DES using 56/112/168 bit keys featuring key version
Hardware AES using 128-bit keys featuring key version
Data authenticity by 8 byte CMAC
Data encryption on RF-channel
Authentication on application level
Hardware exception sensors
Self-securing file system
Backward compatibility to MF3ICD40: 4 byte MAC, CRC 16
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2.1.5 New features on MIFARE DESFire EV2







MIsmartApp (Delegated Application Management)
Memory reuse in DAM applications (Format Application)
Transaction MAC on application level
Multiple Key Sets per application with fast key rolling mechanism (up to 16 sets)
Accessing files from any two applications during a single transaction
Multiple keys assignment for each file access rights (up to 8)
Virtual Card Architecture for enhanced card/application selection on multi-VC devices
with privacy protection
 Proximity Check for protection against Relay Attacks
 Originality Check for proof of genuine NXP’s product
 New EV2 Secure Messaging based on AES (similar with MIFARE Plus’s secure
messaging)
2.1.6 ISO/IEC 7816 compatibility











Supports ISO/IEC 7816-4 file structure (selection by File ID or DF name)
Supports ISO/IEC 7816-4 APDU message structure
Supports ISO/IEC 7816-4 APDU wrapper for MIFARE DESFire native commands
Supports ISO/IEC 7816-4 INS code ‘A4’ for SELECT FILE
Supports ISO/IEC 7816-4 INS code ‘B0’ for READ BINARY
Supports ISO/IEC 7816-4 INS code ‘D6’ for UPDATE BINARY
Supports ISO/IEC 7816-4 INS code ‘B2’ for READ RECORDS
Supports ISO/IEC 7816-4 INS code ‘E2’ for APPEND RECORD
Supports ISO/IEC 7816-4 INS code ‘84’ for GET CHALLENGE
Supports ISO/IEC 7816-4 INS code ‘88’ for INTERNAL AUTHENTICATE
Supports ISO/IEC 7816-4 INS code ‘82’ for EXTERNAL AUTHENTICATE
2.1.7 Special features




MF3Dx2_MF3DHx2_SDS
Preliminary short data sheet
COMPANY PUBLIC
Transaction oriented automatic anti-tear mechanism
Configurable ATS information for card personalization
Backward compatibility mode to MIFARE DESFire EV1 and D40 (MF3ICD40)
Optional high input capacitance (70pF) for small form factor designs (MF3DHx2)
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MIFARE DESFire EV2 contactless multi-application IC
2.2 Summary of key differences between MIFARE DESFire generations
Table 1 shows the key differences between each product generation of the MIFARE
DESFire family.
Table 1.
Key differences between MIFARE DESFire generations
Features
MIFARE DESFire D40
MIFARE DESFire EV1
MIFARE DESFire EV2
Cryptography scheme(s)
Single DES, 2KTDEA
Single DES, 2KTDEA,
3KTDEA, AES128
Single DES, 2KTDEA,
3KTDEA, AES128
Secure messaging(s)
D40 Native
D40 Native, EV1
D40 Native, EV1, EV2
No. of applications
28
28
No limit
No. of files per application
16
32
32
Max. no. of files with backup
8
32
32
ISO/IEC7816-4 commands
3
8
8 (refine)
Random ID
No
Yes
Yes
Configurable ATS
No
Yes, Historical bytes only
Yes, all parameters (FSCI
supporting up to 128 bytes)
Max. communication buffer
64 bytes
64 bytes
128 bytes
Chaining during data transfer
Native (AFh)
Native (AFh)
Native (AFh) or
ISO/IEC14443-4
Multiple Key Sets with rolling
No
No
Yes
MIsmartApp (Delegated
Application Management)
No
No
Yes
Shared Application
Management
No
No
Yes
Multiple keys per access right
No
No
Yes
UpdateRecord command
No
No
Yes
Transaction MAC
No
No
Yes
Virtual Card Architecture
No
No
Yes
Proximity Check
No
No
Yes
Originality Check
No
No
Yes
3. Applications








MF3Dx2_MF3DHx2_SDS
Preliminary short data sheet
COMPANY PUBLIC
Secure public transport ticketing
Multi-application smart city and mobility card
Secure access management
Micro-payment and Loyalty
Student ID
Road tolling and parking
Hospitality
Event ticketing
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MIFARE DESFire EV2 contactless multi-application IC
4. Quick reference data
Table 2.
Quick reference data [1][2]
Symbol
Parameter
fi
input frequency
input capacitance
Ci
Conditions
Min
Typ
Max
Unit
-
13.56
-
MHz
MF3Dx2
[3][4]
16.15
17.0
17.85
pF
MF3DHx2
[3][4]
66.5
70.0
73.5
pF
EEPROM characteristics
tret
retention time
Tamb = 22 C
25
-
-
year
Nendu(W)
write endurance
Tamb = 22 C
200000
500000
-
cycle
tcy(W)
write cycle time
Tamb = 22 C
-
1
-
ms
[1]
Stresses above one or more of the values may cause permanent damage to the device.
[2]
Exposure to limiting values for extended periods may affect device reliability.
[3]
Measured with LCR meter.
[4]
Tamb = 22 C; fi = 13.56 MHz; 2 V RMS
MF3Dx2_MF3DHx2_SDS
Preliminary short data sheet
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5. Ordering information
Table 3.
Ordering information
Type number
Package
Description
FFC
Version
8 inch wafer (sawn; 120 m
thickness)[1][2];
8K EE, 17pF input capacitance -
FFC
8 inch wafer (sawn; 120 m
thickness)[1][2];
4K EE, 17pF input capacitance -
MF3D2201DUD/00
FFC
8 inch wafer (sawn; 120 m
thickness)[1][2];
2K EE, 17pF input capacitance -
MF3DH8201DUD/00
FFC
8 inch wafer (sawn; 120 m thickness)[1][2]; 8K EE, 70pF input capacitance
MF3DH4201DUD/00
FFC
8 inch wafer (sawn; 120 m thickness)[1][2]; 4K EE, 70pF input capacitance
MF3DH2201DUD/00
FFC
8 inch wafer (sawn; 120 m thickness)[1][2]; 2K EE 70pF input capacitance
MF3D8201DUF/00
FFC
8 inch wafer (sawn; 75 m thickness)[1][2]; 8K EE, 17pF input capacitance -
MF3D4201DUF/00
FFC
8 inch wafer (sawn; 75 m thickness)[1][2]; 4K EE, 17pF input capacitance -
MF3D2201DUF/00
FFC
8 inch wafer (sawn; 75 m thickness)[1][2]; 2K EE, 17pF input capacitance -
MF3DH8201DUF/00
FFC
8 inch wafer (sawn; 75 m thickness)[1][2]; 8K EE, 70pF input capacitance -
MF3DH4201DUF/00
FFC
8 inch wafer (sawn; 75 m thickness)[1][2]; 4K EE, 70pF input capacitance -
MF3DH2201DUF/00
FFC
8 inch wafer (sawn; 75 m thickness)[1][2]; 2K EE, 70pF input capacitance -
MF3D8200DA4/00
MOA4
plastic leadless module carrier package; 8K EE, 17pF input capacitance
SOT500-2
MF3D4200DA4/00
MOA4
plastic leadless module carrier package; 4K EE, 17pF input capacitance
SOT500-2
MF3D2200DA4/00
MOA4
plastic leadless module carrier package; 2K EE, 17pF input capacitance
SOT500-2
MF3DH8200DA4/00
MOA4
plastic leadless module carrier package; 8K EE, 70pF input capacitance
SOT500-2
MF3DH4200DA4/00
MOA4
plastic leadless module carrier package; 4K EE, 70pF input capacitance
SOT500-2
MF3DH2200DA4/00
MOA4
plastic leadless module carrier package; 2K EE, 70pF input capacitance
SOT500-2
MF3D8200DA6/00
MOB6
plastic leadless module carrier package; 8K EE, 17pF input capacitance
SOT500-3
MF3D4200DA6/00
MOB6
plastic leadless module carrier package; 4K EE, 17pF input capacitance
SOT500-3
MF3D2200DA6/00
MOB6
plastic leadless module carrier package; 2K EE, 17pF input capacitance
SOT500-3
MF3DH8200DA6/00
MOB6
plastic leadless module carrier package; 8K EE, 70pF input capacitance
SOT500-3
MF3DH4200DA6/00
MOB6
plastic leadless module carrier package; 4K EE, 70pF input capacitance
SOT500-3
MF3DH2200DA6/00
MOB6
plastic leadless module carrier package; 2K EE, 70pF input capacitance
SOT500-3
MF3D8201DUD/00
MF3D4201DUD/00
[1]
Delivered on film frame carrier with electronic fail die marking according to SECSII format.
[2]
See Ref. 2
MF3Dx2_MF3DHx2_SDS
Preliminary short data sheet
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6. Block diagram
ANALOG
ROM
LA
POR
OSCILLATOR
CLOCK
GENERATION
LB
RECTIFIER,
MODULATOR
DEMODULATOR
CLOCK FILTER
data
bus
MMU
CPU
VOLTAGE
SENSORS
SUSPENSION
TIME, TEMP
SENSOR
ACTIVE
SHIELDING, RAIL
SENSORS
LIGHT
GLITCH
SENSOR
RAM
VOLTAGE
REGULATOR
EEPROM
MF3D(H)x2
ISO14443
CIU
CRC
16/32
TRNG
3-KEY
DES
AES
128
aaa-022071
Fig 2. MIFARE DESFire EV2 IC block diagram
7. Limiting values
Table 4.
Limiting values [1][2]
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
II
Min
Max
Unit
input current
-
50
mA
Ptot/pack
total power dissipation per
package
-
200
mW
Tstg
storage temperature
55
125
C
Tamb
ambient temperature
25
70
C
-
2
kV
VESD
Conditions
electrostatic discharge voltage
[3]
[1]
Stresses above one or more of the limiting values may cause permanent damage to the device.
[2]
Exposure to limiting values for extended periods may affect device reliability.
[3]
MIL Standard 883-C method 3015; human body model: C = 100 pF, R = 1.5 k.
MF3Dx2_MF3DHx2_SDS
Preliminary short data sheet
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8. Functional description
8.1 Introduction
MIFARE DESFire EV2 is a contactless multi-application smart card IC compliant with
ISOIEC 14443A (part 1-4). The MIFARE DESFire EV2 operating system provides an
off-the-shelf development platform for smart card application providers.
The memory organization of MIFARE DESFire EV2 is flexible and can be dynamically
structured to fit into any application requirements. The application and file structure is
shown in Figure 3. Each application folder is a container of data files usable within a
certain real world application (e.g. Transport ticketing). There are 5 file types available for
data storage and 1 file type for storing Transaction MAC as detailed in Section 8.6.
Within the application folder, there are a set of keys and configuration settings dedicated
for the application. The application owner can freely organize the file structure and
security setting within his application. An adjacent application will not have access to its
files as long as they do not possess the correct security rights. MIFARE DESFire EV2 also
support the ISO/IEC 7816-4 file structure and APDU.
At the PICC level, there is another set of keys and security settings for the PICC owner.
The PICC owner will have the right to create or delete any application, but he will not have
access to the application's files, unless he knows the application keys too.
Application x
Application z
App. Setting
configuration
Application
Keys
PICC Setting and
configuration
Std. Data
File
BackUp Data
File
Cyclic Record
File
Linear Record
File
Value
File
Up to 14 keys, free and never access options per application.
Applications are independent of PICC keys and crypto
Applications are independent of each other
5 types of data file + 1 Transaction MAC file (optional)
Maximum 32 files per application
PICC Keys
Independent file access and communication settings
Application Y
Transaction
MAC
File
aaa-022073
Fig 3. MIFARE DESFire EV2 application and file structure
MF3Dx2_MF3DHx2_SDS
Preliminary short data sheet
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MIFARE DESFire EV2 supports confidential and integrity protected communication (see
Section 8.7). Each MIFARE DESFire EV2 application can have its own cryptographic
settings (i.e. 2TDEA, 3TDEA or AES) and secure messaging for communication. The D40
and EV1 secure messaging are included in the product for backward compatible support
of existing installations. For new projects, the EV2 secure messaging is recommended.
MIFARE DESFire EV2 offers a transaction oriented backup mechanism to prevent
inconsistent updating of data storage across multiple files during a tearing situation. When
transaction tearing occurs, either all data fields are updated or none is altered.
Besides the application file structure support, MIFARE DESFire EV2 offers many optional
features such as following:
• Delegated Application Management (MIsmartApp) for giving rights to third party
application creation and management.
• Multiple key set within an application with key rolling mechanism and key migration
supported.
• Shared files between two applications, supporting a single transaction over two
applications at the same time.
• Multiple keys for each access rights of files.
• Transaction MAC on application level, MACing the transacted data with a secret key
on the card and served as a proof of transaction to the backend system.
• Virtual Card Architecture providing a privacy protecting mechanism during card
selection.
• Proximity Check to prevent against relay attacks.
• Originality Check for verification of genuine MIFARE DESFire EV2 product from NXP
or its licensees.
The following chapters will provide basic description of some functionality on MIFARE
DESFire EV2. For a morel details description of each functionality on MIFARE DESFire
EV2, please see Ref. 1.
8.2 Contactless energy and data transfer
In the MIFARE system, the MIFARE DESFire EV2 is connected to a coil consisting of a
few turns embedded in a standard ISO/IEC smart card. A battery is not needed. When the
card is positioned in the proximity of the PCD antenna, the high speed RF communication
interface allows data to be transmitted up to 848 kbit/s.
8.3 Anti-collision
An intelligent anti-collision mechanism allows more than one MIFARE DESFire EV2 in the
field to be handled simultaneously. The anti-collision algorithm selects each MIFARE
DESFire EV2 individually and ensures that the execution of a transaction with a selected
MIFARE DESFire EV2 is performed correctly without data corruption resulting from other
MIFARE DESFire EV2s in the field.
MF3Dx2_MF3DHx2_SDS
Preliminary short data sheet
COMPANY PUBLIC
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8.4 UID/serial number
The unique 7 byte (UID) is programmed into a locked part of the NV memory which is
reserved for the manufacturer. Due to security and system requirements these bytes are
write-protected after being programmed by the IC manufacturer at production time.
According to ISO/IEC 14443-3 during the first anti-collision loop the cascade tag returns a
value of 88h and also the first 3 bytes of the UID, UID0 to UID2 and BCC. The second
anti-collision loop returns bytes UID3 to UID6 and BCC.
UID0 holds the manufacturer ID for NXP (04h) according to ISO/IEC 14443-3 and
ISO/IEC 7816-6 AMD 1.
MIFARE DESFire EV2 also allows Random ID to be used. In this case MIFARE DESFire
EV2 only uses a single anti-collision loop. The 3 byte random number is generated after
RF reset of the MIFARE DESFire EV2.
8.5 Memory organization
The NV memory is organized using a flexible file system. This file system allows a multiple
number of different applications on one MIFARE DESFire EV2. Each application can have
multiple files. Every application is represented by its 3 bytes Application IDentifier (AID)
and an optional ISO DF Name.
5 different data file types and 1 Transaction MAC file type are supported; see Section 8.6.
A guideline to assign DESFire AIDs can be found in the application note MIFARE
Application Directory (MAD); see Ref. 3.
Each file can be created either at MIFARE DESFire EV2 initialization (card
production/card printing), at MIFARE DESFire EV2 personalization (vending machine) or
in the field.
If a file or application becomes obsolete in operation, it can be permanently invalidated.
Commands which have impact on the file structure itself (e.g. creation or deletion of
applications, change of keys) activate an automatic rollback mechanism, which protects
the file structure from being corrupted.
If this rollback is necessary, it is done without user interaction before carrying out further
commands. To ensure data integrity on application level, a transaction-oriented backup is
implemented for all file types with backup. It is possible to mix file types with and without
backup within one application.
8.6 Available file types
The files within an application can be any of the following types:
•
•
•
•
•
•
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Standard data files
Backup data files
Value files with backup
Linear record files with backup
Cyclic record files with backup
Transaction MAC file
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8.7 Security
The 7 byte UID is fixed, programmed into each device during production. It cannot be
altered and ensures the uniqueness of each device.
The UID may be used to derive diversified keys for each ticket. Diversified MIFARE
DESFire EV2 keys contribute to gain an effective anti-cloning mechanism and increase
the security of the original key.
Prior to data transmission a mutual three pass authentication can be done between
MIFARE DESFire EV2 and PCD depending on the configuration employing either 56-bit
DES (single DES, DES), 112-bit DES (triple DES, 3DES), 168-bit DES (3 key triple DES,
3K3DES) or AES. During the authentication the level of security of all further commands
during the session is set. In addition the communication settings of the file/application
result in the following options of secure communication between MIFARE DESFire EV2
and PCD:
• Plain data transfer (only possible within the backwards-compatible mode to
MF3ICD40 and EV2 secure messaging)
• Plain data transfer with cryptographic checksum (MAC): Authentication with
backwards-compatible mode to MF3ICD40: 4 byte MAC; All other authentications
based on DES/3DES/AES: 8 byte CMAC
• Encrypted data transfer (secured by CRC before encryption): Authentication with
backwards-compatible mode to MF3ICD40: A 16-bit CRC is calculated over the
stream and attached. The resulting stream is encrypted using the chosen
cryptographic method. All other authentications based DES/3DES/AES: A 32-bit CRC
is calculated over the stream and attached. The resulting stream is encrypted using
the chosen cryptographic method. A cryptographic checksum (CMAC) will also be
attached when using EV2 secure messaging.
Find more information on the security concept of the product in Ref. 1. Be aware not all
levels of security are recommended. For new design, the EV2 secure messaging is
recommended.
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9. DESFire command set
This section contains an overview of MF3D(H)x2 command codes. A detailed description
of all commands is provided in Ref. 1.
9.0.1 Secure Messaging Commands
Table 5.
Secure messaging commands overview
Command
Description
Authenticate
Authentication as it was already supported by D40. Only for
KeyType.2TDEA keys. Note that the PICC only performs encryption
operations. After this authentication, the D40 backwards compatible
secure messaging is used.
AuthenticateISO
Authentication as already supported by DESFire EV1. Only for
KeyType.2TDEA or KeyType.3TDEA keys. After this authentication
EV1 backwards compatible secure messaging is used.
AuthenticateAES
Authentication as already supported by DESFire EV1. Only for
KeyType.AES keys. After this authentication EV1 backwards
compatible secure messaging is used.
AuthenticateEV2First
Authentication for KeyType.AES keys. After this authentication EV2
secure messaging is used. This authentication is intended to be the
first in a transaction.
AuthenticateEV2NonFirst
Authentication for KeyType.AES keys. After this authentication EV2
secure messaging is used. This authentication is intended for any
subsequent authentication after Cmd.AuthenticateEV2First in a
transaction.
9.0.2 Memory and Configuration Management Commands
Table 6.
Memory and configuration management commands overview
Command
Description
FreeMem
Returns the free memory available on the card
Format
At PICC level, all applications and files are deleted. At application
level (only for delegated applications), all files are deleted. The
deleted memory is released and can be reused.
SetConfiguration
Configures the card and pre personalizes the card with a key, defines
if the UID or the random ID is sent back during communication setup
and configures the ATS string.
GetVersion
Returns manufacturing related data of the PICC.
GetCardUID
Returns the UID.
9.1 Key Management Commands
Table 7.
Key management commands overview
Command
Description
ChangeKey
Changes any key stored on the PICC.
ChangeKeyEV2
Depending on the currently selected AID, this command updates a
key of the PICC or of one specified application keyset.
InitializeKeySet
Depending on the currently selected application, initialize the key set
with specific index.
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Table 7.
Key management commands overview …continued
Command
Description
FinalizeKeySet
Within the currently selected application, finalize the key set with
specified number
RollKeySet
Within the currently selected application, roll to the key set with
specified number
GetKeySettings
Gets information on the PICC and application master key settings.
ChangeKeySettings
Changes the master key settings on PICC and application level.
GetKeyVersion
Reads out the current key version of any key stored on the PICC.
9.2 Application Management Commands
Table 8.
Application management commands overview
Command
Description
CreateApplication
Creates new applications on the PICC. The application is initialized
according to the given settings. The application keys of the active
key set are initialized with the Default Application Key.
DeleteApplication
Permanently deactivates applications on the PICC.
CreateDelegatedApplication Creates delegated applications on the PICC with limited memory
consumption.
SelectApplication
Selects one specific application for further access.
GetApplicationIDs
Returns the Application IDentifiers of all applications on a PICC.
GetDFNames
Returns the DF names
GetDelegatedInfo
Returns the DAMSlotVersion and QuotaLimit of a target DAM slot on
the card.
9.3 File Management Commands
Table 9.
File management commands overview
Command
Description
CreateStdDataFile
Creates files for the storage of plain unformatted user data within an
existing application on the PICC.
CreateBackupDataFile
Creates files for the storage of plain unformatted user data within an
existing application on the PICC, additionally supporting the feature
of an integrated backup mechanism.
CreateValueFile
Creates files for the storage and manipulation of 32bit signed integer
values within an existing application on the PICC.
CreateLinearRecordFile
Creates files for multiple storage of structural similar data, for
example for loyalty programs, within an existing application on the
PICC. Once the file is filled completely with data records, further
writing to the file is not possible unless it is cleared.
CreateCyclicRecordFile
Creates files for multiple storage of structural similar data, for
example for logging transactions, within an existing application on
the PICC. Once the file is filled completely with data records, the
PICC automatically overwrites the oldest record with the latest
written one. This wrap is fully transparent for the PCD.
CreateTransactionMACFile Creates a Transaction MAC File and enables the Transaction MAC
feature for the targeted application.
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Table 9.
File management commands overview
Command
Description
DeleteFile
Permanently deactivates a file within the file directory of the currently
selected application.
GetFileIDs
Returns the File IDentifiers of all active files within the currently
selected application.
GetISOFileIDs
Get back the ISO File ID.
GetFileSettings
Get information on the properties of a specific file.
ChangeFileSettings
Changes the access parameters of an existing file.
9.4 Data Management Commands
Table 10.
Data management commands overview
Command
Description
ReadData
Reads data from FileType.StandardData or FileType.BackupData.
WriteData
Writes data to FileType.StandardData or FileType.BackupData
GetValue
Reads the currently stored value from FileType.Value.
Credit
Increases a value stored in a FileType.Value.
Debit
Decreases a value stored in a FileType.Value.
LimitedCredit
Allows a limited increase of a value stored in a FileType.Value
without having full Credit permissions to the file.
ReadRecords
Reads out a set of complete records from a FileType.CyclicRecord or
FileType.LinearRecord.
WriteRecord
Writes data to a record in a FileType.CyclicRecord or
FileType.LinearRecord.
UpdateRecord
Updates data of an existing record in a FileType.LinearRecord or
FileType.CyclicRecord file.
ClearRecordFile
Resets a FileType.LinearRecord or FileType.CyclicRecord to empty
state.
9.5 Transaction Management Commands
Table 11.
Transaction management commands overview
Command
Description
CommitTransaction
Validates all previous write access’ on FileType.BackupData,
FileType.Value, FileType.LinearRecord and FileType.CyclicRecord
within one application.
AbortTransaction
Invalidates all previous write access’ on FileType.BackupData,
FileType.Value, FileType.LinearRecord and FileType.CyclicRecord
within one application.
CommitReaderID
Commits a ReaderID for the ongoing transaction. This will allow a
backend to identify the attacking merchant in case of fraud detected.
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9.6 ISO/IEC 7816-4 Standard Commands
Table 12.
ISO/IEC 7816-4 support commands overview
Command
Description
ISOSelectFile
Selects either the PICC level, a DESFire application or a DESFire file
within an application.
ISOReadBinary
Read data from FileType.StandardData and FileType.BackupData
files.
ISOUpdateBinary
Write data to FileType.StandardData and FileType.BackupData files.
ISOReadRecord
Read data from FileType.LinearRecord and FileType.CyclicRecord
files.
ISOAppendRecord
Write a new record to FileType.LinearRecord and
FileType.CyclicRecord files.
ISOGetChallenge
To initiate a ISO/IEC 7816-4 authentication
ISOExternalAutheticate
Authenticate the PCD during a ISO/IEC 7816-4 authentication
ISOInternalAuthenticate
Authenticate the PICC during a ISO/IEC 7816-4 authentication
9.7 Virtual Card Commands
Table 13.
Virtual Card commands overview
Command
Description
ISOSelect
Select VC with the given IID.
ISOExternalAuthenticate
Authenticate PCD before accessing the VC.
9.8 Proximity Check Commands
Table 14.
Proximity Check commands overview
Command
Description
PreparePC
Prepare for the Proximity Check
ProximityCheck
Perform the precise measurement for the Proximity Check
VerifyPC
Verify the Proximity Check
9.9 Originality Check Commands
Table 15.
Originality Check commands overview
Command
Description
Read_Sig
Retrieve the ECC originality check signature
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10. Abbreviations
Table 16.
Abbreviations
Acronym
Description
AES
Advanced Encryption Standard
AID
Application IDentifier
APDU
Application Protocol Data Unit
ATS
Answer to Select
CC
Common Criteria
CMAC
Cryptic Message Authentication Code
CRC
Cyclic Redundancy Check
DES
Digital Encryption Standard
DF
Dedicated File
EAL
Evaluation Assurance Level
EEPROM
Electrically Erasable Programmable Read-Only Memory
FWT
Frame Waiting Time
ID
IDentifier
INS
Instructions
LCR
inductance, Capacitance, Resistance
MAC
Message Authentication Code
MAD
MIFARE Application Directory
NV
Non-Volatile Memory
PCD
Proximity Coupling Device
PPS
Protocol Parameter Selection
RATS
Request Answer To Select
REQA
Request Answer
RF
Radio Frequency
UID
Unique Identifier
WTX
Waiting Time eXtension
WUPA
Wake Up Protocol A
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11. References
1.
[1]
Data sheet — MF3Dx2 MIFARE DESFire EV2 Functional specification, document
number: 2260**1.
[2]
Data sheet — MF3D(H)x2 Wafer specification, document number: 2953**.
[3]
Application note — MIFARE Application Directory, document number: 0018**.
** ... BU-ID document version number
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12. Revision history
Table 17.
Revision history
Document ID
Release date
Data sheet status
MF3Dx2_MF3DHx2_SDS
20160224
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13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
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Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
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Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Licenses
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
ICs with DPA Countermeasures functionality
NXP ICs containing functionality
implementing countermeasures to
Differential Power Analysis and Simple
Power Analysis are produced and sold
under applicable license from
Cryptography Research, Inc.
13.5 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
MIFARE — is a trademark of NXP B.V.
DESFire — is a trademark of NXP Semiconductors N.V.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
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15. Tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Key differences between MIFARE DESFire
generations . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Quick reference data [1][2] . . . . . . . . . . . . . . . . . .6
Ordering information . . . . . . . . . . . . . . . . . . . . .7
Limiting values [1][2] . . . . . . . . . . . . . . . . . . . . . . .8
Secure messaging commands overview . . . . .13
Memory and configuration management
commands overview . . . . . . . . . . . . . . . . . . . . .13
Key management commands overview . . . . . .13
Application management commands overview 14
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
File management commands overview . . . . . . 14
Data management commands overview . . . . . 15
Transaction management commands overview15
ISO/IEC 7816-4 support commands overview. 16
Virtual Card commands overview . . . . . . . . . . 16
Proximity Check commands overview . . . . . . . 16
Originality Check commands overview . . . . . . 16
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 17
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 19
16. Figures
Fig 1.
Fig 2.
Fig 3.
Evolution of MIFARE DESFire . . . . . . . . . . . . . . . .2
MIFARE DESFire EV2 IC block diagram . . . . . . . .8
MIFARE DESFire EV2 application and file
structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
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17. Contents
1
1.1
1.2
2
2.1
2.1.1
2.1.2
2.1.3
2.1.4
2.1.5
2.1.6
2.1.7
2.2
3
4
5
6
7
8
8.1
8.2
8.3
8.4
8.5
8.6
8.7
9
9.0.1
9.0.2
9.1
9.2
9.3
9.4
9.5
9.6
9.7
9.8
9.9
10
11
12
13
13.1
General description . . . . . . . . . . . . . . . . . . . . . . 1
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Evolution of MIFARE DESFire products family. 2
Features and benefits . . . . . . . . . . . . . . . . . . . . 3
Features overview . . . . . . . . . . . . . . . . . . . . . . 3
RF interface: ISO/IEC 14443 Type A . . . . . . . . 3
Non-volatile memory. . . . . . . . . . . . . . . . . . . . . 3
NV-memory organization . . . . . . . . . . . . . . . . . 3
Security. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
New features on MIFARE DESFire EV2. . . . . . 4
ISO/IEC 7816 compatibility . . . . . . . . . . . . . . . 4
Special features . . . . . . . . . . . . . . . . . . . . . . . . 4
Summary of key differences between MIFARE
DESFire generations . . . . . . . . . . . . . . . . . . . . 5
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Quick reference data . . . . . . . . . . . . . . . . . . . . . 6
Ordering information . . . . . . . . . . . . . . . . . . . . . 7
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8
Functional description . . . . . . . . . . . . . . . . . . . 9
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Contactless energy and data transfer. . . . . . . 10
Anti-collision . . . . . . . . . . . . . . . . . . . . . . . . . . 10
UID/serial number. . . . . . . . . . . . . . . . . . . . . . 11
Memory organization . . . . . . . . . . . . . . . . . . . 11
Available file types . . . . . . . . . . . . . . . . . . . . . 11
Security. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
DESFire command set. . . . . . . . . . . . . . . . . . . 13
Secure Messaging Commands. . . . . . . . . . . . 13
Memory and Configuration Management
Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Key Management Commands . . . . . . . . . . . . 13
Application Management Commands. . . . . . . 14
File Management Commands. . . . . . . . . . . . . 14
Data Management Commands. . . . . . . . . . . . 15
Transaction Management Commands . . . . . . 15
ISO/IEC 7816-4 Standard Commands . . . . . . 16
Virtual Card Commands . . . . . . . . . . . . . . . . . 16
Proximity Check Commands . . . . . . . . . . . . . 16
Originality Check Commands . . . . . . . . . . . . . 16
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 17
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 19
Legal information. . . . . . . . . . . . . . . . . . . . . . . 20
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20
13.2
13.3
13.4
13.5
14
15
16
17
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . .
Licenses. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information . . . . . . . . . . . . . . . . . . . .
Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
20
20
21
21
21
22
22
23
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2016.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 24 February 2016
364220
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