Data Sheet

SL2S1412; SL2S1512;
SL2S1612
ICODE ILT-M
Rev. 3.2 — 8 October 2013
167732
Product data sheet
COMPANY PUBLIC
1. General description
The ISO 18000-3 mode 3/EPC Class-1 HF standard allows the commercialized provision
of mass adoption of HF RFID technology for passive smart tags and labels. Main fields of
applications are supply chain management and logistics for worldwide use.
The ICODE ILT-M is a dedicated chip for passive, intelligent tags and labels supporting
the ISO 18000-3 mode 3 RFID standard. It is especially suited for applications where
reliable identification and high anti-collision rates are required.
The ICODE ILT-M is a product out of the NXP Semiconductors ICODE product family. The
entire ICODE product family offers anti-collision functionality. This allows a reader to
simultaneously operate multiple labels/tags within its antenna field. A ICODE ILT-M based
label/tag requires no external power supply.
Its contactless interface generates the power supply via the antenna circuit by inductive
energy transmission from the interrogator (reader), while the system clock is extracted
from the magnetic field. Data transmitted from interrogator to label/tag is demodulated by
the interface, and it also modulates the interrogator's magnetic field for data transmission
from label/tag to interrogator. A label/tag can be operated without the need for line of sight
or battery, as long as it is connected to a dedicated antenna for the targeted frequency
range. When the label/tag is within the interrogator's operating range, the high-speed
wireless interface allows data transmission in both directions.
2. Features and benefits
2.1 Key features











512-bit user memory
Up to 240-bit of EPC memory
96-bit tag identifier (TID) including 48-bit unique serial number
EAS (Electronic Article Surveillance) functionality
Recommissioning feature (privacy) with 32-bit kill password
32-bit access password to allow a transition into the secured state
Long read/write ranges due to extremely low-power design
Reliable operation of multiple tags due to advanced anti-collision (up to 800 tags/s)
Fast initialization (write EPC)
Forward link: 25 kbit/s to 100 kbit/s
Return link: 53 kbit/s to 848 kbit/s
SL2S1412; SL2S1512; SL2S1612
NXP Semiconductors
ICODE ILT-M
2.2 Key benefits
 High sensitivity provides long read range
 Highly advanced anti-collision resulting in highest identification speed
 Reliable and robust RFID technology suitable noisy environments and dense label
populations
2.3 Custom features
 EAS
Enables the HF RFID tag to be used as EAS tag without the need for a backend data
base.
3. Applications





Healthcare and pharmaceutical supply chain
Medical lab automation
Document tracking
Casino chips
Laundry automation
4. Ordering information
Table 1.
Ordering information
Type number
SL2S1412_SL2S1512_SL2S1612
Product data sheet
COMPANY PUBLIC
Package
Name
Description
SL2S1412FUD
Wafer
sawn, bumped wafer, 120 m, on film frame carrier, Ci between LA and LB = 0 pF (typical)
SL2S1512FUD
Wafer
sawn, bumped wafer, 120 m, on film frame carrier, Ci between LA and LB = 23.5 pF (typical)
SL2S1612FUD
Wafer
sawn, bumped wafer, 120 m, on film frame carrier, Ci between LA and LB = 97 pF (typical)
SL2S1512FTB
XSON3
plastic extremely thin small outline package; no
leads; 3 terminals; body 1 x 1.45 x 0.5 mm;
Ci between LA and LB = 23.5 pF (typical)
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Rev. 3.2 — 8 October 2013
167732
Version
SOT1122
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ICODE ILT-M
5. Block diagram
The SL2S1412; SL2S1512; SL2S1612 IC consists of three major blocks:
- Analog RF Interface
- Digital Controller
- EEPROM
The analog part provides stable supply voltage and demodulates data received from the
reader for being processed by the digital part. Further, the modulation transistor of the
analog part transmits data back to the reader.
The digital section includes the state machines, processes the protocol and handles
communication with the EEPROM, which contains the EPC and the user data.
ANALOG
RF INTERFACE
DIGITAL CONTROL
EEPROM
VREG
PAD
VDD
ANTICOLLISION
DEMOD
RECT
READ/WRITE
CONTROL
data
in
ANTENNA
ACCESS CONTROL
MOD
PAD
MEMORY
data
out
EEPROM INTERFACE
CONTROL
R/W
PAD
VDD
I/O
CONTROL
PAD
RF INTERFACE
CONTROL
OUT
SEQUENCER
CHARGE PUMP
001aai335
Fig 1.
SL2S1412_SL2S1512_SL2S1612
Product data sheet
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Block diagram
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ICODE ILT-M
6. Pinning information
2
LA
1
LB
n.c.
3
aaa-009401
Transparent top view
Fig 2.
Table 2.
SL2S1412_SL2S1512_SL2S1612
Product data sheet
COMPANY PUBLIC
Pin configuration for SOT1122
Pin description SOT1122
Pin
Symbol
Description
1
LB
antenna RF input
2
LA
antenna RF input
3
n.c.
not connected
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SL2S1412; SL2S1512; SL2S1612
ICODE ILT-M
7. Wafer layout
LA
LB
GND
TEST
not to scale
Fig 3.
SL2S1412_SL2S1512_SL2S1612
Product data sheet
COMPANY PUBLIC
001aam246
Wafer SL2S1412FUD and SL2S1512FUD layout and pin configuration for the bare
die
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SL2S1412; SL2S1512; SL2S1612
ICODE ILT-M
LA
LB
GND
TEST
not to scale
Fig 4.
SL2S1412_SL2S1512_SL2S1612
Product data sheet
COMPANY PUBLIC
001aam546
Wafer SL2S1612FUD layout and pin configuration for the bare die
Table 3.
Bonding pad description
Symbol
Description
LA
antenna RF input
LB
antenna RF input
GND
ground
TEST
test input
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ICODE ILT-M
8. Mechanical specification
8.1 Wafer specification
See Ref. 13 “General specification for 8” wafer on UV-tape with electronic fail die
marking”.
Table 4.
Wafer specification
Wafer
Designation
each wafer is inscribed with batch number and wafer number
Diameter
200 mm (8 inches)
Thickness
120 m  15 m
Process
CMOS 0.14 m
Batch size
25 wafers
Dies per wafer
SL2S1412FUD/SL2S1512FUD
110050
SL2S1612FUD
88225
Wafer backside
Material
Si
Treatment
ground and stress release
Roughness
Ra minimum = 0.5 m
Rt maximum = 5 m
Chip dimensions
Die size without scribe
SL2S1412FUD/SL2S1512FUD
520 m  484 m = 251680 mm2
SL2S1612FUD
520 m  607 m = 315640 mm2
Scribe line width
X-dimension
15 m (scribe line width measured between nitride edges)
Y-dimension
15 m (scribe line width measured between nitride edges)
Number of pads
4
Pad location
non-diagonal/placed in chip corners
Distance pad to pad LA to LB
400 m
Distance pad to pad LB to TEST
SL2S1412FUD/SL2S1512FUD
360 m
SL2S1612FUD
517 m
Passivation on front
Type
sandwich structure
Material
PE-nitride (on top)
Thickness
1.75 m total thickness of passivation
Au bump
Material
SL2S1412_SL2S1512_SL2S1612
Product data sheet
COMPANY PUBLIC
>99.9 % pure Au
Hardness
35 HV to 80 HV 0.005
Shear strength
>70 MPa
Height
18 m
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ICODE ILT-M
Table 4.
Wafer specification
Height uniformity
within a die
2 m
within a wafer
3 m
wafer to wafer
4 m
1.5 m
Bump flatness
Bump size
LA, LB
60 m  60 m
TEST, GND
60 m  60 m
5 m
variation
Under bump metallization
sputtered TiW
8.1.1 Fail die identification
No inkdots are applied to the wafer.
Electronic wafer mapping (SECS II format) covers the electrical test results and
additionally the results of mechanical/visual inspection.
See Ref. 13 “General specification for 8” wafer on UV-tape with electronic fail die marking”
8.1.2 Map file distribution
See Ref. 13 “General specification for 8” wafer on UV-tape with electronic fail die
marking”.
SL2S1412_SL2S1512_SL2S1612
Product data sheet
COMPANY PUBLIC
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ICODE ILT-M
9. Functional description
9.1 Power transfer
Whenever connected to a very simple and cheap type of antenna (as a result of the
13.56 MHz carrier frequency) made out of a few windings printed, winded, etched or
punched coil the ICODE ILT-M IC can be operated without line of sight up to a distance of
1.5 m (gate width). No battery is needed.
9.2 Data transfer
9.2.1 Reader to tag Link
An interrogator transmits information to the ICODE ILT-M by modulating an RF signal in
the 13.56 MHz frequency. The ICODE ILT-M receives both information and operating
energy from this RF signal. Tags are passive, meaning that they receive all of their
operating energy from the interrogator's RF waveform.
An interrogator is using a fixed modulation and data rate for the duration of at least an
inventory round. It communicates to the ICODE ILT-M by modulating an RF carrier using
DSB-ASK with PIE encoding.
For further details refer to Section 18, Ref. 2. Interrogator-to-tag (R=>T) communications.
9.2.2 Tag to reader Link
An interrogator receives information from the ICODE ILT-M by transmitting a
continuous-wave RF signal to the tag; the ICODE ILT-M responds by load modulation of
the 13.56 MHz carrier frequency, thereby generating modulated sidebands used to
transmit an information signal to the interrogator. The system is a reader talks first (RTF)
system, meaning that a ICODE ILT-M only responds with an information signal after being
directed by the interrogator.
ICODE ILT-M transmits information using ASK modulation. The returned data are either
coded with FM0 baseband, Miller with sub carrier or Manchester with sub carrier. The
interrogator can select if the ICODE ILT-M shall respond with a sub carrier frequency of
424 kHz or 848 kHz.
For further details refer to Section 18, Ref. 2. tag-to-interrogator (T=>R) communications.
9.3 Air interface standards
The ICODE ILT-M fully supports all parts of the ISO 18000-3 Mode 3 (refer to Section 18,
Ref. 1) and the "EPC™ Radio-Frequency Identity Protocols EPC Class-1 HF RFID Air
Interface Protocol for Communications at 13.56 MHz, Version 2.0.3" (refer to Section 18,
Ref. 2).
SL2S1412_SL2S1512_SL2S1612
Product data sheet
COMPANY PUBLIC
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ICODE ILT-M
10. Memory configuration
This section contains all information including commands by which a reader selects,
inventories, and accesses a ICODE ILT-M population
An interrogator manages ICODE ILT-M equipped tag populations using three basic
operations. Each of these operations comprises one or more commands. The operations
are defined as follows
Select:
The process by which an interrogator selects a tag population for inventory
and access. Interrogators may use one or more Select commands to select a
particular tag population prior to inventory.
Inventory:
The process by which an interrogator identifies ICODE ILT-M equipped tags.
An interrogator begins an inventory round by transmitting a BeginRound
command in one of two sessions. One or more tags may reply. The
interrogator detects a single tag reply and requests the PC, EPC, and
CRC-16 from the chip. An inventory round operates in one and only one
session at a time. For an example of an interrogator inventorying and
accessing a single tag refer to Section 18, Ref. 2.
Access:
The process by which an interrogator transacts with (reads from or writes to)
individual tags. An individual tag must be uniquely identified prior to access.
Access comprises multiple commands, some of which employ one-time-pad
based cover-coding of the R=>T link.
10.1 Memory
For the general memory layout according to the standard Section 18, Ref. 2. The tag
memory is logically subdivided into four distinct banks.
In accordance to the standard Section 18, Ref. 2. The tag memory of the ICODE ILT-M is
organized in following 4 memory sections:
Table 5.
Memory sections
Name
Size
Bank
Reserved memory (32-bit ACCESS and 32-bit KILL password)
64 bit
00b
EPC (excluding 16 bit CRC-16 and 16-bit PC)
240 bit
01b
TID (including unique 48 bit serial number)
96 bit
10b
User memory
512 bit
11b
The logical address of all memory banks begin at zero (00h).
SL2S1412_SL2S1512_SL2S1612
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SL2S1412_SL2S1512_SL2S1612
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Addresses 00h
5Fh
TID
MS Byte
LS Byte
Byte 0
MS Bit
Byte 1
07h 08h
Class Identifier
7
0
13h 14h
Mask-Designer Identifier
11
Byte 5
E2h
(EAN.UCC)
1Fh 20h
Model Number
0
11
006h
(NXP)
Byte 6
Byte 11
15
0 3
0000h
Bits
47
47
0
000000000000h - FFFFFFFFFFFFh
1Fh
Version Number
0 6
0000b
SNR
0
18h 19h
1b
5F
XTID Header
0
Sub Version Number
Bits
2Fh Addresses 30h
803h
(ICODE G2 M)
Addresses 14h
Fig 5.
Byte 4
0
0000011b
(ICODE EPC G2 M)
aaa-002934
TID for ICODE ILT-M
Table 6.
Model number
ICODE ILT-M
SI (Status Indicator Bit)
Sub Version No.
Version (Silicon) No.
1
0000b
0000011b
ICODE ILT-M
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TID Example
(ICODE EPC G2 M)
Byte 3
LS Bit
Addresses 00h
Bits
Byte 2
NXP Semiconductors
SL2S1412; SL2S1512; SL2S1612
ICODE ILT-M
10.1.1 Memory map
Table 7.
Memory map
Bank
address
Memory
address
Type
Content
Initial [1]
Remark
Bank 00
00h – 1Fh
Reserved
kill password:
refer to Section 18, Ref. 2
all 00h
unlocked memory
20h – 3Fh
Reserved
access password:
refer to Section 18, Ref. 2
all 00h
unlocked memory
00h – 0Fh
EPC
CRC-16: refer to Section 18,
Ref. 2
10h – 14h
EPC
Backscatter length:
refer to Section 18, Ref. 2
00110b
unlocked memory
15h
EPC
UMI
refer to Section 18, Ref. 2
0b
unlocked memory
16h
EPC
XI: refer to Section 18, Ref. 2 0b
calculated
17h –1Fh
EPC
Numbering system indicator: 00h
refer to Section 18, Ref. 2
unlocked memory
20h - 10Fh
EPC
EPC:
refer to Section 18, Ref. 2
unlocked memory
110h - 1FFh
EPC
RFU
0000h
factory locked memory
200h - 20Fh
EPC
ConfigWord
0000h
unlocked memory
210h - 21Fh
EPC
XPC_W1
0000h
factory locked memory
00h – 07h
TID
allocation class identifier:
refer to Section 18, Ref. 2
1110 0010b
factory locked memory
08h – 13h
TID
tag mask designer identifier:
refer to Section 18, Ref. 2
0000 0000 0110b
factory locked memory
14h – 1Fh
TID
tag model number:
refer to Section 18, Ref. 2
TMNR
factory locked memory
20h – 2Fh
TID
Extended TID header
refer to [Section 18, Ref. 3
XTID Header
locked memory
30h – 5Fh
TID
serial number:
refer to [Section 18, Ref. 2
SNR
locked memory
00h – 1FFh
User
user memory:
refer to [Section 18, Ref. 2
undefined
unlocked memory
Bank 01
Bank 10
Bank 11
[1]
SL2S1412_SL2S1512_SL2S1612
Product data sheet
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memory mapped
calculated CRC
This is the initial memory content when delivered by NXP Semiconductors
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ICODE ILT-M
10.1.1.1
User memory
The User Memory bank contains a sequential block of 512 bits (32 words of 16 bit)
ranging from address 00h to 1Fh. The user memory can be accessed via Select, Read or
Write command and it may be write locked, permanently write locked, unlocked,
permanently unlocked or block permalocked.
10.1.1.2
Supported EPC types
The EPC types are defined in the EPC Tag Standards document from EPCglobal.
These standards define completely that portion of EPC tag data that is standardized,
including how that data is encoded on the EPC tag itself (i.e. the EPC Tag Encodings), as
well as how it is encoded for use in the information systems layers of the EPC Systems
Network (i.e. the EPC URI or Uniform Resource Identifier Encodings).
The EPC Tag Encodings include a Header field followed by one or more Value Fields. The
Header field indicates the length of the Values Fields and contains a numbering system
identifier (NSI). The Value Fields contain a unique EPC Identifier and optional Filter Value
when the latter is judged to be important to encode on the tag itself.
SL2S1412_SL2S1512_SL2S1612
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ICODE ILT-M
11. Interrogator commands and tag replies
For a detailed description refer to Section 18, Ref. 2.
11.1 Commands
An overview of interrogator to tag commands is located in Section 18, Ref. 2.
Note that all mandatory commands are implemented on the ICODE ILT-M according to
the standard. Additionally the optional command Access is supported by the ICODE ILT-M
(for details refer to Section 11.5 “Optional Access Command”). Besides also custom
commands are implemented on the ICODE ILT-M (for details refer to Section 11.7
“Custom Commands”.
11.2 Mandatory Select Commands
Select commands select a particular ICODE ILT-M tag population based on user-defined
criteria.
11.2.1 Select
For a detailed description of the mandatory Select command refer to Section 18, Ref. 2.
11.3 Mandatory Inventory Commands
Inventory commands are used to run the collision arbitration protocol.
11.3.1 BeginRound
For a detailed description of the mandatory BeginRound command refer to Section 18,
Ref. 2.
11.3.2 AdjustRound
For a detailed description of the mandatory AdjustRound command refer to Section 18,
Ref. 2.
11.3.3 NextSlot
For a detailed description of the mandatory NextSlot command refer to Section 18, Ref. 2.
11.3.4 ACK
For a detailed description of the mandatory ACK command refer to Section 18, Ref. 2.
11.3.5 NAK
For a detailed description of the mandatory NAK command refer to Section 18, Ref. 2.
11.4 Mandatory Access Commands
Access commands are used to read or write data from or to the ICODE ILT-M memory.
For a detailed description of the mandatory Access command refer to Section 18, Ref. 2.
SL2S1412_SL2S1512_SL2S1612
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11.4.1 REQ_RN
Access commands are used to read or write data from or to the ICODE ILT-M memory.
For a detailed description of the mandatory Access command refer to Section 18, Ref. 2.
11.4.2 READ
For a detailed description of the mandatory Req_RN command refer to Section 18, Ref. 2.
11.4.3 WRITE
For a detailed description of the mandatory Write command refer to Section 18, Ref. 2.
11.4.4 KILL (RECOMMISSIONING)
Only mandatory asserted Recom bit 3SB is supported.
For a detailed description of the mandatory Kill command refer to Section 18, Ref. 2.
11.4.5 LOCK
For a detailed description of the mandatory Lock command refer to Section 18, Ref. 2.
11.5 Optional Access Command
11.5.1 Access
For a detailed description of the optional Access command refer to Section 18, Ref. 2,
section 6.3.2.10.
11.5.2 BlockPermalock
The User Memory bank is defined in 8 blocks of 4 words each block.
Table 8.
BlockPermalock
Bank address
Memory address
Word
Type
Content
Initial
Bank 11
00h - 3Fh
0 to 3
User
UserMemory Block 0
undefined
Remark
40h - 7Fh
4 to 7
User
UserMemory Block 1
undefined
80h - BFh
8 to 11
User
UserMemory Block 2
undefined
C0h - FFh
12 to 15
User
UserMemory Block 3
undefined
100h - 13Fh
16 to 19
User
UserMemory Block 4
undefined
140h - 17Fh
20 to 23
User
UserMemory Block 5
undefined
180h - 1BFh
24 to 27
User
UserMemory Block 6
undefined
1C0h - 1FFh
28 to 31
User
UserMemory Block 7
undefined
For a detailed description of the optional BlockPermalock command refer to Section 18,
Ref. 2.
11.5.3 BlockWrite
The BlockWrite command supports the writing of up to two data words at once
(WordCount = 00h to 02h). For a detailed description of the optional BlockWrite command
refer to Section 18, Ref. 2.
SL2S1412_SL2S1512_SL2S1612
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11.6 Optional Features
11.6.1 UMI
The UMI (User Memory Indicator bit 15h) of the Protocol-control (PC) word is supported
using Method 2 (written by the reader). For a detailed description of the optional UMI bit
refer to Section 18, Ref. 2.
11.7 Custom Commands
11.7.1 ChangeConfigWord
The ConfigWord is located in the EPC Memory Bank at the memory address 200h - 20Fh.
Dedicated bits in this word control the custom-specific feature EAS. Memory is accessible
with Select and Read sequence.
The ChangeConfigWord command allows to read the dedicated bits in open and secured
state. Changing these dedicated bits is only possible if the access password is not equal
zero and the IC is in the secured state.
Table 9.
Table 10.
ConfigWord
Bank address
Memory address
Type
Initial
Bank 01 (EPC)
200h - 20Eh
RFU
0b
20Fh
EAS Alarm bit
0b
Remark
ConfigWord details
MSB
LSB
200
hex
201
hex
202
hex
203
hex
204
hex
205
hex
206
hex
207
hex
208
hex
209
hex
20A
hex
20B
hex
20C
hex
20D
hex
20E
hex
20F
hex
RFU
RFU
RFU
RFU
RFU
RFU
RFU
RFU
RFU
RFU
RFU
RFU
RFU
RFU
RFU
EAS
alarm
bit
Table 11.
Command coding
Command
RFU
Data
RN
CRC-16
No. of bits
16
8
16
16
16
Description
11100000 00000111
0000 0000
Toggle EAS Bit handle
optionally XOR
RN16
After completing a successful ChangeConfigWord command the ICODE ILT-M
backscatters the reply within 20 ms shown below comprising a header (a 0-bit), the
ConfigWord, the handle, and a CRC-16 calculated over the 0-bit, ConfigWord and handle.
Table 12.
ChangeConfigWord command response
Header
Status bits
RN
CRC-16
No. of bits
1
16
16
16
Description
0
ConfigWord
handle
If the toggle bits are transmitted with a value of 00h the ICODE ILT-M responds with a
successful Change ConfigWord reply (i.e. the ConfigWord) which allows to read the actual
ConfigWord content.
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If the ICODE ILT-M encounters an error during execution of ChangeConfigWord it
backscatters an error code (see Section 18, Ref. 2 for error-code definitions and for the
reply format).
Table 13.
Command response table
Starting state
Condition
Response
Next state
ready
all
-
ready
arbitrate, reply,
acknowledged
all
-
arbitrate
open
valid handle, ConfigWord needs to
change
Backscatter unchanged
ConfigWord immediately
open
valid handle, ConfigWord does not
need to change
Backscatter ConfigWord
immediately
open
valid handle, ConfigWord needs to
change
Backscatter modified
ConfigWord, when done
secured
valid handle, ConfigWord does not
need to change
Backscatter ConfigWord
immediately
secured
invalid handle
-
secured
all
-
killed
secured
killed
11.8 Custom features
11.8.1 EAS
The ICODE ILT-M offers an EAS feature which can be enabled or disabled with the
ChangeConfigWord command by toggling the EAS Alarm bit.
Only tags with the EAS Alarm bit set to 1 will respond to the following command sequence
(inventory round) with their EPC:
1. Select command to the EAS Alarm bit with the parameters
MemBank:
01h (EPC)
Action:
010b (deassert SL if not matching)
Pointer:
20Fh
Mask length:
01h
Mask:
1b
2. BeginRound
3. ACK
11.8.2 FastInitialWrite
If the memory content where data shall be written is completely 00h the write command
will be executed within shorter time. The FastInitialWrite is internally executed for all
commands where the memory content is changed (e.g. Write, Lock, BlockWrite,
BlockPermalock,...).
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12. Limiting values
Table 14. Limiting values (Wafer)[1][2]
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Tstg
Conditions
Min
Max
Unit
storage temperature
55
+125
C
Ptot
total power dissipation
-
125
mW
Tj
junction temperature
40
+85
C
-
60
mA
-
30
mA
-
2
kV
Ii(max)
maximum input current
LA to LB; peak
II
input current
LA to LB; RMS
VESD
electrostatic discharge voltage
[3]
[4]
Human body model
[1]
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any conditions other than those described in the operating conditions and electrical
characteristics sections of this specification is not implied.
[2]
This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static
charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maxima.
[3]
The voltage between LA and LB is limited by the on-chip voltage limitation circuitry (corresponding to parameter II).
[4]
For ESD measurement, the IC was mounted in a CDIP8 package.
13. Characteristics
13.1 Memory characteristics
Table 15.
EEPROM characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tret
retention time
Tamb  55 C
50
-
-
year
Nendu(W)
write endurance
100000
-
-
cycle
13.2 Interface characteristics
Table 16. Interface characteristics
Typical ratings are not guaranteed. The values listed are at room temperature.
Symbol
Parameter
fi
input frequency
Vi(RMS)min
minimum RMS input voltage
Pi(min)
Ci
minimum input power
input capacitance
Conditions
Min
Typ
Max
Unit
13.553
13.56
13.567
MHz
1.5
-
1.7
V
-
40
-
W
SL2S1412FUD
-
-
-
pF
SL2S1512FUD
22.3
23.5
24.7
pF
SL2S1612FUD
92
97
102
pF
[1]
operating read/write
operating
[2]
between LA and LB
[3]
[1]
Bandwidth limitation ( 7 kHz) according to ISM band regulations.
[2]
Including losses in the resonant capacitor and rectifier.
[3]
Measured with an HP4285A LCR meter at 13.56 MHz and 2 V RMS.
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14. Marking
14.1 Marking SOT1122
Table 17.
SL2S1412_SL2S1512_SL2S1612
Product data sheet
COMPANY PUBLIC
Marking SOT1122
Type number
Marking code
SL2S1512FTB
S1
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15. Package outline
XSON3: plastic extremely thin small outline package; no leads; 3 terminals; body 1 x 1.45 x 0.5 mm
b
SOT1122
b1
1
4×
(2)
L1
3
L
e
2
e1
e1
4×
A
(2)
A1
D
type code
E
terminal 1
index area
pin 1 indication
0
1
Dimensions
A(1)
Unit
mm
2 mm
scale
max 0.50
nom
min
A1
b
b1
D
E
0.04
0.45
0.40
0.37
0.55
0.50
0.47
1.50
1.45
1.40
1.05
1.00
0.95
e
e1
L
0.35
0.55 0.425 0.30
0.27
L1
0.30
0.25
0.22
Notes
1. Dimension A is including plating thickness.
2. Can be visible in some manufacturing processes.
Outline
version
IEC
SOT1122
Fig 6.
sot1122_po
References
JEDEC
JEITA
European
projection
Issue date
09-10-09
MO-252
Package outline SOT1122
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16. Bare die outline
(1)
LA
LB
(5)
Y
(6)
(4)
X
(7)
GND
TEST
(8)
(2)
(3)
not to scale!
001aam108
(1) X-scribe line width: 15 m
(2) Y-scribe line width: 15 m
(3) Chip step, X-length: 535 m
(4) Chip step, Y-length: 499 m
(5) Bump to bump distance X (LA - LB): 400 m
(6) Bump to bump distance Y (LB - TEST): 360 m
(7) Distance bump to nitride edge X: 75 m
(8) Distance bump to nitride edge Y: 45 m
Bump size X  Y: 60 m  60 m
Fig 7.
SL2S1412_SL2S1512_SL2S1612
Product data sheet
COMPANY PUBLIC
Wafer SL2S1412FUD and SL2S1512FUD bare die layout
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(1)
LA
LB
(5)
(6)
(4)
Y
X
(7)
GND
TEST
(8)
(2)
(3)
not to scale!
001aam545
(1) X-scribe line width: 15 m
(2) Y-scribe line width: 15 m
(3) Chip step, X-length: 535 m
(4) Chip step, Y-length: 622 m
(5) Bump to bump distance X (LA - LB): 400 m
(6) Bump to bump distance Y (LB - TEST): 517 m
(7) Distance bump to nitride edge X: 75 m
(8) Distance bump to nitride edge Y: 45 m
Bump size X  Y: 60 m  60 m
Fig 8.
SL2S1412_SL2S1512_SL2S1612
Product data sheet
COMPANY PUBLIC
Wafer SL2S1612FUD bare die layout
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17. Abbreviations
Table 18.
SL2S1412_SL2S1512_SL2S1612
Product data sheet
COMPANY PUBLIC
Abbreviations
Acronym
Description
CRC
Cyclic redundancy check
CW
Continuous wave
EEPROM
Electrically Erasable Programmable Read Only Memory
EPC
Electronic Product Code (containing Header, Domain Manager, Object Class
and Serial Number)
FM0
Bi phase space modulation
IC
Integrated Circuit
LSB
Least Significant Byte/Bit
MSB
Most Significant Byte/Bit
NRZ
Non-Return to Zero coding
RF
Radio Frequency
RTF
Reader Talks First
Tari
Type A Reference Interval (ISO 18000-3 mode 3/EPC Class-1 HF)
HF
High Frequency
XXb
Value in binary notation
xxhex
Value in hexadecimal notation
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18. References
[1]
ISO 18000-3M3
[2]
EPC™ Radio-Frequency Identity Protocols EPC Class-1 HF RFID Air Interface
Protocol for Communications at 13.56 MHz, Version 2.0.3
[3]
EPCglobal: EPC Tag Data Standards 1.5
[4]
ECC ERC Recommendation 70-03 Annex 9
[5]
ISO/IEC Directives, Part 2: Rules for the structure and drafting of International
Standards
[6]
ISO/IEC 3309: Information technology – Telecommunications and information
exchange between systems – High-level data link control (HDLC) procedures –
Frame structure
[7]
ISO/IEC 15961: Information technology, Automatic identification and data capture –
Radio frequency identification (RFID) for item management – Data protocol:
application interface
[8]
ISO/IEC 15962: Information technology, Automatic identification and data capture
techniques – Radio frequency identification (RFID) for item management – Data
protocol: data encoding rules and logical memory functions
[9]
ISO/IEC 15963: Information technology — Radio frequency identification for item
management — Unique identification for RF tags
[10] ISO/IEC 18000-1: Information technology — Radio frequency identification for item
management — Part 1: Reference architecture and definition of parameters to be
standardized
[11] ISO/IEC 19762: Information technology AIDC techniques – Harmonized vocabulary
– Part 3: radio-frequency identification (RFID)
[12] U.S. Code of Federal Regulations (CFR), Title 47, Chapter I, Part 15:
Radio-frequency devices, U.S. Federal Communications Commission
[13] General specification for 8” wafer on UV-tape with electronic fail die
marking — Delivery type description – BU-ID document number: 1093**1.
1.
** ... document version number
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19. Revision history
Table 19.
Revision history
Document ID
Release date Data sheet status
Supersedes
SL2S1412_SL2S1512_SL2S1612
v. 3.2
20131008
SL2S1412_SL2S1512_SL2S1612
v. 3.1
Modifications:
SL2S1412_SL2S1512_SL2S1612
v. 3.1
Modifications:
•
•
Type SL2S1512FTB added
Section 14 “Marking” and Section 15 “Package outline”: added
20130923
•
•
167711
Modifications:
167710
SL2S1412_SL2S1512_SL2S1612
Product data sheet
COMPANY PUBLIC
•
•
Product data sheet
SL2S1412_SL2S1512_SL2S1612
v. 1.2
Objective data sheet
167711
Type SL2S1612 added
Section 4 “Ordering information”: updated
20110316
•
SL2S1412_SL2S1512_SL2S1612
v. 3.0
Data sheet status changed into Product data sheet
SL2S1412_SL2S1512_SL2S1612 v. 20120328
1.2
Modifications:
Product data sheet
Security status into COMPANY PUBLIC
SL2S1412_SL2S1512_SL2S1612 v. 20120502
3.0
Modifications:
Product data sheet
Objective data sheet
167710
Update to final version of ISO 18000-3M3
Objective data sheet
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20. Legal information
20.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
20.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
20.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
SL2S1412_SL2S1512_SL2S1612
Product data sheet
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Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
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Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
20.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
ICODE and I-CODE — are trademarks of NXP B.V.
21. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
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22. Tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Ordering information . . . . . . . . . . . . . . . . . . . . . .2
Pin description SOT1122 . . . . . . . . . . . . . . . . . .4
Bonding pad description . . . . . . . . . . . . . . . . . .6
Wafer specification . . . . . . . . . . . . . . . . . . . . . . .7
Memory sections . . . . . . . . . . . . . . . . . . . . . . .10
Model number. . . . . . . . . . . . . . . . . . . . . . . . . . 11
Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . .12
BlockPermalock . . . . . . . . . . . . . . . . . . . . . . . .15
ConfigWord. . . . . . . . . . . . . . . . . . . . . . . . . . . .16
ConfigWord details . . . . . . . . . . . . . . . . . . . . . .16
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Command coding. . . . . . . . . . . . . . . . . . . . . . . 16
ChangeConfigWord command response . . . . . 16
Command response table . . . . . . . . . . . . . . . . 17
Limiting values (Wafer)[1][2] . . . . . . . . . . . . . . . 18
EEPROM characteristics . . . . . . . . . . . . . . . . 18
Interface characteristics . . . . . . . . . . . . . . . . . 18
Marking SOT1122 . . . . . . . . . . . . . . . . . . . . . . 19
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 23
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 25
23. Figures
Fig 1.
Fig 2.
Fig 3.
Fig 4.
Fig 5.
Fig 6.
Fig 7.
Fig 8.
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
Pin configuration for SOT1122. . . . . . . . . . . . . . . .4
Wafer SL2S1412FUD and SL2S1512FUD layout
and pin configuration for the bare die . . . . . . . . . .5
Wafer SL2S1612FUD layout and pin configuration
for the bare die. . . . . . . . . . . . . . . . . . . . . . . . . . . .6
TID for ICODE ILT-M . . . . . . . . . . . . . . . . . . . . . . 11
Package outline SOT1122 . . . . . . . . . . . . . . . . . .20
Wafer SL2S1412FUD and SL2S1512FUD
bare die layout . . . . . . . . . . . . . . . . . . . . . . . . . . .21
Wafer SL2S1612FUD bare die layout . . . . . . . . .22
SL2S1412_SL2S1512_SL2S1612
Product data sheet
COMPANY PUBLIC
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24. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
2.1
Key features . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2.2
Key benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2.3
Custom features . . . . . . . . . . . . . . . . . . . . . . . . 2
3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
4
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
5
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
7
Wafer layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
8
Mechanical specification . . . . . . . . . . . . . . . . . 7
8.1
Wafer specification . . . . . . . . . . . . . . . . . . . . . . 7
8.1.1
Fail die identification . . . . . . . . . . . . . . . . . . . . . 8
8.1.2
Map file distribution. . . . . . . . . . . . . . . . . . . . . . 8
9
Functional description . . . . . . . . . . . . . . . . . . . 9
9.1
Power transfer . . . . . . . . . . . . . . . . . . . . . . . . . 9
9.2
Data transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
9.2.1
Reader to tag Link . . . . . . . . . . . . . . . . . . . . . . 9
9.2.2
Tag to reader Link . . . . . . . . . . . . . . . . . . . . . . . 9
9.3
Air interface standards . . . . . . . . . . . . . . . . . . . 9
10
Memory configuration . . . . . . . . . . . . . . . . . . . 10
10.1
Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
10.1.1
Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 12
10.1.1.1 User memory . . . . . . . . . . . . . . . . . . . . . . . . . 13
10.1.1.2 Supported EPC types . . . . . . . . . . . . . . . . . . . 13
11
Interrogator commands and tag replies . . . . 14
11.1
Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
11.2
Mandatory Select Commands . . . . . . . . . . . . 14
11.2.1
Select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
11.3
Mandatory Inventory Commands . . . . . . . . . . 14
11.3.1
BeginRound . . . . . . . . . . . . . . . . . . . . . . . . . . 14
11.3.2
AdjustRound . . . . . . . . . . . . . . . . . . . . . . . . . . 14
11.3.3
NextSlot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
11.3.4
ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
11.3.5
NAK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
11.4
Mandatory Access Commands. . . . . . . . . . . . 14
11.4.1
REQ_RN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
11.4.2
READ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
11.4.3
WRITE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
11.4.4
KILL (RECOMMISSIONING) . . . . . . . . . . . . . 15
11.4.5
LOCK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
11.5
Optional Access Command . . . . . . . . . . . . . . 15
11.5.1
Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
11.5.2
BlockPermalock . . . . . . . . . . . . . . . . . . . . . . . 15
11.5.3
BlockWrite. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
11.6
Optional Features . . . . . . . . . . . . . . . . . . . . . . 16
11.6.1
11.7
11.7.1
11.8
11.8.1
11.8.2
12
13
13.1
13.2
14
14.1
15
16
17
18
19
20
20.1
20.2
20.3
20.4
21
22
23
24
UMI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Custom Commands . . . . . . . . . . . . . . . . . . . .
ChangeConfigWord . . . . . . . . . . . . . . . . . . . .
Custom features. . . . . . . . . . . . . . . . . . . . . . .
EAS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
FastInitialWrite . . . . . . . . . . . . . . . . . . . . . . . .
Limiting values . . . . . . . . . . . . . . . . . . . . . . . .
Characteristics . . . . . . . . . . . . . . . . . . . . . . . .
Memory characteristics . . . . . . . . . . . . . . . . .
Interface characteristics . . . . . . . . . . . . . . . . .
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Marking SOT1122 . . . . . . . . . . . . . . . . . . . . .
Package outline. . . . . . . . . . . . . . . . . . . . . . . .
Bare die outline . . . . . . . . . . . . . . . . . . . . . . . .
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . .
References. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . .
Legal information . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information . . . . . . . . . . . . . . . . . . . .
Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16
16
16
17
17
17
18
18
18
18
19
19
20
21
23
24
25
26
26
26
26
27
27
28
28
29
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 8 October 2013
167732
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