Data Sheet

SL2S2002; SL2S2102
ICODE SLIX
Rev. 3.3 — 23 August 2012
178033
Product data sheet
COMPANY PUBLIC
1. General description
The ICODE SLIX IC is a dedicated chip for intelligent label applications such as libraries,
product authentication in different industries such as pharmaceutical, medical devices and
alcohol, as well as production management in different areas of the industry. This IC is the
third generation of a product family of smart label ICs based on the ISO standards
ISO/IEC 15693 (Ref. 1) and ISO/IEC 18000-3 (Ref. 4), prolonging a successful story of
NXP in the field of vicinity identification systems.
The ICODE system offers the possibility of operating labels simultaneously in the field of
the reader antenna (anticollision). It is designed for long range applications.
1.1 Contactless energy and data transfer
Whenever connected to a very simple and easy-to-produce type of antenna (as a result of
the 13.56 MHz carrier frequency) made out of a few windings printed, winded, etched or
punched coil, the ICODE SLIX IC can be operated without line of sight up to a distance of
1.5 m (gate width). No battery is needed. When the smart label is positioned in the field of
an interrogator antenna, the high speed RF communication interface enables data to be
transmitted up to 53 kbit/s.
1.2 Anticollision
An intelligent anticollision function enables several tags to operate in the field
simultaneously. The anticollision algorithm selects each tag individually and ensures that
the execution of a transaction with a selected tag is performed correctly without data
corruption resulting from other tags in the field.
1.3 Security and privacy aspects
• Unique IDentifier (UID):
The UID cannot be altered and guarantees the uniqueness of each label.
• Password protected EAS and AFI functionality:
The 32-bit EAS/AFI password enables the addressed label to be set in a mode where
the EAS status and the AFI value can only be changed if the correct EAS/AFI
password is transmitted to the label within the mentioned commands.
SL2S2002; SL2S2102
NXP Semiconductors
ICODE SLIX
2. Features and benefits
2.1 ICODE SLIX RF interface (ISO/IEC 15693)











Contactless transmission of data and supply energy (no battery needed)
Operating distance: up to 1.5 m (depending on antenna geometry)
Operating frequency: 13.56 MHz (ISM, world-wide licence freely available)
Fast data transfer: up to 53 kbit/s
High data integrity: 16-bit CRC, framing
True anticollision
Password protected Electronic Article Surveillance (EAS)
Password protected Application Family Identifier (AFI)
Data Storage Format Identifier (DSFID)
Additional fast anticollision read
Write distance equal to read distance
2.2 EEPROM
 1024 bits, organized in 32 blocks of 4 bytes each
 50 years data retention
 Write endurance of 100000 cycles
2.3 Security




Unique identifier for each device
Lock mechanism for each user memory block (write protection)
Lock mechanism for DSFID, AFI, EAS
Password (32-bit) protected EAS and AFI functionality
3. Applications





SL2S2002_SL2S2102
Product data sheet
COMPANY PUBLIC
Libraries
Item level tagging in pharmaceutical supply chains
Counterfeit protection for consumer goods
Industrial applications
Asset and document tracking
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ICODE SLIX
4. Ordering information
Table 1.
Ordering information
Type number
Package
Version
Name
Description
SL2S2002FUD
wafer
sawn, bumped wafer, 120 m, on film frame carrier,
Ci between LA and LB = 23.5 pF (typical)
-
SL2S2102FUD
wafer
sawn, bumped wafer, 120 m, on film frame carrier,
Ci between LA and LB = 97 pF (typical)
-
SL2S2002FTB
XSON3 plastic extremely thin small outline package; no leads; SOT1122
3 terminals; body 1 x 1.45 x 0.5 mm;
Ci between LA and LB = 23.5 pF (typical)
SL2S2102FTB
XSON3 plastic extremely thin small outline package; no leads; SOT1122
3 terminals; body 1 x 1.45 x 0.5 mm;
Ci between LA and LB = 97 pF (typical)
5. Block diagram
ANALOG
RF INTERFACE
DIGITAL CONTROL
EEPROM
VREG
PAD
VDD
ANTICOLLISION
LA
RECT
DEMOD
READ/WRITE
CONTROL
data
in
ANTENNA
Cres
MEMORY
ACCESS CONTROL
MOD
data
out
EEPROM INTERFACE
CONTROL
R/W
CLK
PAD
Clock
RF INTERFACE
CONTROL
LB
SEQUENCER
CHARGE PUMP
001aam247
Fig 1.
SL2S2002_SL2S2102
Product data sheet
COMPANY PUBLIC
Block diagram of ICODE SLIX
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ICODE SLIX
6. Pinning information
SL2S2002
SL2S2102
LA
2
1
LB
n.c.
3
001aan361
Transparent top view
Fig 2.
Table 2.
SL2S2002_SL2S2102
Product data sheet
COMPANY PUBLIC
Pin configuration for SOT1122
Pin description SOT1122
Pin
Symbol
Description
1
LB
antenna RF input
2
LA
antenna RF input
3
n.c.
not connected
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ICODE SLIX
7. Wafer layout
LA
LB
GND
TEST
not to scale
Fig 3.
SL2S2002_SL2S2102
Product data sheet
COMPANY PUBLIC
001aam246
Wafer SL2S2002FUD layout and pin configuration for the bare die
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ICODE SLIX
LA
LB
GND
TEST
not to scale
Fig 4.
001aam546
Wafer SL2S2102FUD layout and pin configuration for the bare die
7.1 Bonding pad description
SL2S2002_SL2S2102
Product data sheet
COMPANY PUBLIC
Table 3.
Bonding pad description
Symbol
Description
LA
antenna RF input
LB
antenna RF input
GND
ground
TEST
test input
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ICODE SLIX
8. Mechanical specification
8.1 Wafer specification
See Ref. 6 “General specification for 8” wafer on UV-tape with electronic fail die marking”.
Table 4.
Wafer specification
Wafer
Designation
each wafer is enscribed with batch number and wafer number
Diameter
200 mm (8 inches)
Thickness
120 m  15 m
Process
CMOS 0.14 m
Batch size
25 wafers
Dies per wafer
SL2S2002FUD
110050
SL2S2102FUD
88225
Wafer backside
Material
Si
Treatment
ground and stress release
Roughness
Ra minimum = 0.5 m
Rt maximum = 5 m
Chip dimensions
Die size without scribe
SL2S2002FUD
520 m  484 m = 251680 mm2
SL2S2102FUD
520 m  607 m = 315640 mm2
Scribe line width
X-dimension
15 m (scribe line width measured between nitride edges)
Y-dimension
15 m (scribe line width measured between nitride edges)
Number of pads
4
Pad location
non-diagonal/placed in chip corners
Distance pad to pad LA to LB
400 m
Distance pad to pad LB to TEST
SL2S2002FUD
360 m
SL2S2102FUD
517 m
Passivation on front
Type
sandwich structure
Material
PE-nitride (on top)
Thickness
1.75 m total thickness of passivation
Au bump
Material
>99.9 % pure Au
Hardness
35 HV to 80 HV 0.005
Shear strength
>70 MPa
Height
18 m
Height uniformity
SL2S2002_SL2S2102
Product data sheet
COMPANY PUBLIC
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ICODE SLIX
Table 4.
Wafer specification
within a die
2 m
within a wafer
3 m
wafer to wafer
4 m
1.5 m
Bump flatness
Bump size
LA, LB
60 m  60 m
TEST, GND
60 m  60 m
variation
5 m
Under bump metallization
sputtered TiW
8.1.1 Fail die identification
No inkdots are applied to the wafer.
Electronic wafer mapping (SECS II format) covers the electrical test results and
additionally the results of mechanical/visual inspection.
See Ref. 6 “General specification for 8” wafer on UV-tape with electronic fail die marking”.
8.1.2 Map file distribution
See Ref. 6 “General specification for 8” wafer on UV-tape with electronic fail die marking”.
SL2S2002_SL2S2102
Product data sheet
COMPANY PUBLIC
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ICODE SLIX
9. Functional description
9.1 Block description
The ICODE SLIX IC consists of three major blocks:
• Analog RF interface
• Digital controller
• EEPROM
The analog section provides stable supply voltage and demodulates data received from
the reader for processing by the digital section. The analog section’s modulation transistor
also transmits data back to the reader.
The digital section includes the state machines, processes the protocol and handles
communication with the EEPROM.
The label requires no internal power supply. Its contactless interface generates the power
supply and the system clock via the resonant circuitry by inductive coupling to the
interrogator. The interface also demodulates data that are transmitted from the
interrogator to the ICODE Label, and modulates the electromagnetic field for data
transmission from the ICODE Label to the interrogator.
Data are stored in a non-volatile memory (EEPROM).
9.2 Memory organization
The 1024 bit EEPROM memory is divided into 32 blocks. A block is the smallest access
unit. Each block consists of 4 bytes (1 block = 32 bits). Bit 0 in each byte represents the
least significant bit (LSB) and bit 7 the most significant bit (MSB), respectively.
The memory is divided into 2 parts:
• Configuration area
Within this part of the memory all required information is stored, such as UID, write
protection, access control information, passwords, AFI and EAS. This memory area
cannot be directly accessed.
• User memory
Within the 896 bit memory area the user data are stored. Direct read/write access to
this part of the memory is possible depending on the related write protection
conditions.
SL2S2002_SL2S2102
Product data sheet
COMPANY PUBLIC
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ICODE SLIX
Table 5.
Memory organization
Block
Byte 0
Byte 1
Byte 2
Byte 3
Description
Configuration area for
internal use
0
User memory:
1
28 blocks,
2
4 bytes each,
:
:
:
:
112 bytes in total.
:
25
26
27
Blocks 0 to 27 can be addressed with read and write commands only.
9.2.1 Unique identifier
The 64-bit unique identifier (UID) is programmed during the production process according
to ISO/IEC 15693-3 and cannot be changed afterwards.
The 64 bits are numbered according to ISO/IEC 15693-3 starting with LSB 1 and ending
with MSB 64. This is in contrast to the general used bit numbering within a byte.
The TAG type is a part of the UID (bit 41 to 48, next to the manufacturer code which is
“04h” for NXP Semiconductors).
The TAG type of the ICODE SLIX IC is “01h”.
Bit 37 is set to logic 1 for the ICODE SLIX IC which indicates that this type supports the
password protected EAS/AFI feature (not supported by ICODE SLI SL2ICS2001 with
bit 37 set to logic 0).
Table 6.
Unique identifier
MSB
64:57
SL2S2002_SL2S2102
Product data sheet
COMPANY PUBLIC
LSB
56:49
48:41
“E0”
“04”
“01”
UID 7
UID 6
UID 5
40:1
IC manufacturer serial number
UID 4
UID 3
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178033
UID 2
UID 1
UID 0
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ICODE SLIX
9.2.2 Configuration of delivered ICs
ICODE SLIX ICs are delivered with the following configuration by NXP Semiconductors:
• Unique identifier is unique and read only
• Write access conditions allow change to user blocks, AFI, DSFID, EAS and
passwords
•
•
•
•
•
•
Status of EAS mode is not defined
AFI is supported and not defined
All EAS/AFI password bytes are 00h
EAS and AFI password protection is disabled
DSFID is supported and not defined
User data memory is not defined
Remark: Because the EAS mode is undefined at delivery, the EAS mode shall be set
(enabled or disabled) according to your application requirements during the test or
initialization phase.
Remark: If EAS and/or AFI password protection is not required in the targeted application,
it is recommended a random EAS/AFI password is written during the label initialization.
9.3 Communication principle
For detailed description of the protocol and timing please refer to ISO/IEC 15693-2
(modulation, bit-coding, framing, Ref. 2) and ISO/IEC 15693-3 (anticollision, timing,
protocol, Ref. 3).
9.4 Supported commands
9.4.1 Mandatory commands
9.4.1.1
INVENTORY
As defined in ISO/IEC 15693-3.
9.4.1.2
STAY QUIET
As defined in ISO/IEC 15693-3.
SL2S2002_SL2S2102
Product data sheet
COMPANY PUBLIC
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ICODE SLIX
9.4.2 Optional commands
9.4.2.1
READ SINGLE BLOCK
As defined in ISO/IEC 15693-3.
Option 0 (Option flag not set) is supported.
Option 1 (Option flag set) is supported.
9.4.2.2
WRITE SINGLE BLOCK
As defined in ISO/IEC 15693-3.
Option 0 (Option flag not set) is supported.
Option 1 (Option flag set) is supported.
9.4.2.3
LOCK BLOCK
As defined in ISO/IEC 15693-3.
Option 0 (Option flag not set) is supported.
Option 1 (Option flag set) is supported.
9.4.2.4
READ MULTIPLE BLOCKS
As defined in ISO/IEC 15693-3.
Option 0 (Option flag not set) is supported.
Option 1 (Option flag set) is supported.
Remark: If the sum of the first block number and the number of blocks exceeds the total
available number of user blocks, the number of transmitted blocks is less than the
requested number of blocks, which means that the last returned block is the highest
available user block, followed by the 16-bit CRC and the EOF.
9.4.2.5
SELECT
As defined in ISO/IEC 15693-3.
9.4.2.6
RESET TO READY
As defined in ISO/IEC 15693-3.
9.4.2.7
WRITE AFI
As defined in ISO/IEC 15693-3.
Option 0 (Option flag not set) is supported.
Option 1 (Option flag set) is supported.
Remark: This command maybe password protected, refer to Section 9.4.3.11
“PASSWORD PROTECT EAS/AFI”.
SL2S2002_SL2S2102
Product data sheet
COMPANY PUBLIC
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ICODE SLIX
9.4.2.8
LOCK AFI
As defined in ISO/IEC 15693-3.
Option 0 (Option flag not set) is supported.
Option 1 (Option flag set) is supported.
Remark: This command maybe password protected, refer to Section 9.4.3.11
“PASSWORD PROTECT EAS/AFI”.
9.4.2.9
WRITE DSFID
As defined in ISO/IEC 15693-3.
Option 0 (Option flag not set) is supported.
Option 1 (Option flag set) is supported.
9.4.2.10
LOCK DSFID
As defined in ISO/IEC 15693-3.
Option 0 (Option flag not set) is supported.
Option 1 (Option flag set) is supported.
9.4.2.11
GET SYSTEM INFORMATION
As defined in ISO/IEC 15693-3.
The TAG type of the ICODE SLIX is “01h”.
9.4.2.12
GET MULTIPLE BLOCK SECURITY STATUS
As defined in ISO/IEC 15693-3.
Remark: If the sum of the first block number and the number of blocks exceeds the total
available number of user blocks the number of transmitted security status bytes is less
than the requested number, which means that the last returned status byte is the one
corresponding to the highest available user block, followed by the 16-bit CRC and the
EOF.
9.4.3 Custom commands
The manufacturer code of NXP Semiconductors is defined in ISO/IEC 7816-6A1 (Ref. 5).
It has the value “04h”.
For the structure of custom commands please refer to ISO/IEC 15693-3.
If not explicitly specified differently all address modes are supported.
9.4.3.1
GET RANDOM NUMBER
Command code = B2h
The GET RANDOM NUMBER command is required to receive a random number from the
label IC. The passwords that will be transmitted with the SET PASSWORD command
have to be calculated with the password and the random number (see Section 9.4.3.2
“SET PASSWORD”).
SL2S2002_SL2S2102
Product data sheet
COMPANY PUBLIC
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ICODE SLIX
The different passwords are addressed with the password identifier.
Table 7.
SOF
Flags
GET
RANDOM
NUMBER
IC Mfg
code
UID
CRC16
EOF
-
8 bits
8 bits
8 bits
64 bits
optional
16 bits
-
Table 8.
Response format when Error_flag set
SOF
Flags
Error code
CRC16
EOF
-
8 bits
8 bits
16 bits
-
Table 9.
9.4.3.2
Request format
Response format when Error_flag NOT set
SOF
Flags
Random number CRC16
EOF
-
8 bits
16 bits
-
16 bits
SET PASSWORD
Command code = B3h
The SET PASSWORD command enables the EAS/AFI password to be transmitted to the
label to access EAS and/or AFI (if the EAS and/or AFI password is enabled). The SET
PASSWORD command has to be executed just once for the related password if the label
is powered.
Remark: The SET PASSWORD command can only be executed in Addressed or
Selected mode.
The XOR password has to be calculated with the password and two times the received
random number from the last GET RANDOM NUMBER command:
XOR_Password[31:0] = Password[31:0] XOR {Random_Number[15:0],
Random_Number[15:0]}.
The EAS/AFI password is addressed with the password identifier.
Table 10.
Flags
SET
PASSWORD
IC Mfg
code
UID
-
8 bits
8 bits
8 bits
64 bits 8 bits
optional
Table 11.
Product data sheet
COMPANY PUBLIC
Password XOR
identifier password
32 bits
CRC16
EOF
16 bits
-
Password Identifier
Password identifier
Password
10h
EAS/AFI
Table 12.
SL2S2002_SL2S2102
Request format
SOF
Response format when Error_flag set
SOF
Flags
Error code
CRC16
EOF
-
8 bits
8 bits
16 bits
-
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ICODE SLIX
Table 13.
Response format when Error_flag NOT set
SOF
Flags
CRC16
EOF
-
8 bits
16 bits
-
Remark: If the IC receives an invalid password, it will not execute any following command
until a Power-On Reset (POR) (RF reset) is executed.
9.4.3.3
WRITE PASSWORD
Command code = B4h
The WRITE PASSWORD command enables a new password to be written into the related
memory if the related old password has already been transmitted with a SET PASSWORD
command and the addressed password is not locked (see Section 9.4.3.4 “LOCK
PASSWORD”).
Remark: The WRITE PASSWORD command can only be executed in addressed or
selected mode. The new password takes effect immediately which means that the new
password has to be transmitted with the SET PASSWORD command to access protected
blocks.
The EAS/AFI password is addressed with the password identifier.
The timing of the command is write alike.
Option 0 (Option flag not set) is supported.
Option 1 (Option flag set) is supported.
Table 14.
SOF Flags
WRITE
PASSWORD
IC Mfg
code
UID
Password
identifier
Password CRC16
EOF
-
8 bits
8 bits
64 bits
optional
8 bits
32 bits
-
8 bits
Table 15.
Password
10h
EAS/AFI
Response format when Error_flag set
SOF
Flags
Error code
CRC16
EOF
-
8 bits
8 bits
16 bits
-
Table 17.
Product data sheet
COMPANY PUBLIC
16 bits
Password identifier
Password identifier
Table 16.
SL2S2002_SL2S2102
Request format
Response format when Error_flag NOT set
SOF
Flags
CRC16
EOF
-
8 bits
16 bits
-
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ICODE SLIX
9.4.3.4
LOCK PASSWORD
Command code = B5h
The LOCK PASSWORD command enables the addressed password to be locked if the
related password has already been transmitted with a SET PASSWORD command. A
locked password cannot be changed.
The EAS/AFI password is addressed with the password identifier.
The timing of the command is write alike.
Option 0 (Option flag not set) is supported.
Option 1 (Option flag set) is supported.
Table 18.
Flags
LOCK
PASSWORD
IC Mfg
code
UID
Password
identifier
CRC16
EOF
-
8 bits
8 bits
8 bits
64 bits
optional
8 bits
16 bits
-
Table 19.
Password identifier
Password identifier
Password
10h
EAS/AFI
Table 20.
Response format when Error_flag set
SOF
Flags
Error code
CRC16
EOF
-
8 bits
8 bits
16 bits
-
Table 21.
9.4.3.5
Request format
SOF
Response format when Error_flag NOT set
SOF
Flags
CRC16
EOF
-
8 bits
16 bits
-
INVENTORY READ
Command code = A0h
When receiving the INVENTORY READ request, the ICODE SLIX IC performs the same
as the anticollision sequence, with the difference that instead of the UID and the DSFID,
the requested memory content is re-transmitted from the ICODE SLIX IC.
If an error is detected, the ICODE SLIX IC remains silent.
If the Option flag is set to logic 0, n blocks of data are re-transmitted. If the Option flag is
set to 1, n blocks of data and the part of the UID which is not part of the mask are
re-transmitted.
The request contains:
• Flags
• INVENTORY READ command code
• IC manufacturer code
SL2S2002_SL2S2102
Product data sheet
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ICODE SLIX
•
•
•
•
•
•
Table 22.
AFI (if AFI flag set)
Mask length
Mask value (if mask length > 0)
First block number to be read
Number of blocks to be read
CRC 16
Request format
SOF
Flags
INVENTORY
READ
IC Mfg
code
AFI
Mask
length
Mask
value
First block Number
number
of blocks
CRC16
EOF
-
8 bits
8 bits
8 bits
8 bits
optional
8 bits
0 to 64
bits
8 bits
16 bits
-
8 bits
The Inventory_flag must be set to logic 1.
The meaning of flags 5 to 8 is in accordance with table 5 in ISO/IEC 15693-3.
The number of blocks in the request is one less than the number of blocks that the ICODE
SLIX IC returns in its response.
If the Option flag in the request is set to logic 0 the response contains:
Table 23.
Response format: Option flag logic 0
SOF
Flags
-
8 bits
Data
CRC16
EOF
Block length
16 bits
-
Repeated as needed
The ICODE SLIX IC reads the requested block(s) and sends back their value in the
response. The mechanism and timing of the INVENTORY READ command performs the
same as the INVENTORY command which is described in clause 8 of ISO/IEC 15693-3.
If the Option flag in the request is set to logic 1, the response contains:
Table 24.
Response format: Option flag logic 1
SOF
Flags
Rest of UID which is not part of Data
the mask and slot number
CRC16
EOF
-
8 bits
0 to 64 bit
Block length
16 bits
-
Multiple of 8 bits
Repeated as needed
The ICODE SLIX IC reads the requested block(s) and sends back their value in the
response. Additionally the bytes of the UID, which are not parts of the mask and the slot
number in case of 16 slots, are returned. Instead of padding with zeros up to the next byte
boundary, the corresponding bits of the UID are returned. The mechanism and timing of
the INVENTORY READ command perform the same as the INVENTORY command
which is described in clause 8 of ISO/IEC 15693-3.
Remark: The number of bits of the re-transmitted UID can be calculated as follows:
• 16 slots: 60 bits (bit 64 to bit 4) - mask length rounded up to the next byte boundary
• 1 slot: 64 bits - mask length rounded up to the next byte boundary
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ICODE SLIX
Remark: If the sum of first block number and number of blocks exceeds the total available
number of user blocks, the number of transmitted blocks is less than the requested
number of blocks, which means that the last returned block is the highest available user
block, followed by the 16-bit CRC and the EOF.
Example: mask length = 30 bits
Returned: bit 64 to bit 4 (30 bits) = 30 gives 4 bytes
Table 25.
Byte 0
Example: mask length = 30
Byte 1
Byte 2
Byte 3
Byte 4
Byte 5
mask value including padding with
zeros
Byte 6
Byte 7
-
transmitted by
interrogator
returned value
9.4.3.6
UID
transmitted by
ICODE SLIX IC
FAST INVENTORY READ
Command code = A1h
When receiving the FAST INVENTORY READ command the ICODE SLIX IC behaves the
same as the INVENTORY READ command with the following exceptions:
The data rate in the direction ICODE SLIX IC to the interrogator is twice that defined in
ISO/IEC 15693-3 depending on the Datarate_flag 53 kbit (high data rate) or 13 kbit (low
data rate).
The data rate from the interrogator to the ICODE SLIX IC and the time between the rising
edge of the EOF from the interrogator to the ICODE SLIX IC remain unchanged (stay the
same as defined in ISO/IEC 15693-3).
In the ICODE SLIX IC to the interrogator direction, only the single subcarrier mode is
supported.
9.4.3.7
SET EAS
Command code = A2h
The SET EAS command enables the EAS mode if the EAS mode is not locked. If the EAS
mode is password protected the EAS password has to be first transmitted with the SET
PASSWORD command.
The timing of the command is write alike.
Option 0 (Option flag not set) is supported.
Option 1 (Option flag set) is supported.
Table 26.
SL2S2002_SL2S2102
Product data sheet
COMPANY PUBLIC
Request format
SOF
Flags
SET EAS
IC Mfg code
UID
CRC16
EOF
-
8 bits
8 bits
8 bits
64 bits
optional
16 bits
-
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ICODE SLIX
Table 27.
SOF
Flags
Error code
CRC16
EOF
-
8 bits
8 bits
16 bits
-
Table 28.
9.4.3.8
Response format when Error_flag set
Response format when Error_flag NOT set
SOF
Flags
CRC16
EOF
-
8 bits
16 bits
-
RESET EAS
Command code = A3h
The RESET EAS command disables the EAS mode if the EAS mode is not locked. If the
EAS mode is password protected the EAS password has to be first transmitted with the
SET PASSWORD command.
The timing of the command is write alike.
Option 0 (Option flag not set) is supported.
Option 1 (Option flag set) is supported.
Table 29.
SOF
Flags
RESET EAS
IC Mfg code
UID
CRC16
EOF
-
8 bits
8 bits
8 bits
64 bits
optional
16 bits
-
Table 30.
Response format when Error_flag set
SOF
Flags
Error code
CRC16
EOF
-
8 bits
8 bits
16 bits
-
Table 31.
9.4.3.9
Request format
Response format when Error_flag NOT set
SOF
Flags
CRC16
EOF
-
8 bits
16 bits
-
LOCK EAS
Command code = A4h
The LOCK EAS command locks the current state of the EAS mode and the EAS ID. If the
EAS mode is password protected the EAS password has to be first transmitted with the
SET PASSWORD command.
The timing of the command is write alike.
Option 0 (Option flag not set) is supported.
Option 1 (Option flag set) is supported.
Table 32.
SL2S2002_SL2S2102
Product data sheet
COMPANY PUBLIC
Request format
SOF
Flags
LOCK EAS
IC Mfg code
UID
CRC16
EOF
-
8 bits
8 bits
8 bits
64 bits
optional
16 bits
-
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ICODE SLIX
Table 33.
SOF
Flags
Error code
CRC16
EOF
-
8 bits
8 bits
16 bits
-
Table 34.
9.4.3.10
Response format when Error_flag set
Response format when Error_flag NOT set
SOF
Flags
CRC16
EOF
-
8 bits
16 bits
-
EAS ALARM
Command code = A5h
If the EAS mode is enabled, the EAS sequence is returned from the ICODE SLIX IC.
Table 35.
Request format
SOF
Flags
EAS
ALARM
IC Mfg code
UID
CRC16
EOF
-
8 bits
8 bits
8 bits
64 bits
optional
16 bits
-
If an error is detected the ICODE SLIX IC remains silent.
Table 36.
Response format
SOF
Flags
EAS sequence
CRC16
EOF
-
8 bits
256 bits
16 bits
-
EAS sequence (starting with the LSB, which is transmitted first; read from left to right):
11110100
00010111
01000001
10001111
11001101
10001101
01011011
00111001
01000110
00000001
01011001
10001011
00001110
00011100
01100001
01001000
10101011
01001011
11110110
10100101
11100101
10000001
11110101
01001110
00001001
10010010
11010001
11101100
11111110
01101110
00001101
11110111
If the EAS mode is disabled the ICODE SLIX IC remains silent.
9.4.3.11
PASSWORD PROTECT EAS/AFI
Command code = A6h
The PASSWORD PROTECT EAS/AFI command enables the password protection for
EAS and/or AFI if the EAS/AFI password is first transmitted with the SET PASSWORD
command.
Option flag set to logic 0: EAS will be password protected.
Option flag set to logic 1: AFI will be password protected.
Both password protections (AFI and EAS) can be enabled separately.
Remark: Independent of the Option flag, this write-alike command will be executed like a
write command with Option flag 0 (Option flag not set).
Once the EAS/AFI password protection is enabled, it is not possible to change back to
unprotected EAS and/or AFI.
The timing of the command is write alike (as write command with Option flag 0).
SL2S2002_SL2S2102
Product data sheet
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ICODE SLIX
Table 37.
Request format
SOF
Flags
PASSWORD
PROTECT EAS/AFI
IC Mfg code
UID
CRC16
EOF
-
8 bits
8 bits
8 bits
64 bits optional
16 bits
-
Table 38.
Response format when Error_flag set
SOF
Flags
Error code
CRC16
EOF
-
8 bits
8 bits
16 bits
-
Table 39.
Response format when Error_flag NOT set
SOF
Flags
CRC16
EOF
-
8 bits
16 bits
-
9.5 Error handling
9.5.1 Transmission errors
According to ISO/IEC 15693 the label IC will not respond if a transmission error (CRC, bit
coding, bit count, wrong framing) is detected and will silently wait for the next correct
received command.
9.5.2 Not supported commands or options
If the received command or option is not supported, the behavior of the label IC depends
on the addressing mechanism.
9.5.2.1
Non Addressed Mode
The label IC remains silent.
9.5.2.2
Addressed or Selected Mode
The addressed or selected label IC responds with the error code “0Fh” (error with no
information given or error code is not supported).
If the Inventory flag or the Protocol Extension flag is set, the label IC will not respond if the
command or option is not supported.
9.5.3 Parameter out of range
9.5.3.1
Read commands
If the sum of the first block number and the number of blocks exceeds the total available
number of user blocks, the number of transmitted blocks is less than the requested
number of blocks, which means that the last returned block is the highest available user
block, followed by the 16-bit CRC and the EOF.
9.5.3.2
Write and lock commands
If the address of a block to be written does not exist or a block to be written is locked, the
behaviour of the label IC depends on the addressing mechanism.
Non Addressed Mode
• The label IC remains silent and aborts the command without writing anything.
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ICODE SLIX
Addressed or Selected Mode
• The addressed or selected label IC responds with the error code “0Fh”(error with no
information given or error code is not supported).
9.6 Data integrity
Following mechanisms are implemented in the contactless communication link between
interrogator and label to ensure very reliable data transmission:
•
•
•
•
16-bit CRC per block
Bit count checking
Bit coding to distinguish between logic 1, logic 0, and no information
Channel monitoring (protocol sequence and bit stream analysis)
9.7 RF interface
The definition of the RF interface is according to the standard ISO/IEC 15693-2 and
ISO/IEC 15693-3.
10. Limiting values
Table 40. Limiting values (Wafer)[1][2]
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Tstg
storage temperature
55
+125
C
Ptot
total power dissipation
-
125
mW
Tj
junction temperature
40
+85
C
-
60
mA
-
30
mA
-
2
kV
Ii(max)
maximum input current
LA to LB; peak
II
input current
LA to LB; RMS
VESD
electrostatic discharge voltage
Human body model
Min
[3]
[4]
Max
Unit
[1]
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any conditions other than those described in the operating conditions and electrical
characteristics sections of this specification is not implied.
[2]
This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static
charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maxima.
[3]
The voltage between LA and LB is limited by the on-chip voltage limitation circuitry (corresponding to parameter II).
[4]
For ESD measurement, the IC was mounted in a CDIP8 package.
SL2S2002_SL2S2102
Product data sheet
COMPANY PUBLIC
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ICODE SLIX
11. Characteristics
11.1 Memory characteristics
Table 41.
EEPROM characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tret
retention time
Tamb  55 C
50
-
-
year
Nendu(W)
write endurance
100000
-
-
cycle
11.2 Interface characteristics
Table 42. Interface characteristics
Typical ratings are not guaranteed. The values listed are at room temperature.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
13.553
13.56
13.567
MHz
1.5
-
1.7
V
-
40
-
W
SL2S2002FUD
SL2S2002FTB
22.3
23.5
24.7
pF
SL2S2102FUD
SL2S2102FTB
92
97
102
pF
[1]
fi
input frequency
Vi(RMS)min
minimum RMS input voltage
operating read/write
Pi(min)
minimum input power
operating
[2]
Ci
input capacitance
between LA and LB
[3]
[1]
Bandwidth limitation ( 7 kHz) according to ISM band regulations.
[2]
Including losses in the resonant capacitor and rectifier.
[3]
Measured with an HP4285A LCR meter at 13.56 MHz and 2 V RMS.
12. Marking
12.1 Marking SOT1122
Table 43.
SL2S2002_SL2S2102
Product data sheet
COMPANY PUBLIC
Marking SOT1122
Type number
Marking code
SL2S2002FTB
20
SL2S2102FTB
21
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ICODE SLIX
13. Package outline
XSON3: plastic extremely thin small outline package; no leads; 3 terminals; body 1 x 1.45 x 0.5 mm
b
SOT1122
b1
1
4×
(2)
L1
3
L
e
2
e1
e1
4×
A
(2)
A1
D
type code
E
terminal 1
index area
pin 1 indication
0
1
Dimensions
A(1)
Unit
mm
2 mm
scale
max 0.50
nom
min
A1
b
b1
D
E
0.04
0.45
0.40
0.37
0.55
0.50
0.47
1.50
1.45
1.40
1.05
1.00
0.95
e
e1
L
0.35
0.55 0.425 0.30
0.27
L1
0.30
0.25
0.22
Notes
1. Dimension A is including plating thickness.
2. Can be visible in some manufacturing processes.
Outline
version
IEC
SOT1122
Fig 5.
sot1122_po
References
JEDEC
JEITA
European
projection
Issue date
09-10-09
MO-252
Package outline SOT1122
SL2S2002_SL2S2102
Product data sheet
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ICODE SLIX
14. Bare die outline
(1)
LA
LB
(5)
Y
(6)
(4)
X
(7)
GND
TEST
(8)
(2)
(3)
not to scale!
001aam108
(1) X-scribe line width: 15 m
(2) Y-scribe line width: 15 m
(3) Chip step, X-length: 535 m
(4) Chip step, Y-length: 499 m
(5) Bump to bump distance X (LA - LB): 400 m
(6) Bump to bump distance Y (LB - TEST): 360 m
(7) Distance bump to nitride edge X: 75 m
(8) Distance bump to nitride edge Y: 45 m
Bump size X  Y: 60 m  60 m
Fig 6.
SL2S2002_SL2S2102
Product data sheet
COMPANY PUBLIC
Wafer SL2S2002FUD bare die layout
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ICODE SLIX
(1)
LA
LB
(5)
(6)
(4)
Y
X
(7)
GND
TEST
(8)
(2)
(3)
not to scale!
001aam545
(1) X-scribe line width: 15 m
(2) Y-scribe line width: 15 m
(3) Chip step, X-length: 535 m
(4) Chip step, Y-length: 622 m
(5) Bump to bump distance X (LA - LB): 400 m
(6) Bump to bump distance Y (LB - TEST): 517 m
(7) Distance bump to nitride edge X: 75 m
(8) Distance bump to nitride edge Y: 45 m
Bump size X  Y: 60 m  60 m
Fig 7.
SL2S2002_SL2S2102
Product data sheet
COMPANY PUBLIC
Wafer SL2S2102FUD bare die layout
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ICODE SLIX
15. Abbreviations
Table 44.
Abbreviations
Acronym
Description
AFI
Application Family Identifier
CRC
Cyclic Redundancy Check
DSFID
Data Storage Format Identifier
EAS
Electronic Article Surveillance
EEPROM
Electrically Erasable Programmable Read Only Memory
EOF
End Of Frame
IC
Integrated Circuit
LCR
Inductance, Capacitance, Resistance
LSB
Least Significant Byte/Bit
MSB
Most Significant Byte/Bit
RF
Radio Frequency
SOF
Start Of Frame
UID
Unique IDentifier
16. References
1.
[1]
ISO Standard — ISO/IEC 15693 - Identification cards - Contactless integrated
circuit cards - Vicinity cards.
[2]
ISO Standard — ISO/IEC 15693-2 -Identification cards - Contactless integrated
circuit cards - Vicinity cards - Part 2: Air interface and initialization.
[3]
ISO Standard — ISO/IEC 15693-3 -Identification cards - Contactless integrated
circuit cards - Vicinity cards - Part 3: Anticollision and transmission protocol.
[4]
ISO Standard — ISO/IEC 18000-3 - Information technology - Radio frequency
identification for item management - Part 3: Parameters for air interface
communications at 13.56 MHz.
[5]
ISO Standard — ISO/IEC 7816-6 - Identification cards - Integrated circuit cards Part 6: Interindustry data elements for interchange.
[6]
General specification for 8” wafer on UV-tape with electronic fail die
marking — Delivery type description – BL-ID document number: 1093**1.
** ... document version number
SL2S2002_SL2S2102
Product data sheet
COMPANY PUBLIC
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ICODE SLIX
17. Revision history
Table 45.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
SL2S2002_SL2S2102 v3.3
20120823
Product data sheet
-
SL2S2002_SL2S2102 v3.2
Modifications:
SL2S2002_SL2S2102 v3.2
Modifications:
SL2S2002_SL2S2102 v3.1
Modifications:
SL2S2002 v3.0
•
Security level changed into “COMPANY PUBLIC”
20110110
•
•
Product data sheet
-
SL2S2002_SL2S2102 v3.1
Type numbers SL2S2002FTB and SL2S2102FTB added
Section 6 “Pinning information”, Section 12 “Marking” and Section 13 “Package outline”
added
20100908
Product data sheet
-
SL2S2002 v3.0
• Added type number SL2S2102
• Document layout updated
• Table 43: symbols and parameter descriptions updated
20100527
Product data sheet
-
178020
178020
20100430
Preliminary data sheet
-
178010
178010
20100205
Objective data sheet
-
-
SL2S2002_SL2S2102
Product data sheet
COMPANY PUBLIC
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ICODE SLIX
18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
SL2S2002_SL2S2102
Product data sheet
COMPANY PUBLIC
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
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ICODE SLIX
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
ICODE and I-CODE — are trademarks of NXP B.V.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
SL2S2002_SL2S2102
Product data sheet
COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.3 — 23 August 2012
178033
© NXP B.V. 2012. All rights reserved.
30 of 32
SL2S2002; SL2S2102
NXP Semiconductors
ICODE SLIX
20. Tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Ordering information . . . . . . . . . . . . . . . . . . . . .3
Pin description SOT1122 . . . . . . . . . . . . . . . . . .4
Bonding pad description . . . . . . . . . . . . . . . . . .6
Wafer specification . . . . . . . . . . . . . . . . . . . . . . .7
Memory organization . . . . . . . . . . . . . . . . . . . .10
Unique identifier . . . . . . . . . . . . . . . . . . . . . . . .10
Request format . . . . . . . . . . . . . . . . . . . . . . . .14
Response format when Error_flag set . . . . . . .14
Response format when Error_flag NOT set . . .14
Request format . . . . . . . . . . . . . . . . . . . . . . . .14
Password Identifier . . . . . . . . . . . . . . . . . . . . .14
Response format when Error_flag set . . . . . . .14
Response format when Error_flag NOT set . . .15
Request format . . . . . . . . . . . . . . . . . . . . . . . .15
Password identifier . . . . . . . . . . . . . . . . . . . . .15
Response format when Error_flag set . . . . . . .15
Response format when Error_flag NOT set . . .15
Request format . . . . . . . . . . . . . . . . . . . . . . . .16
Password identifier . . . . . . . . . . . . . . . . . . . . .16
Response format when Error_flag set . . . . . . .16
Response format when Error_flag NOT set . . .16
Request format . . . . . . . . . . . . . . . . . . . . . . . .17
Response format: Option flag logic 0 . . . . . . .17
Table 24.
Table 25.
Table 26.
Table 27.
Table 28.
Table 29.
Table 30.
Table 31.
Table 32.
Table 33.
Table 34.
Table 35.
Table 36.
Table 37.
Table 38.
Table 39.
Table 40.
Table 41.
Table 42.
Table 43.
Table 44.
Table 45.
Response format: Option flag logic 1 . . . . . . . 17
Example: mask length = 30 . . . . . . . . . . . . . . . 18
Request format . . . . . . . . . . . . . . . . . . . . . . . . 18
Response format when Error_flag set . . . . . . 19
Response format when Error_flag NOT set . . 19
Request format . . . . . . . . . . . . . . . . . . . . . . . . 19
Response format when Error_flag set . . . . . . 19
Response format when Error_flag NOT set . . 19
Request format . . . . . . . . . . . . . . . . . . . . . . . . 19
Response format when Error_flag set . . . . . . 20
Response format when Error_flag NOT set . . 20
Request format . . . . . . . . . . . . . . . . . . . . . . . . 20
Response format . . . . . . . . . . . . . . . . . . . . . . . 20
Request format . . . . . . . . . . . . . . . . . . . . . . . . 21
Response format when Error_flag set . . . . . . 21
Response format when Error_flag NOT set . . 21
Limiting values (Wafer)[1][2] . . . . . . . . . . . . . . . 22
EEPROM characteristics . . . . . . . . . . . . . . . . 23
Interface characteristics . . . . . . . . . . . . . . . . . 23
Marking SOT1122 . . . . . . . . . . . . . . . . . . . . . . 23
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 27
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 28
21. Figures
Fig 1.
Fig 2.
Fig 3.
Fig 4.
Fig 5.
Fig 6.
Fig 7.
Block diagram of ICODE SLIX . . . . . . . . . . . . . . . .3
Pin configuration for SOT1122. . . . . . . . . . . . . . . .4
Wafer SL2S2002FUD layout and pin
configuration for the bare die . . . . . . . . . . . . . . . . .5
Wafer SL2S2102FUD layout and pin
configuration for the bare die . . . . . . . . . . . . . . . . .6
Package outline SOT1122 . . . . . . . . . . . . . . . . . .24
Wafer SL2S2002FUD bare die layout . . . . . . . . .25
Wafer SL2S2102FUD bare die layout . . . . . . . . .26
SL2S2002_SL2S2102
Product data sheet
COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.3 — 23 August 2012
178033
© NXP B.V. 2012. All rights reserved.
31 of 32
SL2S2002; SL2S2102
NXP Semiconductors
ICODE SLIX
22. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
1.1
Contactless energy and data transfer. . . . . . . . 1
1.2
Anticollision. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3
Security and privacy aspects . . . . . . . . . . . . . . 1
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 2
2.1
ICODE SLIX RF interface (ISO/IEC 15693) . . . 2
2.2
EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2.3
Security. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
4
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
5
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
7
Wafer layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
7.1
Bonding pad description . . . . . . . . . . . . . . . . . . 6
8
Mechanical specification . . . . . . . . . . . . . . . . . 7
8.1
Wafer specification . . . . . . . . . . . . . . . . . . . . . . 7
8.1.1
Fail die identification . . . . . . . . . . . . . . . . . . . . . 8
8.1.2
Map file distribution. . . . . . . . . . . . . . . . . . . . . . 8
9
Functional description . . . . . . . . . . . . . . . . . . . 9
9.1
Block description . . . . . . . . . . . . . . . . . . . . . . . 9
9.2
Memory organization . . . . . . . . . . . . . . . . . . . . 9
9.2.1
Unique identifier . . . . . . . . . . . . . . . . . . . . . . . 10
9.2.2
Configuration of delivered ICs . . . . . . . . . . . . 11
9.3
Communication principle . . . . . . . . . . . . . . . . 11
9.4
Supported commands . . . . . . . . . . . . . . . . . . 11
9.4.1
Mandatory commands . . . . . . . . . . . . . . . . . . 11
9.4.1.1
INVENTORY. . . . . . . . . . . . . . . . . . . . . . . . . . 11
9.4.1.2
STAY QUIET. . . . . . . . . . . . . . . . . . . . . . . . . . 11
9.4.2
Optional commands . . . . . . . . . . . . . . . . . . . . 12
9.4.2.1
READ SINGLE BLOCK . . . . . . . . . . . . . . . . . 12
9.4.2.2
WRITE SINGLE BLOCK. . . . . . . . . . . . . . . . . 12
9.4.2.3
LOCK BLOCK. . . . . . . . . . . . . . . . . . . . . . . . . 12
9.4.2.4
READ MULTIPLE BLOCKS . . . . . . . . . . . . . . 12
9.4.2.5
SELECT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
9.4.2.6
RESET TO READY . . . . . . . . . . . . . . . . . . . . 12
9.4.2.7
WRITE AFI . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
9.4.2.8
LOCK AFI . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
9.4.2.9
WRITE DSFID . . . . . . . . . . . . . . . . . . . . . . . . 13
9.4.2.10 LOCK DSFID . . . . . . . . . . . . . . . . . . . . . . . . . 13
9.4.2.11 GET SYSTEM INFORMATION. . . . . . . . . . . . 13
9.4.2.12 GET MULTIPLE BLOCK SECURITY STATUS 13
9.4.3
Custom commands. . . . . . . . . . . . . . . . . . . . . 13
9.4.3.1
GET RANDOM NUMBER. . . . . . . . . . . . . . . . 13
9.4.3.2
SET PASSWORD . . . . . . . . . . . . . . . . . . . . . . 14
9.4.3.3
WRITE PASSWORD . . . . . . . . . . . . . . . . . . . 15
9.4.3.4
LOCK PASSWORD . . . . . . . . . . . . . . . . . . . . 16
9.4.3.5
9.4.3.6
9.4.3.7
9.4.3.8
9.4.3.9
9.4.3.10
9.4.3.11
9.5
9.5.1
9.5.2
9.5.2.1
9.5.2.2
9.5.3
9.5.3.1
9.5.3.2
9.6
9.7
10
11
11.1
11.2
12
12.1
13
14
15
16
17
18
18.1
18.2
18.3
18.4
19
20
21
22
INVENTORY READ . . . . . . . . . . . . . . . . . . . . 16
FAST INVENTORY READ . . . . . . . . . . . . . . . 18
SET EAS . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
RESET EAS. . . . . . . . . . . . . . . . . . . . . . . . . . 19
LOCK EAS . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
EAS ALARM . . . . . . . . . . . . . . . . . . . . . . . . . 20
PASSWORD PROTECT EAS/AFI . . . . . . . . . 20
Error handling . . . . . . . . . . . . . . . . . . . . . . . . 21
Transmission errors . . . . . . . . . . . . . . . . . . . . 21
Not supported commands or options . . . . . . . 21
Non Addressed Mode . . . . . . . . . . . . . . . . . . 21
Addressed or Selected Mode. . . . . . . . . . . . . 21
Parameter out of range . . . . . . . . . . . . . . . . . 21
Read commands . . . . . . . . . . . . . . . . . . . . . . 21
Write and lock commands . . . . . . . . . . . . . . . 21
Non Addressed Mode . . . . . . . . . . . . . . . . . . . 21
Addressed or Selected Mode. . . . . . . . . . . . . . 22
Data integrity . . . . . . . . . . . . . . . . . . . . . . . . . 22
RF interface . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 22
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 23
Memory characteristics . . . . . . . . . . . . . . . . . 23
Interface characteristics . . . . . . . . . . . . . . . . . 23
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Marking SOT1122 . . . . . . . . . . . . . . . . . . . . . 23
Package outline. . . . . . . . . . . . . . . . . . . . . . . . 24
Bare die outline . . . . . . . . . . . . . . . . . . . . . . . . 25
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 27
References. . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Revision history . . . . . . . . . . . . . . . . . . . . . . . 28
Legal information . . . . . . . . . . . . . . . . . . . . . . 29
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 29
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Contact information . . . . . . . . . . . . . . . . . . . . 30
Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 23 August 2012
178033
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