Data Sheet

SL3S1003_1013
UCODE G2iM and G2iM+
Rev. 3.7 — 21 May 2015
201237
Product data sheet
COMPANY PUBLIC
1. General description
NXP’s UCODE G2iM series transponder ICs offers in addition to the leading-edge read
range features such as a Tag Tamper Alarm, Data Transfer, Digital Switch, advanced
privacy-protection modes and a 640 bit configurable User Memory.
Very high chip sensitivity (17.5 dBm) enables longer read ranges with simple, single-port
antenna designs. In fashion and retail the UCODE G2iM series improve read rates and
provide for theft deterrence. In the electronic device market, they are ideally suited for
device configuration, activation, production control and PCB tagging. In authentication
applications, they protect brands and guard against counterfeiting. They can also be used
to tag containers, electronic vehicles, airline baggage, and more.
In addition to the EPC specifications the UCODE G2iM offers an integrated Product Status
Flag (PSF) feature and read protection of the memory content.
The UCODE G2iM+ offers on top of the UCODE G2iM features an integrated tag tamper
alarm, digital switch, external supply mode, data transfer mode and real read range
reduction. A special feature is the conditional, automatic real read range reduction, where
the activation condition can be defined by the user, is newly introduced in the UCODE
G2iM+. When connected to a power supply, the READ as well as the WRITE range can
be boosted to a sensitivity of 27 dBm.
The UCODE G2iM+ also allows the segmentation of the 640 bit User Memory in up to
three segments (open, protected, private) with different access levels (Access- and User
Password). For applications which require a longer EPC number the UCODE G2iM+
offers the possibility of up to 448 bit.
2. Features and benefits
2.1 Key features









UHF RFID Gen2 tag chip according EPCglobal v1.2.0
256 bit EPC for UCODE G2iM and up to 448 bit EPC for UCODE G2iM+
Up to 640 bit User Memory which can be segmented in the UCODE G2iM+
Private User Memory area protected by special User Password
Memory read protection
Integrated Product Status Flag (PSF)
Tag tamper alarm
Digital switch
Data transfer mode
SL3S1003_1013
NXP Semiconductors
UCODE G2iM and G2iM+








Real Read Range Reduction (Privacy Mode)
Conditional Real Read Range Reduction
External supply mode
Long read/write ranges due to extremely low power design
Reliable operation of multiple tags due to advanced anti-collision
Broad international operating frequency: from 840 MHz to 960 MHz
Data retention: 20 years
Wide specified temperature range: 40 C up to +85 C
2.1.1 Memory










256 bit of EPC memory / up to 448 bit in G2iM+
96 bit Tag IDentifier (TID) including 48-bit factory locked unique serial number
112 bit User TID memory
32 bit Kill Password to permanently disable the tag
32 bit Access Password to allow a transition into the secured state
32 bit User Password to allow access to the private user memory segment
Read protection
BlockWrite (32 bit)
Write Lock
BlockPermalock
2.2 Key benefits
2.2.1 End user benefit








Outstanding User Memory size of 640 bit
Prevention of unauthorized memory access through different levels of read protection
Indication of tag tampering attempt by use of the tag tamper alarm feature
Electronic device configuration and / or activation by the use of the digital switch / data
transfer mode
Theft deterrence supported by the PSF feature (PSF alarm or EPC code)
Small label sizes, long read ranges due to high chip sensitivity
Product identification through unalterable TID range, including a 48 bit serial number
Reliable operation in dense reader and noisy environments through high interference
suppression
2.2.2 Antenna design benefits
 High sensitivity enables small and cost efficient antenna designs
 Low Q-Value eases broad band antenna design for global usage
2.2.3 Label manufacturer benefit
 Consistent performance on different materials due to low Q-factor
 Ease of assembly and high assembly yields through large chip input capacitance and
Polyimide spacer
 Fast first WRITE or BLOCKWRITE of the EPC memory for fast label initialization
SL3S1003_1013
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2.3 Custom commands
 PSF Alarm
Built-in PSF (Product Status Flag), enables the UHF RFID tag to be used as EAS tag
(Electronic Article Surveillance) tag without the need for a back-end data base.
 Read Protect
Protects all memory content from unauthorized reading.
 ChangeConfig
Configures the additional features of the chip like external supply mode, tamper alarm,
digital switch, read range reduction, privacy mode activation condition or data transfer.
The UCODE G2iM+ is equipped with a number of additional features. Nevertheless, the
chip is designed in a way standard EPCglobal READ/WRITE/ACCESS commands can be
used to operate the features. No custom commands are needed to take advantage of all
the features in case of unlocked EPC memory.
3. Applications
3.1 Markets






Fashion (apparel and footwear)
Retail
Electronics
Fast moving consumer goods
Asset management
Electronic vehicle identification
3.2 Applications
 Supply chain management
 Item level tagging
 Pallet and case tracking
 Container identification
 Product authentication
 PCB tagging
 Cost efficient, low level seals
 Wireless firmware download
 Wireless product activation
SL3S1003_1013
Product data sheet
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4. Ordering information
Table 1.
Ordering information
Type number
Package
Name
IC type
Description
Version
SL3S1003FUD/BG
Wafer
G2iM
bumped G2iM die on sawn 8” 120 mm wafer,
7 mm Polyimide spacer
not applicable
SL3S1013FUD/BG
Wafer
G2iM+
bumped G2iM+ die on sawn 8” 120 mm wafer, not applicable
7 mm Polyimide spacer
SL3S1013FTB0
XSON6
G2iM+
plastic extremely thin small outline package; SOT886F1
no leads; 6 terminals; body 1  1.45  0.5 mm
5. Marking
Table 2.
SL3S1003_1013
Product data sheet
COMPANY PUBLIC
Marking codes
Type number
Marking code
Comment
Version
SL3S1013FTB0
US
UCODE G2iM+
SOT886
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6. Block diagram
The SL3S10x3 IC consists of three major blocks:
- Analog Interface
- Digital Control
- EEPROM
The analog part provides stable supply voltage and demodulates data received from the
reader for being processed by the digital part. Further, the modulation transistor of the
analog part transmits data back to the reader.
The digital section includes the state machines, processes the protocol and handles
communication with the EEPROM, which contains the EPC and the user data.
ANALOG
RF INTERFACE
DIGITAL CONTROL
EEPROM
VREG
PAD
VDD
RECT
ANTICOLLISION
DEMOD
READ/WRITE
CONTROL
data
in
ANTENNA
ACCESS CONTROL
MOD
PAD
MEMORY
data
out
EEPROM INTERFACE
CONTROL
R/W
PAD
VDD
PAD
I/O
CONTROL
OUT
RF INTERFACE
CONTROL
I/O CONTROL
SEQUENCER
CHARGE PUMP
001aam226
Fig 1.
SL3S1003_1013
Product data sheet
COMPANY PUBLIC
Block diagram of SL3S10x3 IC
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7. Pinning information
SL3S10x3FTB0
OUT
RFN
RFP
1
6
VDD
n.c.
2
5
n.c.
RFN
3
4
OUT
NXP trademark
VDD
RFP
aaa-001689
Transparent top view
001aan572
Fig 2.
Pinning bare die
Fig 3.
Pin configuration for SOT886
7.1 Pin description
Table 3.
Symbol
Description
OUT
output pin
RFN
grounded antenna connector
VDD
external supply
RFP
ungrounded antenna connector
Table 4.
SL3S1003_1013
Product data sheet
COMPANY PUBLIC
Pin description bare die
Pin description SOT886
Pin
Symbol
Description
1
RFP
ungrounded antenna connector
2
n.c.
not connected
3
RFN
grounded antenna connector
4
OUT
output pin
5
n.c.
not connected
6
VDD
external supply
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8. Wafer layout
8.1 Wafer layout
(1)
(5)
(9)
OUT
RFN
Y
(4)
(6)
X
(7)
VDD
RFP
(8)
(2)
(3)
not to scale!
001aan642
(1) Die to Die distance (metal sealring - metal sealring) 21,4 m, (X-scribe line width: 15 m)
(2) Die to Die distance (metal sealring - metal sealring) 21,4 m, (Y-scribe line width: 15 m)
(3) Chip step, x-length: 615 m
(4) Chip step, y-length: 475 m
(5) Bump to bump distance X (OUT - RFN): 513 m
(6) Bump to bump distance Y (RFN - RFP): 333 m
(7) Distance bump to metal sealring X: 43,5 m (outer edge - top metal)
(8) Distance bump to metal sealring (RFP, VDD) Y: 40,3 m
(9) Distance bump to metal sealring (RFN, OUT) Y: 80,3 m
Bump size X  Y: 60 m ´ 60 m
Remark: OUT and VDD are used with G2iM+ only
Fig 4.
SL3S1003_1013
Product data sheet
COMPANY PUBLIC
SL3S10x3 wafer layout
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9. Mechanical specification
The SL3S10x3 wafers are offered with 120 mm thickness and 7mm Polyimide spacer.
This robust structure with the enhanced Polyimide spacer supports easy assembly due to
low assembly variations.
9.1 Wafer specification
See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BU-ID document number: 1093**”.
9.1.1 Wafer
Table 5.
Specifications
Wafer
Designation
each wafer is scribed with batch number and
wafer number
Diameter
200 mm (8”)
Thickness
120 m 15 m
Number of pads
4
Pad location
non diagonal/ placed in chip corners
Distance pad to pad RFN-RFP
333.0 m
Distance pad to pad OUT-RFN
513.0 m
Process
CMOS 0.14 mm
Batch size
25 wafers
Potential good dies per wafer
100544
Wafer backside
Material
Si
Treatment
ground and stress release
Roughness
Ra max. 0.5 m, Rt max. 5 m
Chip dimensions
Die size including scribe
0.615 mm  0.475 mm = 0.292 mm2
Scribe line width:
x-dimension = 15 m
y-dimension = 15 m
Passivation on front
Type
Sandwich structure
Material
PE-Nitride (on top)
Thickness
1.75 m total thickness of passivation
Polyimide spacer
7 m
Au bump
Bump material
> 99.9% pure Au
Bump hardness
35 – 80 HV 0.005
Bump shear strength
> 70 MPa
Bump height
25 m[1]
Bump height uniformity
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Table 5.
Specifications …continued
– within a die
 2 m
– within a wafer
 3 m
– wafer to wafer
 4 m
Bump flatness
1.5 m
Bump size
– RFP, RFN
60  60 m
– OUT, VDD
60  60 m
Bump size variation
 5 m
[1]
Because of the 7 m spacer, the bump will measure 18 m relative height protruding the spacer.
9.1.2 Fail die identification
No inkdots are applied to the wafer.
Electronic wafer mapping (SECS II format) covers the electrical test results and
additionally the results of mechanical/visual inspection.
See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BU-ID document number: 1093**”
9.1.3 Map file distribution
See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BU-ID document number: 1093**”
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10. Functional description
10.1 Air interface standards
The UCODE G2iM fully supports all parts of the "Specification for RFID Air Interface
EPCglobal, EPCTM Radio-Frequency Identity Protocols, Class-1 Generation-2 UHF
RFID, Protocol for Communications at 860 MHz to 960 MHz, Version 1.2.0".
10.2 Power transfer
The interrogator provides an RF field that powers the tag, equipped with a UCODE G2iM.
The antenna transforms the impedance of free space to the chip input impedance in order
to get the maximum possible power for the UCODE G2iM on the tag. The UCODE G2iM+
can also be supplied externally.
The RF field, which is oscillating on the operating frequency provided by the interrogator,
is rectified to provide a smoothed DC voltage to the analog and digital modules of the IC.
The antenna attached to the chip may use a DC connection between the two antenna
pads which also enables loop antenna design.
10.3 Data transfer
10.3.1 Reader to tag Link
An interrogator transmits information to the UCODE G2iM by modulating an UHF RF
signal. The UCODE G2iM receives both information and operating energy from this RF
signal. Tags are passive, meaning that they receive all of their operating energy from the
interrogator's RF waveform. In order to further improve the read range the UCODE G2iM
can be externally supplied as well so the energy to operate the chip does not need to be
transmitted by the reader.
An interrogator is using a fixed modulation and data rate for the duration of at least one
inventory round. It communicates to the UCODE G2iM by modulating an RF carrier using
DSB-ASK with PIE encoding.
For further details refer to Section 17, Ref. 1. Interrogator-to-tag (R=>T) communications.
10.3.2 Tag to reader Link
An interrogator receives information from a UCODE G2iM by transmitting an unmodulated
RF carrier and listening for a backscattered reply. The UCODE G2iM backscatters by
switching the reflection coefficient of its antenna between two states in accordance with
the data being sent. For further details refer to Section 17, Ref. 1, chapter 6.3.1.3.
The UCODE G2iM communicates information by backscatter-modulating the amplitude
and/or phase of the RF carrier. Interrogators shall be capable of demodulating either
demodulation type.
The encoding format, selected in response to interrogator commands, is either FM0
baseband or Miller-modulated subcarrier.
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10.4 UCODE G2iM and UCODE G2iM+ differences
The UCODE G2iM is tailored for application where EPC or TID number space, and User
Memory is needed. The UCODE G2iM+ provides beside the segmented memory
additional functionality such as tag tamper alarm, external supply operation to further
boost read/write range (external supply mode), a privacy mode reducing the read range
where the activation criteria (open or short) can be defined or I/O functionality (data
transfer to externally connected devices) where required.
The following table provides an overview of UCODE G2iM, UCODE G2iM+ special
features.
Table 6.
Overview of UCODE G2iM and UCODE G2iM+ features
Features
UCODE G2iM
UCODE G2iM+
Read protection (bankwise)
yes
yes
PSF (Built-in Product Status Flag)
yes
yes
Backscatter strength reduction
yes
yes
BlockWrite (32 bit)
yes
yes
BlockPermalock
yes
yes
User TID (112 bit)
yes
yes
Segmented user memory (open, protected, private)
-
yes
Additional User Password for private memory
-
yes
EPC size selectable (448bit max.)
-
yes
Tag tamper alarm
-
yes
Digital switch / Digital input
-
yes
External supply mode
-
yes
Data transfer
-
yes
Real read range reduction
-
yes
Conditional Real Read Range Reduction
-
yes
10.5 Supported commands
The UCODE G2iM supports all mandatory EPCglobal V1.2.0 commands.
In addition the UCODE G2iM supports the following optional commands:
• ACCESS
• BlockWrite (32 bit)
• BlockPermalock
The UCODE G2iM features the following custom commands described more in detail
later:
•
•
•
•
•
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ResetReadProtect (backward compatible to UCODE G2X; UCODE G2iL)
ReadProtect(backward compatible to UCODE G2X; UCODE G2iL)
ChangeEAS (backward compatible to UCODE G2X; UCODE G2iL)
EAS_Alarm(backward compatible to UCODE G2X; UCODE G2iL)
ChangeConfig(backward compatible to UCODE G2iL)
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10.6 UCODE G2iM and UCODE G2iM+ memory
The UCODE G2iM and UCODE G2iM+ memory is implemented according EPCglobal
Class1Gen2 and organized in four banks:
Table 7.
UCODE G2iM and UCODE G2iM+ memory sections
Name
Size
Bank
Reserved memory (32 bit ACCESS and 32 bit KILL password)
64 bit
00b
EPC (excluding 16 bit CRC-16 and 16 bit PC) (UCODE G2iM)
256 bit
01b
EPC (excluding 16 bit CRC-16 and 16 bit PC) (UCODE G2iM+)
128 bit
up to
448 bit
G2iM Configuration Word (Config-Word)
16 bit
01b
G2iM Memory Configuration Word (Mem-Config-Word)
16 bit
01b
TID (including permalocked unique 48 bit serial number; 16bit unalterable 96 bit
XTID-header)
10b
User TID
112 bit
10b
User memory (UCODE G2iM)
512 bit
11b
User memory can be segmented and configured (UCODE G2iM+)
320 bit
up to
640 bit
The logical address of all memory banks begin at zero (00h).
In addition to the four memory banks two configuration words are available. The first to
handle the UCODE G2iM memory configuration (Mem-Config-Word) is available at EPC
bank 01 address 1F0h and the second to handle UCODE G2iM specific features
Config-Word) is available at EPC bank 01 address 200h. The configuration words are
described in detail in Section 10.7.1 “ChangeConfig” and Section 10.7.3 “UCODE G2iM+
memory configuration control mechanism”.
Memory pages (16 bit words) pre-programmed to zero will not execute an erase cycle
before writing data to it. This approach accelerates initialization of the chip and enables
faster programming of the memory.
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10.6.1 UCODE G2iM and UCODE G2iM+ overall memory map
Table 8.
UCODE G2iM and UCODE G2iM+ overall memory map
Bank
address
Memory
address
Type
Content
Initial
Bank 00
00h to 1Fh
reserved
Kill Password
all 00h
unlocked memory
20h to 3Fh
reserved
Access Password
all 00h
unlocked memory
00h to 0Fh
EPC
CRC-16: refer to Ref. 16
Bank 01
EPC
Bank 01
Config Word
memory mapped
calculated CRC
10h to 14h
EPC
backscatter length
00110b
unlocked memory
15h
EPC
UMI
0b
calculated according EPC
16h
EPC
reserved for future use
0b
hardwired to 0
17h to 1Fh
EPC
numbering system indicator
00h
unlocked memory
unlocked memory
EPC
EPC
[1]
1F0h to 1F3h EPC
RFU
0000b
hardwired to 0000b
1F4h to 1F7h EPC
Number of EPC blocks
0h
unlocked memory
1F8h to 1FBh EPC
Number protected memory
blocks
0h
unlocked memory
1FCh to 1FFh EPC
Number of private memory
blocks
0h
unlocked memory
200h
tamper alarm flag
0b[4]
indicator bit
indicator bit
20h to 9Fh
Bank 01
Memory
Config Word
Remark
EPC
201h
EPC
external supply flag or input
signal
0b[4]
202h
EPC
RFU
0b[4]
locked memory
RFU
0b[4]
locked memory
temporary bit
203h
EPC
204h
EPC
invert digital output:
0b[4]
205h
EPC
transparent mode on/off
0b[4]
temporary bit
transparent mode data/raw
0b[4]
temporary bit
unlocked memory
206h
EPC
207h
EPC
conditional read range
reduction
0b[4]
208h
EPC
conditional read range
reduction
open/short
0b[4]
unlocked memory
209h
EPC
max. backscatter strength
1b[4]
unlocked memory
20Ah
EPC
digital output
0b[4]
unlocked memory
read range reduction on/off
0b[4]
unlocked memory
read protect User Memory
0b[4]
locked memory
unlocked memory
20Bh
20Ch
EPC
EPC
20Dh
EPC
read protect EPC Bank
0b[4]
20Eh
EPC
read protect TID
0b[4]
unlocked memory
PSF alarm flag
0b[4]
unlocked memory
20Fh
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EPC
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Table 8.
UCODE G2iM and UCODE G2iM+ overall memory map
Bank
address
Memory
address
Type
Content
Initial
Remark
Bank 10
TID
00h to 07h
TID
allocation class identifier
1110 0010b
locked memory
08h to 13h
TID
tag mask designer identifier
0000 0000 0110b
locked memory
locked memory
Bank 11
USER
14h
TIG
config word indicator
1b[2]
14h to 1Fh
TID
tag model number
TMNR[3]
locked memory
20h to 2Fh
TID
XTID Header
00h
locked memory
30h to 5Fh
TID
serial number
SNR
locked memory
60h to CFh
TID
User TID memory
all ’0’
unlocked memory
User Memory
undefined
unlocked memory
000h to 27Fh USER
[1]
UCODE G2iM: HEX E200 680A 0000 0000 0000 0000 (0000 0000)
UCODE G2iM+: HEX E200 680B 0000 0000 0000 0000 (0000 0000)
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[2]
Indicates the existence of a Configuration Word at the end of the EPC number
[3]
See Figure 5
[4]
See also Table 13 for further details.
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10.6.2 UCODE G2iM and UCODE G2iM+ TID memory details
Table 9.
G2iM TID description
Model number
Type
First 32 bit of
TID memory
Class ID
Mask designer
ID
Config Word
indicator
Sub version
number
Version (Silicon)
number
UCODE G2iM
E200680A
E2h
006h
1
0000b
0001010
UCODE G2iM+
E200680B
E2h
006h
1
0000b
0001011
Addresses 00h
CFh
TID
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MS Byte
MS Bit
LS Byte
LS Bit
Addresses 00h
07h 08h
Class Identifier
Bits
TID Example
(UCODE G2iM)
7
13h 14h
Mask-Designer Identifier
0
11
0
E2h
(EAN.UCC)
1Fh 20h
Model Number
11
006h
(NXP)
0
0 3
47
0 112
0
1Fh
0
001aan573
0001010b
(UCODE G2iM)
G2iM TID memory structure
UCODE G2iM and G2iM+
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SL3S1003_1013
Fig 5.
0
CFh
User TID
Version Number
0 6
000b
Serial Number
0000h
18h 19h
Sub Version Number
Bits
15
80Ah
(UCODE G2iM)
Addresses 14h
5Fh 60h
2Fh 30h
XTID Header
SL3S1003_1013
NXP Semiconductors
UCODE G2iM and G2iM+
10.7 Custom commands
The UCODE G2iM and UCODE G2iM+ supports a number of additional features and
custom commands. Nevertheless, the chip is designed in a way standard EPCglobal
READ/WRITE/ACCESS commands can be used to operate the features.
The memory map stated in the previous section describes the Config-Word used to
control the additional features located at address 200h as well as the Mem-Config-Word
located at 1F0h of the EPC memory. For this reason the standard READ/WRITE
commands of an UHF EPCglobal compliant reader can be used to select the flags,
activate/deactivate features or define memory segments.
The features can only be activated/deactivated (written) using standard EPC WRITE
command as long the EPC is not locked. In case the EPC is locked either the bank needs
to be unlocked to apply changes or the ChangeConfig custom command is used to
change the settings.
The UCODE G2iM products supports the complete UCODE G2iL command set for
backward compatibility reasons.
Bit 14h of the TID indicates the existence of a Configuration Word. This flag will enable
selecting Config-Word enhanced transponders in mixed tag populations.
10.7.1 ChangeConfig
Although UCODE G2iM is tailored for supply chain management, item level tagging and
product authentication the UCODE G2iM+ version enables active interaction with
products. Among the password protected features are the capability of download firmware
to electronics, activate/deactivate electronics which can also be used as theft deterrence,
a dedicated privacy mode by reducing the read range, integrated PSF (Product Status
Flag) or Tag Tamper Alarm. In addition to the UCODE G2iL/G2iL+ the activation condition
(open/short) for the Read Range Reduction can be defined by the user.
The UCODE G2iM ChangeConfig custom command allows handling the special NXP
Semiconductors features described in the following paragraph. Please also see the
memory map in Section 10.6 “UCODE G2iM and UCODE G2iM+ memory” and “Section
10.7.2 “UCODE G2iM and UCODE G2iM+ special features control mechanism”. If the
EPC memory is not write locked the standard EPC READ/WRITE command can be used
to change the settings.
UCODE G2iM and UCODE G2iM+ special features1
UCODE G2iM and UCODE G2iM+ common special features are:
• Bank wise read protection (separate for EPC, TID and User Memory)
EPC bank (except of configuration words), the serial number part of the TID as well as
the User TID and the User Memory (open segment) can be read protected
independently. When protected reading of the particular memory will return '0'. The
flags of the Config-Word can be selected using the standard SELECT command. Only
read protected parts will then participate an inventory round.
1.
The features can only be manipulated (enabled/disabled) with unlocked EPC bank, otherwise the ChangeConfig command can be
used.
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UCODE G2iM and G2iM+
• Integrated PSF (Product Status Flag)
The PSF is a general purpose flag that can be used as an EAS (Electronic Article
Surveillance) flag, quality checked flag or similar.
The UCODE G2iM offers two ways of detecting an activated PSF. In cases extremely
fast detection is needed the EAS_Alarm command can be used. The UCODE G2iM
will reply a 64 bit alarm code like described in section EAS_Alarm upon sending the
command. As a second option the EPC SELECT command selecting the PSF flag of
the Config-Word can be used. In the following inventory round only PSF enabled
chips will reply their EPC number.
• Backscatter strength reduction
The UCODE G2iM features two levels of backscatter strengths. Per default maximum
backscatter is enabled in order to enable maximum read rates. When clearing the flag
the strength can be reduced if needed.
UCODE G2iM+ specific special features are:1
• Real Read Range Reduction 4R (UCODE G2iM+ only)
Some applications require the reduction of the read range to close proximity for
privacy reasons. Setting the 4R flag will significantly reduce the chip sensitivity to
+12 dBm. The +12 dBm have to be available at chip start up (slow increase of field
strength is not applicable). For additional privacy, the read protection can be activated
in the same configuration step. The related flag of the configuration word can be
selected using the standard SELECT command so only chips with reduced read
range will be part of an inventory.
Remark: The attenuation will result in only a few centimeter of read range at 36 dBm
EIRP!
• Tag Tamper Alarm (UCODE G2iM+ only)
The UCODE G2iM+ Tamper Alarm will flag the status of the VDD to OUT pad
connection which can be designed as an predetermined breaking point (see
Figure 6).
RFN
RFP
OUT
VDD
001aan668
Fig 6.
Schematic of connecting VDD and OUT pad with a predetermined breaking point
to turn a standard RFID label into a wireless safety seal
The status of the pad connection (open/closed) can be read in the configuration register
and/or selected using the EPC SELECT. This feature enables the design of a wireless
RFID safety seal. When breaking the connection by peeling off the label or manipulating a
lock an alarm can be triggered.
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UCODE G2iM and G2iM+
• Conditional Real Read Range Reduction (UCODE G2iM+ only)
In addition to the 4R and the Tag Tamper Alarm feature the UCODE G2iM+ offers a
feature which combines both in one functionality. This feature allow the automatic
activation of the 4R depending on the status of the VDD to OUT pad connection. To
offer high flexibility for the applications the 4R activation can be done on short (bit 8 =
’1’) or open (bit 8 =’0’) of the VDD to OUT pad connection. For activation of this
feature bit 7 and bit 11 of the Config-Word have to be set to ’1’.
• Digital Switch (UCODE G2iM+ only)
By connecting a supply voltage between RFN and VDD the OUT pin of the UCODE
G2iM+ can be used as digital switch. Depending on the ‘Digital Output’ bit of the
Config-Word register the state of the OUT pin can be switched to VDD or GND.
The state of the OUT pin is persistent in the memory even after KILL or switching off
the supply. In absence of external Vsupply, one cannot detect the difference in Ohmic
resistance between OUT and VDD, regardless of whether ‘Digital Output’ bit is 0 or 1.
The state of the OUT pin can also be changed temporary by toggling the 'Invert Digital
Output' bit.
This feature will allow activating/deactivating externally connected peripherals or can
be used as theft deterrence of electronics.
• Data transfer Mode (UCODE G2iM+ only)
In applications where not switching the output like described in "Digital Switch" but
external device communication is needed the UCODE G2iM+ Data Transfer Mode
can be used by setting the according bit of the Config-Word register. When activated
the air interface communication will be directly transferred to the OUT pad of the chip.
Two modes of data transfer are available and can be switched using the Transparent
Mode DATA/RAW bit.
The default Transparent Mode DATA will remove the Frame Sync of the
communication and toggle the output with every raising edge in the RF field. This will
allow implementing a Manchester type of data transmission.
The Transparent Mode RAW will switch the demodulated air interface communication
to the OUT pad.
• External Supply Indicator - Digital Input (UCODE G2iM+ only)
The VDD pad of the UCODE G2iM+ can be used as a digital input pin. The state of
the pad is directly associated with the External Supply Indicator bit of the configuration
register. A simple return signaling (chip to reader) can be implemented by polling this
Configuration Word register flag. RF reset is necessary for proper polling.
• External Supply Mode (G2iM+ only)
The UCODE G2iM+ can be supplied externally by connecting 1.85 V (Iout = 0 A)
supply. When externally supplied less energy from the RF field is needed to operate
the chip. This will not just enable further improved sensitivity and read ranges (up to
-27 dBm) but also enable a write range that is equal to the read range.
The figure schematically shows the supply connected to the UCODE G2iM+.
Remark: When permanently externally supplied there will not be a power-on-reset. This
will result in the following limitations:
• When externally supplied session flag S0 will keep it’s state during RF-OFF phase.
• When externally supplied session flag S2, S3, SL will have infinite persistence time
and will behave similar to S0.
• Session flag S1 will behave regular like in pure passive operation.
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UCODE G2iM and G2iM+
RFN
RFP
OUT
VDD
Vsupply
001aan669
Fig 7.
Schematic of external power supply
Table 10.
ChangeConfig custom command
Command
RFU
Data
RN
CRC-16
No. of bits
16
8
16
16
16
Description
11100000
00000111
00000000
Toggle bits
XOR RN 16
handle
-
The bits to be toggled in the configuration register need to be set to '1'.
E.g. sending 0000 0000 0001 0001 XOR RN16 will activate the 4R and PSF. Sending the
very same command a second time will disable the features again.
The reply of the ChangeConfig will return the current register setting.
Table 11.
Header
Status bits
RN
CRC-16
No. of bits
1
16
16
16
Description
0
Config-Word
Handle
-
Table 12.
Condition
Response
Next state
ready
all
-
ready
arbitrate, reply,
acknowledged
all
-
arbitrate
open
valid handle Status word
needs to change
Backscatter unchanged
Config-Word immediately
open
valid handle Status word does Backscatter Config-Word
not need to change
immediately
open
valid handle Status word
needs to change
Backscatter modified
Config-Word, when done
secured
valid handle Status word does Backscatter Config-Word
not need to change
immediately
secured
all
killed
killed
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ChangeConfig command-response table
Starting state
secured
SL3S1003_1013
ChangeConfig custom command reply
-
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UCODE G2iM and G2iM+
The features can only be activated/deactivated using standard EPC WRITE if the EPC
bank is unlocked. The permanent and temporary bits of the Configuration Word can be
toggled without the need for an Access Password in case the Access Password is set to
zero. In case the EPC bank is locked the lock needs to be removed before applying
changes or the ChangeConfig command has to be used.
10.7.2 UCODE G2iM and UCODE G2iM+ special features control mechanism
Special features of the UCODE G2iM are managed using a configuration word
(Config-Word) located at address 200h in the EPC memory bank.
The entire Config-Word is selectable (using the standard EPC SELECT command), as
well as single bits, and can be read using standard EPC READ command and modified
using the standard EPC WRITE or ChangeConfig custom command in case the EPC
memory is locked for writing.
ChangeConfig can be executed from the OPEN and SECURED state.
The chip will take all “Toggle Bits” for ’0’ if the chip is in the OPEN state or the ACCESS
password is zero; therefore it will not alter any status bits, but report the current status
only. The command will be ignored with an invalid CRC-16 or an invalid handle. The chip
will then remain in the current state. The CRC-16 is calculated from the first
command-code bit to the last handle bit.
A ChangeConfig command without frame-sync and proceeding Req_RN will be ignored.
The command will also be ignored if any of the RFU bits are toggled.
In order to change the configuration, to activate/deactivate a feature a ’1’ has to be written
to the corresponding register flag to toggle the status. E.g. sending 0x0002 to the register
will activate the read protection of the TID. Sending the same command a second time will
again clear the read protection of the TID. Invalid toggling on indicator or RFU bits are
ignored.
Executing the command with zero as payload or in the OPEN state will return the current
register settings. The chip will reply to a successful ChangeStatus with an extended
preamble regardless of the TRext value of the Query command.
After sending a ChangeConfig an interrogator shall transmit CW for less than TReply or
20ms, where TReply is the time between the interrogator's ChangeConfig command and
the chip’s backscattered reply. An interrogator may observe three possible responses
after sending a ChangeConfig, depending on the success or failure of the operation
• ChangeConfig succeeded: The chip will backscatter the reply shown above
comprising a header (a 0-bit), the current Config-Word setting, the handle, and a
CRC-16 calculated over the 0-bit, the Config-Word and the handle. If the interrogator
observes this reply within 20 ms then the ChangeConfig completed successfully.
• The chip encounters an error: The chip will backscatter an error code during the CW
period rather than the reply shown below (see EPCglobal Spec for error-code
definitions and for the reply format).
• ChangeConfig does not succeed: If the interrogator does not observe a reply within
20 ms then the ChangeConfig did not complete successfully. The interrogator may
issue a Req_RN command (containing the handle) to verify that the chip is still in the
interrogator's field, and may reissue the ChangeConfig command.
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The UCODE G2iM configuration word (Config-Word) is located at address 200h of the
EPC memory and is structured as following:
Table 13.
Address 200h to 207h
Indicator bits
Temporary bits
Permanent bits
Tamper
indicator
External supply
indicator
RFU
RFU
Invert Output
Transparent
mode
on/off
Data mode
data/raw
Conditional Read
Range Reduction
on/off
0
1
2
3
4
5
6
7
Table 14.
Address 208h to 20Fh
Permanent bits
Conditional
Read Range
Reduction
open/short
max. backscatter
strength
Digital
output
Read
Protect UM
Range
Reduction
Protect EPC
Protect TID
PSF Alarm
bit
8
9
10
11
13
14
15
12
The configuration word contains three different type of bits:
• Indicator bits cannot be changed by command:
Tag Tamper Alarm Indicator
External Supply Indicator (digital input)
• Temporary bits are reset at power up:
Invert Output
Transparent Mode on/off
Data Mode data/raw
• Permanent bits: permanently stored bits in the memory
Conditional Read Range Reduction on/off
Conditional Read Range Reduction short/open
Max. Backscatter Strength
Digital Output
Read Range Reduction
Read Protect User Memory
Read Protect EPC
Read Protect TID
PSF Alarm
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10.7.3 UCODE G2iM+ memory configuration control mechanism
The segmented user memory available in the UCODE G2iM+ enables a flexible
configuration of the device with respect to EPC size and access rights to the User
Memory.
The standard configuration offers 256 bit EPC memory and 512 bit open User Memory for
UCODE G2iM and 128 bit EPC memory and 640 bit open User Memory for UCODE
G2iM+. For applications where more EPC memory is required the UCODE G2iM+ offers
the flexibility to extend the 128 bit EPC up to 448 bit (in steps of 64 bit) by reducing the
User Memory size accordingly. See Table 15 and Table 17.
Table 15.
EPC / User Memory Standard Configuration (UCODE G2iM)
EPC Memory
User Memory
Open
256 bit
Table 16.
512 bit
EPC / User Memory Standard Configuration (UCODE G2iM+)
EPC Memory
User Memory
Open
128 bit
Table 17.
640 bit
EPC / User Memory Max. EPC Configuration (UCODE G2iM+)
EPC Memory
User Memory
Open
448 bit
320 bit
Beside the possibility to extend the EPC memory the UCDOE G2iM+ offers the possibility
to segment the User Memory in up to three areas with different access rights.
• Open: no read/write protection
• Protected: read/write protected by the Access Password
• Private: read/write protected by the User Password (see Section 10.7.4)
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The memory configuration can be defined one time, by programming the memory
configuration word, at the initialization of the UCODE G2iM+. The UCODE G2iM+
Memory Configuration Word (Mem-Config-Word) is located at address 1F0h of the EPC
memory and is structured as following:
Table 18.
Memory Configuration Word, Address 1F0h to 1FFh
RFU
0
Number
of EPC blocks
1
2
3
4
5
6
7
Number of
Protected memory blocks
Number of
Private memory blocks
8
12
9
10
11
13
14
15
• RFU-Bits:
The four RFU bits are fixed to 0000b. These four bits are ignored for access
commands (e.g. WRITE).
• Number of EPC blocks:
The 4 bit of this region specify the number of blocks (max. 5) which should be added
on top of the standard EPC Memory of 128bit.
• Number of Protected memory blocks:
The 4 bit of this region specify the number of blocks which should be used for the
Protected memory region.
• Number of Private memory blocks:
The 4 bit of this region specify the number of blocks which should be used for the
Private memory region.
The total amount of User Memory is defined by the number of blocks for EPC-, Open-,
Protected- and Private- memory area. Based on the total User Memory size (640 bit) and
the defined block size of 64 bit, the overall number of blocks results in ten blocks. As
described in the examples (Table 19 to Table 21) below the blocks used for the EPC-,
Open-, Protected- or Private segment can be exchanged according to the application
requirements as long as the overall block number is below ten.
The number of blocks allocated to the Open Memory Area are defined by the number of
blocks specified in the Mem-Config-Word, therefore the size of the Open Memory area is
derived by subtracting the number of defined blocks (Mem-Config-Word) from the total
available number of blocks of the User Memory (10 blocks). Undefined blocks are always
added to the Open Memory area.
In case an invalid total amount of blocks (exceeds ten) is written to the Mem-Config-Word,
the configuration fails and the error code (Locked Memory) will be returned.
The entire Mem-Config-Word is selectable (using the standard EPC SELECT command),
as well as single bits, and can be read using standard EPC READ command and modified
using the standard EPC WRITE command.
NOTE:
THE MEM-CONFIG-WORD IS ONE TIME PROGRAMMABLE.
Programming has be performed in the secured state.
In case no programming of the memory configuration word is done at the initialization of
the UCODE G2iM+ it will be automatically locked upon a lock of any part of the memory.
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The following tables will provide a few examples for different memory configurations.
• Standard EPC size, 4 blocks Protected and 3 blocks Private memory which results in
3 blocks Open memory.
(Mem-Config-Word value: 0043h)
See Table 19
Table 19.
User Memory Configuration with 3 segments
EPC Memory
User Memory
128 bit
Open
Protected
Private
192 bit
256 bit
192 bit
• Standard EPC size, 3 blocks Protected memory which results in 7 blocks Open
memory. (Mem-Config-Word value: 0030h).
See Table 20
Table 20.
User Memory Configuration with 2 segments (no Private segment)
EPC Memory
User Memory
128 bit
Open
Protected
448 bit
192 bit
• 192 bit EPC (1 block EPC added), 6 blocks Private memory which results in 4 blocks
Open memory. (Mem-Config-Word value: 0106h)
See Table 21
Table 21.
User Memory Configuration with 2 areas (no Access password protected area)
EPC Memory
User Memory
192 bit
Open
Private
192 bit
384 bit
10.7.4 Private Memory Segment
The Private memory is a part of the User Memory which can be accessed out of the
secured state only. Private regions will appear as non existent to not authorized users.
The address of the location of the User Password is not fixed and has therefore to be
calculated based on the applied memory configuration.
The 32 bit User Password is located at the end of the User Memory. Since the UCODE
G2iM+ memory is configurable and can be segmented the address location of the User
Password depends on the Memory configuration done at the initialization.
User Password address calculation:
HEX[(Total number of memory blocks - blocks appointed to EPC)*Blocksize)]
Example:
EPC length: 192
This means that 1 block from the User Memory is required (128 bit + 64 bit)
HEX[(101)*64]=HEX[9*64]=HEX[384]=240h
Therefore the User Password for this configuration is located at address 240h to 25Fh
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10.7.5 ReadProtect2
The UCODE G2iM ReadProtect custom command enables reliable read protection of the
entire UCODE G2iM memory. Executing ReadProtect from the Secured state will set the
ProtectEPC and ProtectTID bits of the Configuration Word to '1'. With the ReadProtect-Bit
set the UCODE G2iM will continue to work unaffected but veil its protected content.
The read protection can be removed by executing Reset ReadProtect. The
ReadProtect-Bits will than be cleared.
Devices whose access password is zero will ignore the command. A frame-sync must be
pre-pended the command.
After sending the ReadProtect command an interrogator shall transmit CW for the lesser
of TReply or 20 ms, where TReply is the time between the interrogator's ReadProtect
command and the backscattered reply. An interrogator may observe three possible
responses after sending a ReadProtect, depending on the success or failure of the
operation:
• ReadProtect succeeds: After completing the ReadProtect the UCODE G2iM shall
backscatter the reply shown in Table 23 comprising a header (a 0-bit), the tag's
handle, and a CRC-16 calculated over the 0-bit and handle. Immediately after this
reply the UCODE G2iM will render itself to this ReadProtect mode. If the interrogator
observes this reply within 20 ms then the ReadProtect completed successfully.
• The UCODE G2iM encounters an error: The UCODE G2iM will backscatter an error
code during the CW period rather than the reply shown in the EPCglobal Spec (see
Annex I for error-code definitions and for the reply format).
• ReadProtect does not succeed: If the interrogator does not observe a reply within
20 ms then the ReadProtect did not complete successfully. The interrogator may
issue a Req_RN command (containing the handle) to verify that the UCODE G2iM is
still in the interrogation zone, and may re-initiate the ReadProtect command.
The UCODE G2iM reply to the ReadProtect command will use the extended preamble
shown in EPCglobal Spec (Figure 6.11 or Figure 6.15), as appropriate (i.e. a Tag shall
reply as if TRext=1) regardless of the TRext value in the Query that initiated the round.
Table 22.
Command
RN
CRC-16
# of bits
16
16
16
description
11100000 00000001
handle
-
Table 23.
2.
ReadProtect command
UCODE G2iM reply to a successful ReadProtect procedure
Header
RN
CRC-16
# of bits
1
16
16
description
0
handle
-
Note: The ChangeConfig command can be used instead of “ReadProtect”, “ResetReadProtect”, “ChangeEAS”.
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Table 24.
ReadProtect command-response table
Starting State
Condition
Response
Next State
ready
all
–
ready
arbitrate, reply,
acknowledged
all
–
arbitrate
open
all
-
open
secured
valid handle & invalid
access password
–
arbitrate
valid handle & valid
non zero access
password
Backscatter handle,
when done
secured
killed
invalid handle
–
secured
all
–
killed
10.7.6 Reset ReadProtect2
Reset ReadProtect allows an interrogator to clear the ProtectEPC and ProtectTID bits of
the Configuration Word. This will re-enable reading of the related UCODE G2iM memory
content.
For details on the command response please refer to Table 25 “Reset ReadProtect
command”.
After sending a Reset ReadProtect an interrogator shall transmit CW for the lesser of
TReply or 20 ms, where TReply is the time between the interrogator's Reset ReadProtect
command and the UCODE G2iM backscattered reply. A Req_RN command prior to the
Reset ReadProtect is necessary to successfully execute the command. A frame-sync
must be pre-pended the command.
An interrogator may observe three possible responses after sending a Reset
ReadProtect, depending on the success or failure of the operation:
• Reset ReadProtect succeeds: After completing the Reset ReadProtect a UCODE
G2iM will backscatter the reply shown in Table 26 comprising a header (a 0-bit), the
handle, and a CRC-16 calculated over the 0-bit and handle. If the interrogator
observes this reply within 20 ms then the Reset ReadProtect completed successfully.
• The UCODE G2iM encounters an error: The UCODE G2iM will backscatter an error
code during the CW period rather than the reply shown in Table 26 (see EPCglobal
Spec for error-code definitions and for the reply format).
• Reset ReadProtect does not succeed: If the interrogator does not observe a reply
within 20 ms then the Reset ReadProtect did not complete successfully. The
interrogator may issue a Req_RN command (containing the handle) to verify that the
G2iM is still in the interrogation zone, and may reissue the Reset ReadProtect
command.
The UCODE G2iM reply to the Reset ReadProtect command will use the extended
preamble shown in EPCglobal Spec (Figure 6.11 or Figure 6.15), as appropriate (i.e. a
UCODE G2iM will reply as if TRext=1 regardless of the TRext value in the Query that
initiated the round.
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The Reset ReadProtect command is structured as following:
• 16 bit command
• Password: 32 bit Access-Password XOR with 2 times current RN16
Remark: To generate the 32 bit password the 16 bit RN16 is duplicated and used two
times to generate the 32 bit (e.g. a RN16 of 1234 will result in 1234 1234).
• 16 bit handle
• CRC-16 calculate over the first command-code bit to the last handle bit
Table 25.
Command
Password
RN
# of bits
16
32
16
16
description
11100000
00000010
(access
password) 
2*RN16
handle
-
Table 26.
UCODE G2iM reply to a successful Reset ReadProtect command
RN
CRC-16
# of bits
1
16
16
description
0
handle
-
Reset ReadProtect command-response table
Starting State
Condition
Response
Next State
ready
all
–
ready
arbitrate, reply,
acknowledged
all
–
arbitrate
open
valid handle & valid access password
Backscatter handle,
when done
open
valid handle & invalid access password
–
arbitrate
invalid handle
–
open
valid handle & valid access password
Backscatter handle,
when done
secured
valid handle & invalid access password
–
arbitrate
invalid handle
–
secured
all
–
killed
secured
killed
Product data sheet
COMPANY PUBLIC
CRC-16
Header
Table 27.
SL3S1003_1013
Reset ReadProtect command
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10.7.7 ChangeEAS2
UCODE G2iM equipped RFID tags will also feature a stand-alone operating EAS alarm
mechanism for fast and offline electronic article surveillance. The PSF bit of the
Config-Word directly relates to the EAS Alarm feature. With an PSF bit set to '1' the tag
will reply to an EAS_Alarm command by backscattering a 64 bit alarm code without the
need of a Select or Query. The EAS is a built-in solution so no connection to a backend
database is required. In case the EAS_Alarm command is not implemented in the reader
a standard EPC SELCET to the Config-Word and Query can be used. When using
standard SELECT/QUERY the EPC will be returned during inventory.
ChangeEAS can be executed from the Secured state only. The command will be ignored
if the Access Password is zero, the command will also be ignored with an invalid CRC-16
or an invalid handle, the UCODE G2iM will than remain in the current state. The CRC-16
is calculated from the first command-code bit to the last handle bit. A frame-sync must be
pre-pended the command.
The UCODE G2iM reply to a successful ChangeEAS will use the extended preamble, as
appropriate (i.e. a Tag shall reply as if TRext=1) regardless of the TRext value in the
Query that initiated the round.
After sending a ChangeEAS an interrogator shall transmit CW for less than TReply or
20 ms, where TReply is the time between the interrogator's ChangeEAS command and
the UCODE G2iM backscattered reply. An interrogator may observe three possible
responses after sending a ChangeEAS, depending on the success or failure of the
operation
• ChangeEAS succeeds: After completing the ChangeEAS a UCODE G2iM will
backscatter the reply shown in Table 29 comprising a header (a 0-bit), the handle, and
a CRC-16 calculated over the 0-bit and handle. If the interrogator observes this reply
within
20 ms then the ChangeEAS completed successfully.
• The UCODE G2iM encounters an error: The UCODE G2iM will backscatter an error
code during the CW period rather than the reply shown in Table 29 (see EPCglobal
Spec for error-code definitions and for the reply format).
• ChangeEAS does not succeed: If the interrogator does not observe a reply within
20 ms then the ChangeEAS did not complete successfully. The interrogator may
issue a Req_RN command (containing the handle) to verify that the G2iM is still in the
interrogator's field, and may reissue the ChangeEAS command.
Upon receiving a valid ChangeEAS command a G2iM will perform the commanded
set/reset operation of the PSF bit of the Configuration Word.
If PSF bit is set, the EAS_Alarm command will be available after the next power up and
reply the 64 bit EAS code upon execution. Otherwise the EAS_Alarm command will be
ignored.
Table 28.
SL3S1003_1013
Product data sheet
COMPANY PUBLIC
ChangeEAS command
Command
ChangeEas
RN
CRC-16
# of bits
16
1
16
16
description
11100000
00000011
1 ... set PSF bit
0 ... reset PSF bit
handle
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Table 29.
UCODE G2iM reply to a successful ChangeEAS command
Header
RN
CRC-16
# of bits
1
16
16
description
0
handle
-
Table 30.
ChangeEAS command-response table
Starting State
Condition
Response
Next state
ready
all
–
ready
arbitrate, reply,
acknowledged
all
–
arbitrate
open
all
–
open
secured
valid handle
backscatter handle,
when done
secured
invalid handle
–
secured
all
–
killed
killed
10.7.8 EAS_Alarm
Upon receiving an EAS_Alarm custom command the UCODE G2iM will immediately
backscatter an EAS-Alarmcode in case the PSF bit of the Config-Word is set. The alarm
code is returned without any delay caused by Select, Query and without the need for a
backend database.
The EAS feature of the UCODE G2iM is available after enabling it by sending a
ChangeEAS command described in Section 10.7.7 “ChangeEAS2” or after setting the
PSF bit of the Config-Word to ’1’. With the EAS-Alarm enabled the UCODE G2iM will
reply to an EAS_Alarm command by backscattering a fixed 64 bit alarm code. A UCODE
G2iM will reply to an EAS_Alarm command from the ready state only. As an alternative to
the fast EAS_Alarm command a standard SELECT (upon the Config-Word) and QUERY
can be used.
If the PSF bit is reset to '0' by sending a ChangeEAS command in the password protected
Secure state or clearing the PSF bit the UCODE G2iM will not reply to an EAS_Alarm
command.
The EAS_Alarm command is structured as following:
• 16 bit command
• 16 bit inverted command
• DR (TRcal divide ratio) sets the T=>R link frequency as described in EPCglobal Spec.
6.3.1.2.8 and Table 6.9.
• M (cycles per symbol) sets the T=>R data rate and modulation format as shown in
EPCglobal Spec. Table 6.10.
• TRext chooses whether the T=>R preamble is pre-pended with a pilot tone as
described in EPCglobal Spec. 6.3.1.3.
A preamble must be pre-pended the EAS_Alarm command according EPCglobal Spec,
6.3.1.2.8.
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Upon receiving an EAS_Alarm command the tag loads the CRC5 register with 01001b
and backscatters the 64 bit alarm code accordingly. The reader is now able to calculate
the CRC5 over the backscattered 64 bits received to verify the received code.
Table 31.
EAS_Alarm command
Command
Inv_Command
DR
M
TRext
CRC-16
# of bits
16
16
1
2
1
16
description
11100000
00000100
00011111
0: DR=8
00: M=1
1: DR=64/3
01: M=2
0: no pilot
tone
-
11111011
1: use pilot
tone
10: M=4
11: M=8
Table 32.
Header
EAS Code
# of bits
1
64
description
0
CRC5 (MSB)
Table 33.
SL3S1003_1013
Product data sheet
COMPANY PUBLIC
UCODE G2iM reply to a successful EAS_Alarm command
EAS_Alarm command-response table
Starting State
Condition
Response
Next state
ready
PSF bit is set
backscatter alarm code
ready
PSF bit is cleard
--
arbitrate, reply,
acknowledged
all
–
arbitrate
open
all
–
open
secured
all
–
secured
killed
all
–
killed
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11. Limiting values
Table 34. Limiting values[1][2]
In accordance with the Absolute Maximum Rating System (IEC 60134).
Voltages are referenced to RFN
Symbol
Parameter
Conditions
Min
Max
Unit
55
+125
C
40
+85
C
-
±2
kV
Bare die limitations
Tstg
storage temperature
Tamb
ambient temperature
VESD
electrostatic discharge
voltage
Human body
model
[3]
Pad limitations
SL3S1003_1013
Product data sheet
COMPANY PUBLIC
Vi
input voltage
absolute limits,
VDD-OUT pad
0.5
+2.5
V
Io
output current
absolute limits
input/output
current, VDD-OUT
pad
0.5
+0.5
mA
Pi
input power
maximum power
dissipation, RFP
pad
-
100
mW
[1]
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at these or any conditions other
than those described in the Operating Conditions and Electrical Characteristics section of this specification
is not implied.
[2]
This product includes circuitry specifically designed for the protection of its internal devices from the
damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be
taken to avoid applying greater than the rated maxima.
[3]
For ESD measurement, the die chip has been mounted into a CDIP20 package.
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12. Characteristics
12.1 UCODE G2iM and UCODE G2iM+ bare die characteristics
Table 35.
UCODE G2iM and UCODE G2iM+ RF interface characteristics (RFN, RFP)
Symbol
Parameter
fi
input frequency
Conditions
Min
Typ
Max
Unit
840
-
960
MHz
-
17.5
-
dBm
-
30
20
-
%
Normal mode - no external supply, read range reduction OFF
[1][2][7]
Pi(min)
minimum input power
READ sensitivity
Pi(min)
minimum input power
WRITE,
BLOCKWRITE
sensitivity, (write
range/read range ratio)
Ci
input capacitance
parallel
[3]
-
0.77
-
pF
-
-
Q
quality factor
915 MHz
[3]
-
9.2
Z
impedance
866 MHz
[3]
-
27 j234 -

915 MHz
[3]
-
24 j222 -

953MHz
[3]
-
23 j213 -

Ext. supplied READ
[1][2]
-
27
-
dBm
Ext. supplied WRITE
[2]
-
27
-
dBm
externally supplied,
915 MHz
[3]
-
8 -j228
-

4R on READ
[1][2][4]
-
+10
-
dBm
4R on WRITE
[2][4]
-
+10
-
dBm
4R on, 915 MHz
[3]
-
16 j1
-

modulation
resistance, max.
backscatter = off
[5]
-
170
-

modulation
resistance, max.
backscatter = on
[6]
-
55
-

External supply mode - VDD pad supplied, read range reduction OFF
Pi(min)
Z
minimum input power
impedance
Read range reduction ON - no external supply
Pi(min)
Z
minimum input power
impedance
Modulation resistance
R
resistance
[1]
Power to process a Query command.
[2]
Measured with a 50  source impedance.
[3]
At minimum operating power.
[4]
It has to be assured the reader (system) is capable of providing enough field strength to give +10 dBm at the chip otherwise
communication with the chip will not be possible.
[5]
Enables tag designs to be within ETSI limits for return link data rates of e.g. 320 kHz/M4.
[6]
Will result in up to 10 dB higher tag backscatter power at high field strength.
[7]
Results in approx. 18 dBm tag sensitivity on a 2 dBi gain antenna.
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Table 36.
VDD pin characteristics
Symbol
Parameter
Conditions
Minimum supply voltage/current - without assisted EEPROM WRITE
Min
Typ
Max
Unit
[1][3][4]
VDD
supply voltage
minimum voltage
-
-
1.8
V
IDD
supply current
minimum current,
Iout = 0 A
-
-
14
A
-
-
120
A
minimum voltage,
Iout = 0 A
-
1.8
1.85
V
Iout = 100 A
-
-
1.95
V
minimum current,
Iout = 0 A
-
-
135
A
-
-
265
A
Iout = 100 A
Minimum supply voltage/current - assisted EEPROM READ and WRITE
VDD
supply voltage
supply current
IDD
[2][3][4]
Iout = 100 A
[3][5]
Maximum supply voltage/current
VDD
supply voltage
absolute maximum
voltage
2.2
-
-
V
Ii(max)
maximum input current
absolute maximum
current
280
-
-
A
[1]
Activates Digital Output (OUT pin), increases read range (external supplied).
[2]
Activates Digital Output (OUT pin), increases read and write range (external supplied).
[3]
Operating the chip outside the specified voltage range may lead to undefined behavior.
[4]
Either the voltage or the current needs to be above given values to guarantee specified functionality.
[5]
No proper operation is guaranteed if both, voltage and current, limits are exceeded.
Table 37.
G2iM, G2iM+ VDD and OUT pin characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
OUT pin characteristics
VOL
Low-level output voltage
Isink = 1mA
-
-
100
mV
VOH
HIGH-level output voltage
VDD = 1.8 V; Isource
= 100A
1.5
-
-
V
VDD/OUT pin characteristics
load capacitance
CL
output voltage
Vo
VDD - OUT pin max.
[1]
-
-
5
pF
maximum RF peak
voltage on VDD-OUT
pins
[2]
-
-
500
mV
[3]
VDD/OUT pin tamper alarm characteristics
RL(max)
RL(min)
maximum load resistance
minimum load resistance
resistance range high
[4]
-
-
<2
M
resistance range low
[5]
>20
-
-
M
[1]
Is the sum of the allowed capacitance of the VDD and OUT pin referenced to RFN.
[2]
Is the maximum allowed RF input voltage coupling to the VDD/OUT pin to guarantee undisturbed chip functionality.
[3]
Resistance between VDD and OUT pin in checked during power up only.
[4]
Resistance range to achieve tamper alarm flag = 1.
[5]
Resistance range to achieve tamper alarm flag = 0:
SL3S1003_1013
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Table 38.
Symbol
UCODE G2iM and UCODE G2iM+ memory characteristics
Parameter
Conditions
Min
Typ
Max
Unit
20
-
-
year
1000
10000[1]
-
cycle
Typ
Max
Unit
EEPROM characteristics
tret
retention time
Nendu(W)
write endurance
[1]
Tamb 55 C
Tamb 25 C
12.2 UCODE G2iM+ SOT886 characteristics
Table 39.
G2iM+ RF interface characteristics (RFN, RFP)
Symbol
Parameter
Conditions
Min
Normal mode - no external supply, read range reduction OFF
Pi(min)
minimum input power
READ
sensitivity
[1][2]
-
17.6
-
dBm
Z
impedance
915 MHz
[3]
-
21.2 -j199.7
-

-

Normal mode - externally supply VDD = 1.8V, read range reduction OFF
Z
impedance
915 MHz
[1]
Power to process a Query command.
[2]
Measured with a 50  source impedance.
[3]
At minimum operating power.
[3]
-
6.9 -j205.5
Remark: For DC and memory characteristics refer to Table 36, Table 37 and Table 38.
SL3S1003_1013
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13. Package outline
SOT886
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm
b
1
2
3
4x
(2)
L
L1
e
6
5
e1
4
e1
6x
A
(2)
A1
D
E
terminal 1
index area
0
1
2 mm
scale
Dimensions (mm are the original dimensions)
Unit
max
nom
min
mm
A(1)
0.5
A1
b
D
E
0.04 0.25 1.50 1.05
0.20 1.45 1.00
0.17 1.40 0.95
e
0.6
e1
0.5
L
L1
0.35 0.40
0.30 0.35
0.27 0.32
Notes
1. Including plating thickness.
2. Can be visible in some manufacturing processes.
Outline
version
IEC
SOT886
Fig 8.
sot886_po
References
JEDEC
JEITA
European
projection
Issue date
04-07-22
12-01-05
MO-252
Package outline SOT886
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14. Handling information
14.1 Assembly conditions
14.1.1 General assembly recommendations
While pads OUT and VDD are not used for UCODE G2iM (SL3S1003), they are still
electrically active and therefore must not be connected to the antenna and the RFN and
RFP pads.
In case of any doubts, the customer is constrained to contact NXP Semiconductors for
further clarification.
14.1.2 Label converting
Generally, an optimization of the entire lamination process by label manufacturer is
recommended in order to minimize the stress onto the module and guarantee high
assembly yield. Roller diameter must not be smaller than 45 mm.
15. Packing information
15.1 Wafer
See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BU-ID document number: 1093**”
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16. Abbreviations
Table 40.
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Product data sheet
COMPANY PUBLIC
Abbreviations
Acronym
Description
CRC
Cyclic Redundancy Check
CW
Continuous Wave
DC
Direct Current
EAS
Electronic Article Surveillance
EEPROM
Electrically Erasable Programmable Read Only Memory
EPC
Electronic Product Code (containing Header, Domain Manager, Object Class
and Serial Number)
ESD
ElectroStatic Discharge
FCS
Flip Chip Strap
FM0
Bi phase space modulation
G2
Generation 2
HBM
Human Body Model
IC
Integrated Circuit
PSF
Product Status Flag
PCB
Printed Circuit Board
RF
Radio Frequency
UHF
Ultra High Frequency
TID
Tag IDentifier
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17. References
[1]
EPCglobal: EPC Radio-Frequency Identity Protocols Class-1 Generation-2 UHF
RFID Protocol for Communications at 860 MHz – 960 MHz, Version 1.1.0
(December 17, 2005)
[2]
EPCglobal: EPC Tag Data Standards
[3]
EPCglobal (2004): FMCG RFID Physical Requirements Document (draft)
[4]
EPCglobal (2004): Class-1 Generation-2 UHF RFID Implementation Reference
(draft)
[5]
European Telecommunications Standards Institute (ETSI), EN 302 208:
Electromagnetic compatibility and radio spectrum matters (ERM) – Radio-frequency
identification equipment operating in the band 865 MHz to 868 MHz with power
levels up to 2 W, Part 1 – Technical characteristics and test methods
[6]
European Telecommunications Standards Institute (ETSI), EN 302 208:
Electromagnetic compatibility and radio spectrum matters (ERM) – Radio-frequency
identification equipment operating in the band 865 MHz to 868 MHz with power
levels up to 2 W, Part 2 – Harmonized EN under article 3.2 of the R&TTE directive
[7]
[CEPT1]: CEPT REC 70-03 Annex 1
[8]
[ETSI1]: ETSI EN 330 220-1, 2
[9]
[ETSI3]: ETSI EN 302 208-1, 2 V<1.1.1> (2004-09-Electromagnetic compatibility
And Radio spectrum Matters (ERM) Radio Frequency Identification Equipment
operating in the band 865 - MHz to 868 MHz with power levels up to 2 W Part 1:
Technical characteristics and test methods.
[10] [FCC1]: FCC 47 Part 15 Section 247
[11] ISO/IEC Directives, Part 2: Rules for the structure and drafting of International
Standards
[12] ISO/IEC 3309: Information technology – Telecommunications and information
exchange between systems – High-level data link control (HDLC) procedures –
Frame structure
[13] ISO/IEC 15961: Information technology, Automatic identification and data capture –
Radio frequency identification (RFID) for item management – Data protocol:
application interface
[14] ISO/IEC 15962: Information technology, Automatic identification and data capture
techniques – Radio frequency identification (RFID) for item management – Data
protocol: data encoding rules and logical memory functions
[15] ISO/IEC 15963: Information technology — Radio frequency identification for item
management — Unique identification for RF tags
[16] ISO/IEC 18000-1: Information technology — Radio frequency identification for item
management — Part 1: Reference architecture and definition of parameters to be
standardized
[17] ISO/IEC 18000-6: Information technology automatic identification and data capture
techniques — Radio frequency identification for item management air interface —
Part 6: Parameters for air interface communications at 860–960 MHz
[18] ISO/IEC 19762: Information technology AIDC techniques – Harmonized vocabulary
– Part 3: radio-frequency identification (RFID)
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[19] U.S. Code of Federal Regulations (CFR), Title 47, Chapter I, Part 15:
Radio-frequency devices, U.S. Federal Communications Commission.
[20] Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BU-ID document number: 1093**3
3.
** ... document version number
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SL3S1003_1013
NXP Semiconductors
UCODE G2iM and G2iM+
18. Revision history
Table 41.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
SL3S1003_1013 v. 3.7
20150521
Product data sheet
-
SL3S1003_1013 v. 3.6
Modifications:
SL3S1003_1013 v. 3.6
Modifications:
SL3S1003_1013 v. 3.5
Modifications:
SL3S1003_1013 v. 3.4
Modifications:
SL3S1003_1013 v. 3.3
Modifications:
SL3S1003_1013 v. 3.2
Modifications:
SL3S1003_1013 v. 3.1
Modifications:
SL3S1003_1013 v. 3.0
Modifications:
SL3S1003_1013 v. 2.0
SL3S1003_1013
Product data sheet
COMPANY PUBLIC
•
•
Table 36 “VDD pin characteristics”: current units corrected
Section 10.7.1 “ChangeConfig”: “Digital Switch” updated
20141017
Product data sheet
-
SL3S1003_1013 v. 3.5
•
Table 21 “User Memory Configuration with 2 areas (no Access password protected area)”:
corrected
•
Table 39 “G2iM+ RF interface characteristics (RFN, RFP)”: corrected
20131107
•
•
•
•
Product data sheet
Table 2 “Marking codes”: updated
Section 2.2 “Key benefits”: title updated
Table 39 “G2iM+ RF interface characteristics (RFN, RFP)”: title updated
Product data sheet
Product data sheet
Product data sheet
Product data sheet
-
SL3S1003_1013 v. 3.1
-
SL3S1003_1013 v. 3.0
Security status changed into COMPANY PUBLIC
Package delivery form SOT886 added
Section 5 “Marking”, Section 13 “Package outline”: added
20110503
•
•
•
SL3S1003_1013 v. 3.2
Section 8.1 “Wafer layout”: figure notes (1), (2), (8) and (9) updated
20111117
•
•
•
SL3S1003_1013 v. 3.3
Section 14 “Handling information”: added
20120111
•
-
Figure 4 “SL3S10x3 wafer layout”: Figure notes (1) and (2) updated
20120130
•
SL3S1003_1013 v. 3.4
Table 1 “Ordering information”: updated
20120227
•
-
Product data sheet
-
SL3S1003_1013 v. 2.0
-
-
Specification status changed into product
Some EPC bit values changed
Table 16 added
20110415
Preliminary data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3.7 — 21 May 2015
201237
© NXP Semiconductors N.V. 2015. All rights reserved.
40 of 43
SL3S1003_1013
NXP Semiconductors
UCODE G2iM and G2iM+
19. Legal information
19.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
19.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
19.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
SL3S1003_1013
Product data sheet
COMPANY PUBLIC
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 3.7 — 21 May 2015
201237
© NXP Semiconductors N.V. 2015. All rights reserved.
41 of 43
SL3S1003_1013
NXP Semiconductors
UCODE G2iM and G2iM+
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
19.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
UCODE — is a trademark of NXP Semiconductors N.V.
20. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
SL3S1003_1013
Product data sheet
COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.7 — 21 May 2015
201237
© NXP Semiconductors N.V. 2015. All rights reserved.
42 of 43
NXP Semiconductors
SL3S1003_1013
UCODE G2iM and G2iM+
21. Contents
1
2
2.1
2.1.1
2.2
2.2.1
2.2.2
2.2.3
2.3
3
3.1
3.2
4
5
6
7
7.1
8
8.1
9
9.1
9.1.1
9.1.2
9.1.3
10
10.1
10.2
10.3
10.3.1
10.3.2
10.4
10.5
10.6
10.6.1
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Key features . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Key benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
End user benefit . . . . . . . . . . . . . . . . . . . . . . . . 2
Antenna design benefits . . . . . . . . . . . . . . . . . . 2
Label manufacturer benefit . . . . . . . . . . . . . . . . 2
Custom commands. . . . . . . . . . . . . . . . . . . . . . 3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Markets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Ordering information . . . . . . . . . . . . . . . . . . . . . 4
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pinning information . . . . . . . . . . . . . . . . . . . . . . 6
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6
Wafer layout . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Wafer layout . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Mechanical specification . . . . . . . . . . . . . . . . . 8
Wafer specification . . . . . . . . . . . . . . . . . . . . . . 8
Wafer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Fail die identification . . . . . . . . . . . . . . . . . . . . 9
Map file distribution. . . . . . . . . . . . . . . . . . . . . . 9
Functional description . . . . . . . . . . . . . . . . . . 10
Air interface standards . . . . . . . . . . . . . . . . . . 10
Power transfer . . . . . . . . . . . . . . . . . . . . . . . . 10
Data transfer . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Reader to tag Link . . . . . . . . . . . . . . . . . . . . . 10
Tag to reader Link . . . . . . . . . . . . . . . . . . . . . . 10
UCODE G2iM and UCODE G2iM+ differences 11
Supported commands . . . . . . . . . . . . . . . . . . 11
UCODE G2iM and UCODE G2iM+ memory . 12
UCODE G2iM and UCODE G2iM+ overall
memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 13
10.6.2
UCODE G2iM and UCODE G2iM+ TID
memory details . . . . . . . . . . . . . . . . . . . . . . . . 15
10.7
Custom commands. . . . . . . . . . . . . . . . . . . . . 16
10.7.1
ChangeConfig. . . . . . . . . . . . . . . . . . . . . . . . . 16
UCODE G2iM and UCODE G2iM+ special
features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
10.7.2
UCODE G2iM and UCODE G2iM+ special
features control mechanism . . . . . . . . . . . . . . 20
10.7.3
UCODE G2iM+ memory configuration control
mechanism . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
10.7.4
Private Memory Segment . . . . . . . . . . . . . . . . 24
10.7.5
ReadProtect . . . . . . . . . . . . . . . . . . . . . . . . . .
10.7.6
Reset ReadProtect2 . . . . . . . . . . . . . . . . . . . .
10.7.7
ChangeEAS2 . . . . . . . . . . . . . . . . . . . . . . . . .
10.7.8
EAS_Alarm . . . . . . . . . . . . . . . . . . . . . . . . . .
11
Limiting values . . . . . . . . . . . . . . . . . . . . . . . .
12
Characteristics . . . . . . . . . . . . . . . . . . . . . . . .
12.1
UCODE G2iM and UCODE G2iM+ bare die
characteristics . . . . . . . . . . . . . . . . . . . . . . . .
12.2
UCODE G2iM+ SOT886 characteristics . . . .
13
Package outline. . . . . . . . . . . . . . . . . . . . . . . .
14
Handling information . . . . . . . . . . . . . . . . . . .
14.1
Assembly conditions . . . . . . . . . . . . . . . . . . .
14.1.1
General assembly recommendations . . . . . .
14.1.2
Label converting. . . . . . . . . . . . . . . . . . . . . . .
15
Packing information . . . . . . . . . . . . . . . . . . . .
15.1
Wafer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . .
17
References. . . . . . . . . . . . . . . . . . . . . . . . . . . .
18
Revision history . . . . . . . . . . . . . . . . . . . . . . .
19
Legal information . . . . . . . . . . . . . . . . . . . . . .
19.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
19.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
19.3
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . .
19.4
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
20
Contact information . . . . . . . . . . . . . . . . . . . .
21
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
25
26
28
29
31
32
32
34
35
36
36
36
36
36
36
37
38
40
41
41
41
41
42
42
43
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2015.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 21 May 2015
201237
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