Data Sheet

SL3S1004_1014
UCODE 7xm and UCODE 7xm+
Rev. 3.1 — 27 July 2015
325031
Product data sheet
COMPANY PUBLIC
1. General description
The UCODE 7xm series is the latest generation of NXP’s memory UHF tag ICs. With the
leading-edge read range UCODE 7xm is well suited for applications which require high
read range and also demanding an extended user memory to store data specific to
customer or products. UCODE 7xm offers an user memory of 1-kbit, whereas UCODE
7xm+ supports 2-kbit user memory and a 384-bit digital signature.
Both products incorporate features known from UCODE 7 like self pre-serialization, tag
power indicator as well as the product status flag.
There are numbers of applications where the combination of high read range and user
memory is needed, such as:
• Inventory and supply chain management
• Process optimization (e.g in the automotive industry)
• Brand protection/authentication (e.g. expensive wines or branded luxury fashion
items)
• Automatic vehicle ID where no cryptography is required
• Asset tracking (e.g. for high value assets)
2. Features and benefits
2.1 Key features
Read sensitivity 19 dBm
Write sensitivity 12 dBm
Encoding speed: 32 bits per 1.5 milliseconds
Up to 2-kbit user memory
Digital signature
Standard functionality
 Untraceable feature
 Tag Power Indicator
 Automatic self pre-serialization for 96-bit EPC
 Integrated Product Status Flag (PSF)
 Parallel encoding mode
 According to EPCglobal v1.2.0
 Compatible with single-slit antenna






SL3S1004_1014
NXP Semiconductors
UCODE 7xm and UCODE 7xm+
2.1.1 Memory












Up to 448-bit of EPC memory
Supports self pre-serialization for 96-bit EPC
96-bit Tag IDentifier (TID) factory locked
48-bit unique serial number factory-encoded into TID
1-kbit user memory for UCODE 7xm
2-kbit user memory for UCODE 7xm+
384-bit digital signature in UCODE 7xm+
32-bit kill password to permanently disable the tag
32-bit access password
Wide operating temperature range: 40 C up to +85 C
Minimum 100.000 write cycle endurance
Data retention 20 years
2.2 Key benefits
2.2.1 End user benefit




Extended user memory of up to 2-kbit
Brand protection feature using digital signature
Long read/write ranges due to leading edge chip sensitivity
Reliable operation in dense reader and noisy environments through high interference
rejection
2.2.2 Antenna design benefits
 High sensitivity enables smaller and cost efficient antenna designs
 Selected chip impedance enables re-use of antenna designs from UCODE 7
2.2.3 Label/module manufacturer benefit





Large RF pad-to-pad distance to ease antenna design
Symmetric RF inputs are less sensitive to process variation
Single-slit antenna for a more mechanically stable antenna connection
Automatic self pre-serialization of the 96-bit EPC
Extremely fast encoding of the EPC content
2.3 Supported features
 All mandatory commands of EPCglobal v1.2.0 specification are implemented
 The following optional commands are implemented:
 Access
 BlockPermalock (block size of 256-bit)
 32-bit BlockWrite
 Implemented custom commands and features:
 Untraceable
 ReadSignature
 Product Status Flag bit: enables the UHF RFID tag to be used as EAS
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UCODE 7xm and UCODE 7xm+
(Electronic Article Surveillance) tag without the need for a back-end data base.
 Tag Power Indicator: enables the reader to select only ICs/tags that have enough
power to be written to.
 Parallel encoding: allows for the ability to bring (multiple) tag(s) quickly to the
OPEN state and hence allowing single tags to be identified simply, without timing
restrictions, or multiple tags to be e.g. written to at the same time, considerably
reducing the encoding process
UCODE 7xm can be used in combination with readers compliant with EPCglobal v1.2.0
standard. For access to full UCODE 7xm family functionality firmware upgrade of the
reader may be necessary.
3. Applications
3.1 Markets
 Logistics
 Brand protection (luxury branded fashion goods)
 Process automation
3.2 Applications





Inventory and supply chain management
Asset tracking
Process optimization(e.g in the automotive industry)
Automatic vehicle ID where no cryptography is required
Brand protection/authentication (e.g. expensive wines or branded luxury fashion
items)
 Parking access
 Fleet management
 Loss prevention
4. Ordering information
Table 1.
Ordering information
Type number
Package
Name
IC type
Description
Version
SL3S1004FUD/BG
Wafer
UCODE 7xm
Gold bumped die on sawn 8” 120 m wafer with 7 m
Polyimide spacer;
not applicable
SL3S1014FUD/BG
Wafer
UCODE 7xm+ Gold bumped die on sawn 8” 120 m wafer with 7 m
Polyimide spacer;
not applicable
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UCODE 7xm and UCODE 7xm+
5. Block diagram
The UCODE 7xm/7xm+ consists of three major blocks:
- Analog Interface
- Digital Control
- EEPROM
The analog part provides stable supply voltage and demodulates data received from the
reader which is then processed by the digital part. Further, the modulation transistor of the
analog part transmits data back to the reader.
The digital control includes the state machines, processes the protocol and handles
communication with the EEPROM, which contains the EPC and the user data.
ANALOG
RF INTERFACE
DIGITAL CONTROL
VREG
VDD
DEMOD
data
in
RF1
RECT
EEPROM
ANTICOLLISION
READWRITE
CONTROL
MEMORY
ACCESS CONTROL
antenna
MOD
RF2
data
out
R/W
EEPROM INTERFACE
CONTROL
RF INTERFACE
CONTROL
SEQUENCER
CHARGE PUMP
aaa-005856
Fig 1.
SL3S1004_1014
Product data sheet
COMPANY PUBLIC
Block diagram of UCODE 7xm/7xm+ ICs
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UCODE 7xm and UCODE 7xm+
6. Pinning information
RF2
RF1
NXP trademark
TP1
TP2
aaa-017985
Fig 2.
Pinning bare die
6.1 Pin description
Table 2.
SL3S1004_1014
Product data sheet
COMPANY PUBLIC
Pin description bare die
Symbol
Description
TP1
test pad 1
RF1
antenna connector 1
TP2
test pad 2
RF2
antenna connector 2
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UCODE 7xm and UCODE 7xm+
7. Wafer layout
7.1 Wafer layout
(1)
RF2
RF1
(5)
Y
(6)
(4)
X
(7)
TP1
TP2
(8)
(2)
(3)
not to scale!
aaa-017986
(1) Die to Die distance (metal sealring - metal sealring) 21,4 m, (X-scribe line width: 15 m)
(2) Die to Die distance (metal sealring - metal sealring) 21,4 m, (Y-scribe line width: 15 m)
(3) Chip step, x-length: 585m
(4) Chip step, y-length: 645 m
(5) Bump to bump distance X (RF1 - RF2): 480 m
(6) Bump to bump distance Y (TP1 - RF2): 540 m
(7) Distance bump to metal sealring X: 41,8m (outer edge - top metal)
(8) Distance bump to metal sealring Y: 41,8 m
Bump size X x Y: 60 m x 60 m
Remark: TP1 and TP2 are electrically disconnected after dicing
Fig 3.
SL3S1004_1014
Product data sheet
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UCODE 7xm/7xm+ wafer layout
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UCODE 7xm and UCODE 7xm+
8. Mechanical specification
The UCODE 7xm/7xm+ wafers are available in 120 m thickness with 7m Polyimide
spacer, resulting in less coupling between the antenna and the active circuit.
8.1 Wafer specification
See Ref. 4 “Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BU-ID document number: 1093**”.
8.1.1 Wafer
Table 3.
Specifications
Wafer
Designation
each wafer is scribed with batch number and
wafer number
Diameter
200 mm (8”) unsawn - 205 mm typical sawn
on foil
Thickness
120 m  15 m
Number of pads
4
Pad location
non diagonal / placed in chip corners
Distance pad to pad RF1-RF2
480.0 m
Distance pad to pad TP1-RF2
540.0 m
Process
CMOS 0.14 m
Batch size
25 wafers
Potential good dies per wafer
77.773
Wafer backside
Material
Si
Treatment
ground and stress release
Roughness
Ra max. 0.5 m, Rt max. 5 m
Chip dimensions
Die size excluding scribe
0.570 mm  0.630 mm = 0.359 mm2
Scribe line width:
x-dimension = 15 m
y-dimension = 15 m
Passivation on front
Type
Sandwich structure
Material
PE-Nitride (on top)
Thickness
1.75 m total thickness of passivation
Polyimide spacer
7 m  1 m
Au bump
Bump material
> 99.9 % pure Au
Bump hardness
35 – 80 HV 0.005
Bump shear strength
> 70 MPa
Bump height
25 m[1]
Bump height uniformity
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UCODE 7xm and UCODE 7xm+
Table 3.
Specifications
within a die
 2 m
– within a wafer
 3 m
– wafer to wafer
 4 m
Bump flatness
 1.5 m
Bump size
– RF1, RF2
60  60 m
– TP1, TP2
60  60 m
Bump size variation
 5 m
[1]
Because of the 7 m spacer, the bump will measure 18 m relative height protruding the spacer.
8.1.2 Fail die identification
No inkdots are applied to the wafer.
Electronic wafer mapping (SECS II format) covers the electrical test results and
additionally the results of mechanical/visual inspection.
See Ref. 4 “Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BU-ID document number: 1093**”
8.1.3 Map file distribution
See Ref. 4 “Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BU-ID document number: 1093**”
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UCODE 7xm and UCODE 7xm+
9. Functional description
9.1 Air interface standards
The UCODE 7xm/7xm+ fully supports all mandatory parts of the EPCglobal v1.2.0
specification.
9.2 Power transfer
The interrogator provides an RF field that powers the tag, equipped with a UCODE
7xm/7xm+ IC. The antenna transforms the impedance of free space to the chip input
impedance in order to get the maximum possible power for the UCODE 7xm/7xm+ on the
tag.
The RF field, which is oscillating on the operating frequency provided by the interrogator,
is rectified to provide a rectified DC voltage to the analog and digital modules of the IC.
The antenna attached to the chip may use a DC connection between the two antenna
pads. Therefore the UCODE 7xm/7xm+ also enables loop antenna design.
9.3 Data transfer
9.3.1 Interrogator to tag Link
An interrogator transmits information to the UCODE 7xm/7xm+ by modulating a UHF RF
signal. The UCODE 7xm/7xm+ receives both information and operating energy from this
RF signal. Tags are passive, meaning that they have no battery and receive all of their
operating energy from the interrogator's RF waveform.
An interrogator is using a fixed modulation and data rate for the duration of at least one
inventory round. It communicates to the UCODE 7xm/7xm+ by modulating an RF carrier.
For further details refer to Ref. 1.
9.3.2 Tag to interrogator Link
Upon transmitting a valid command an interrogator receives information from a UCODE
7xm/7xm+ tag by transmitting an un-modulated RF carrier and listening for a
backscattered reply. The UCODE 7xm/7xm+ backscatters by switching the reflection
coefficient of its antenna between two states in accordance with the data being sent. For
further details refer to Ref. 1.
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UCODE 7xm and UCODE 7xm+
9.4 UCODE 7xm and UCODE 7xm+ Overview
This table should provide a quick overview on the features implemented in UCODE 7xm
and UCODE 7xm+. Details on the features are described in the following paragraphs.
Table 4.
Overview of UCODE 7xm and UCODE 7xm+
Features
UCODE 7xm
UCODE 7xm+
User Memory
1024 bit
2048 bit
EPC Memory
max 448 bit
max 448 bit
TID Memory
96 bit
96 bit
Access Password
32 bit
32 bit
Kill Password
32 bit
32 bit
PSF (Product Status Flag)
yes
yes
BlockWrite (32 bit)
yes
yes
BlockPermalock (256 bit block size)
yes
yes
Pre-Serialization of 96-bit EPC
yes
yes
Parallel Encoding
yes
yes
Backscatter strength reduction
yes
yes
Tag Power Indicator
yes
yes
Untraceable feature
yes
yes
Digital Signature (384-bit)
-
yes
9.5 Supported commands
The UCODE 7xm/7xm+ support all mandatory EPCglobal v1.2.0 commands.
In addition the following optional commands are supported:
• Access
• BlockPermalock (256 bit block size)
• BlockWrite (max 32 bit on even addresses only)
UCODE 7xm/7xm+ also offers the following custom commands:
• Untraceable
• ReadSignature (UCODE 7xm+ only)
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UCODE 7xm and UCODE 7xm+
9.5.1 Custom commands
9.5.1.1
Untraceable
The Untraceable function allows the UCODE 7xm/7xm+ to hide the complete or parts of
the EPC, TID and/or user memory. In addition the read range can be completely or
temporarily reduced.
This command can only be executed from the secured state.
Memory parts which are set untraceable are acting as non-existing.
EPC-field:
Specifies the number of words of the EPC memory which the UCODE 7xm/xm+ back
scatters. A change of this field therefore also changes the L bit in the Protocol Control
(PC) word.
TID-field:
Hide some (“01”) will hide the TID memory from address 20h (included) onwards.
Range-field:
In case of activated range toggling the read range reduction toggles from the actual value
to the second. (e.g. when actual state is normal it toggles to reduced). In case of power
loss the chip reverts to it’s prior state
UCODE 7xm/7xm+ does not support the U bit and therefore ignores this value.
Table 5.
No. of bits
Untraceable command
Command
RFU U
EPC
TID
User
Range
RN
CRC
16
2
1
6
2
1
2
16
16
don’t
care
MSB:
“0”:
show memory above
EPC
“1”:
hide memory above
EPC
“00”: hide none “0”: view “00”: normal handle CRC-16
“01”: hide some “1”: hide “01”: toggle
“10”: hide all
“10”: reduced
“11”: RFU
“11”: RFU
Description 1110 0010 00
0000 0000
5 LSBs:
New EPC length
Table 6.
Untraceable command-response table
Starting State
Condition
Response
Next State
ready
all
-
ready
arbitrate, reply,
acknowledged
all
-
arbitrate
open
all
-
open
secured
executable
backscatter header when done
secured
killed
all
-
killed
In case of an access to the tag the error condition “memory overrun” will be returned.
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UCODE 7xm and UCODE 7xm+
9.5.1.2
ReadSignature (UCODE 7xm+ only)
The ReadSignature command allows the read out of the pre-programmed Digital
Signature and includes a CRC-16 calculated over the whole command, the handle and
the a frame-sync.
Table 7.
ReadSignature command
Command
WordPtr
WordCount
RN
CRC
No. of bits
16
EVB
8
16
16
Description
1110 0000 0000 1000
Starting
Address
Pointer
Number of words to read
Handle
CRC-16
Table 8.
Tag reply to a successful ReadSignature command
Header
Signature Words
RN
CRC
No. of bits
1
Variable
16
16
Description
0
Digital Signature
Handle
CRC-16
The error Response “memory overrun” is returned in case WordCount=0 or in case
WordPtr or the combination of WordPtr and WordCountexceeds exceeds the range of the
Digital Signature.
Table 9.
ReadSignature command-response table
Starting State
Condition
Response
Next State
ready
all
-
ready
arbitrate, reply,
acknowledged
all
-
arbitrate
open
all
backscatter data
open
secured
all
backscatter data
secured
killed
all
-
killed
Digital Signature
The UCODE 7xm+ is delivered with a factory pre-programmed 384-bit Digital Signature
based on the Elliptic Curve Digital Signature Algorithm (ECDSA) using a 192-bit
cryptographic key. The parameters of the curve are according NIST P-192 (secp 192r1).
The data digital signed is the 96-bit TID of the UCODE 7xm+.
Verification of the digital signature:
After issuing the ReadSignature command the tag will return the 384-bit digital signature.
With the knowledge of the Public Key and the algorithm a verification that the silicon is an
origin NXP Semiconductors can be made.
UCODE 7xm+ Public Key:
04A72DB4B83233DD9A9711DB071281F14451747F815EEB111F1D4CD3DCAD60250C
830CD287DCEC0B39C76262BA998B7E01
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UCODE 7xm and UCODE 7xm+
MS VC++ Code Example
/**
* Check Originality Signature on curve NID_X9_62_prime192v1
**/
unsigned char CheckOriginalitySignature192UCode7xmBinary(unsigned char * aUid,
unsigned char * aSignature)
{
/* secp192v1 => ECC_Length=24; */
unsigned int ECC_Length = 24;
unsigned int bLength = 12;
char* publickey_str =
“04A72DB4B83233DD9A9711DB071281F14451747F815EEB111F1D4
CD3DCAD60250C830CD287DCEC0B39C76262BA998B7E01"; /* UCODE7xm */
BIGNUM *pk_bignum = BN_new();
EC_POINT *public_key = NULL;
/* Create a EC_KEY for specified curve */
EC_KEY *pubKey = EC_KEY_new_by_curve_name(NID_X9_62_prime192v1);
const EC_GROUP *ecgroup = EC_KEY_get0_group(pubKey);
ECDSA_SIG *signature = ECDSA_SIG_new();
unsigned char r[24]; /* ECC_Length */
unsigned char s[24]; /* ECC_Length */
char r_dest[24*2+1]; /* ECC_Length *2 +1 */
char s_dest[24*2+1]; /* ECC_Length *2 +1 */
unsigned int loop = 0;
if (signature == NULL )
{
return 1;
}
if (pubKey == NULL)
{
printf("Creation of PubKey failed \n");
return 1;
}
/* Convert the hex public key x,y co-ordinates to BIGNUM */
BN_hex2bn(&pk_bignum, publickey_str);
public_key = EC_POINT_bn2point(ecgroup, pk_bignum, NULL, NULL);
/* Set the public key point to EC_KEY */
EC_KEY_set_public_key(pubKey, public_key);
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/* Extract the r and s part of the signature*/
memcpy(r, aSignature, ECC_Length);
memcpy(s, aSignature+ECC_Length, ECC_Length);
/* BIGNUM conversion function expects r in ASCII value */
for(loop = 0;loop < ECC_Length; loop++)
{
sprintf_s((r_dest+(loop*2)), 3, "%02X", r[loop]);
sprintf_s((s_dest+(loop*2)), 3, "%02X", s[loop]);
}
BN_hex2bn(&signature->r, r_dest);
BN_hex2bn(&signature->s, s_dest);
/*Signature verification for the UID sent*/
if (ECDSA_do_verify(aUid, bLength, signature, pubKey) == 1)
{
printf("\nSignature verified successfully\n\n");
return 0;
}
else
{
printf("\nSignature verification failed\n\n");
return 1;
}
}
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UCODE 7xm and UCODE 7xm+
9.6 UCODE 7xm/7xm+ memory
The UCODE 7xm/7xm+ memory is implemented according EPCglobal v1.2.0 and
organized in four banks:
Table 10.
UCODE 7xm memory sections
Name
Size
Bank
Reserved memory (32 bit ACCESS and 32 bit KILL password)
64 bit
00b
EPC (excluding CRC, PC)
448 bit
01b
TID (including permalocked unique 48 bit serial number)
96 bit
10b
User Memory
1024bit
11b
Name
Size
Bank
Reserved memory (32 bit ACCESS and 32 bit KILL password)
64 bit
00b
EPC (excluding CRC, PC)
448 bit
01b
TID (including permalocked unique 48 bit serial number)
96 bit
10b
User Memory
2048bit
11b
Table 11.
UCODE 7xm+ memory sections
The logical address of all memory banks begin at zero (00h).
In addition to the four memory banks a configuration word to handle the UCODE
7xm/7xm+ specific features is available at address 200h in the EPC memory. The
configuration word is described in detail in Section 9.7.1 “UCODE 7xm/7xm+ features
control mechanism”.
The TID complies to the extended tag Identification scheme according GS1 EPC Tag Data
Standard 1.9. (Ref. 2)
The EPC content will follow a self pre-serialization scheme following the Multi Vendor
Chip-based serialization scheme (Ref. 5) see Section 9.7.3 “Automatic self
pre-serialization of the 96-bit EPC” for more details.
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UCODE 7xm and UCODE 7xm+
9.6.1 UCODE 7xm/7xm+ overall memory map
Table 12.
UCODE 7xm/7xm+ overall memory map
Bank
address
Memory
address
Type
Content
Bank 00
00h to 1Fh
reserved
kill password
all 00h
unlocked memory
20h to 3Fh
reserved
access password
all 00h
unlocked memory
00h to 0Fh
EPC
CRC-16
10h to 14h
EPC
EPC length
00110b
unlocked memory
15h
EPC
UMI
1b
locked memory
16h
EPC
XPC indicator
0b
hardwired to 0
17h to 1Fh
EPC
numbering system indicator
00h
unlocked memory
unlocked memory
Bank 01
EPC
Bank 01
ConfigWord
Bank 10
TID
Remark
memory mapped
calculated CRC
20h to 1DFh
EPC
EPC
[1]
200h
EPC
RFU
0b
locked memory
201h
EPC
RFU
0b
locked memory
202h
EPC
Parallel encoding
0b
Action bit[4]
203h
EPC
RFU
0b
locked memory
204h
EPC
Tag Power Indicator
0b
Action bit[4]
205h
EPC
RFU
0b
locked memory
206h
EPC
RFU
0b
locked memory
207h
EPC
RFU
0b
locked memory
208h
EPC
RFU
0b
locked memory
209h
EPC
max. backscatter strength
1b
permanent bit[5]
20Ah
EPC
RFU
0b
locked memory
20Bh
EPC
RFU
0b
locked memory
20Ch
EPC
RFU
0b
locked memory
20Dh
EPC
RFU
0b
locked memory
20Eh
EPC
RFU
0b
locked memory
20Fh
EPC
PSF alarm flag
0b
Permanent bit[5]
00h to 07h
TID
allocation class identifier
1110 0010b
locked memory
08h to 13h
TID
tag mask designer identifier
806h
locked memory
config word indicator
1b[2]
locked memory
locked memory
14h
Bank 11
USER
Initial
TID
14h to 1Fh
TID
tag model number
TMNR[3]
20h to 2Fh
TID
XTID header
2000h
locked memory
30h to 5Fh
TID
serial number
SNR
locked memory
000h to 3FFh USER
User Memory
undefined
locked memory
UCODE 7xm and 7xm+
400h to 7FFh USER
User Memory
undefined
locked memory
UCODE 7xm+ only
SL3S1004_1014
Product data sheet
COMPANY PUBLIC
[1]
HEX E280 6000 0000 00nn nnnn nnnn (0000 0000) where n are the nibbles used for the pre-serialized
EPC. See also section 9.6.3
[2]
Indicates the existence of a Configuration Word at the end of the EPC number
[3]
See Figure 4
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UCODE 7xm and UCODE 7xm+
SL3S1004_1014
Product data sheet
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[4]
Action bits: meant to trigger a feature upon a SELECT command on the related bit ref feature control
mechanism, seeSection 9.7.1
[5]
Permanent bit: permanently stored bits in the memory; Read/Writeable according to EPC bank lock status,
see Section 9.7.1
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SL3S1004_1014
Product data sheet
COMPANY PUBLIC
9.6.2 UCODE 7xm/7xm+ TID memory details
Model Number
First 48 bit of TID
memory
Class ID
Mask
Designer
ID
UCODE 7xm
E2806D12
E2h
806h
1b
1010b
0010010b
2000h
UCODE 7xm+
E2806D92
E2h
806h
1b
1011b
0010010b
2000h
Addresses
Config
Word
Indicator
00h
Sub
Version
Version Nr. (Silicon) Nr.
XTID
Header
5Fh
TID
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LS Byte
MS Byte
MSBit
Bit
Address
LSBit
00h
07h 08h
Class Identifier
Bits
7
MSBit
E2h
13h 14h
Mask-Designer Identifier
0
11
(EAN.UCC)
0
806h
Bits
D12h
18h
1b
15
(UCODE 7xm)
14h
S.
I.
B.
0
XTID
0
3
Serial Number
0
47
0
000000000000h to FFFFFFFFFFFFh
1Fh
Model Number
0
6
1010b
0
0010010b
(UCODE 7xm)
Fig 4.
2000h
(indication of 48bit
unique SNR)
19h
Sub Version Number
5Fh
2Fh 30h
Model Number
11
(NXP; with XTID)
Address
1Fh 20h
LSBit
aaa-017987
UCODE 7xm/7xm+ TID memory structure
SL3S1004_1014
UCODE 7xm and UCODE 7xm+
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UCODE 7xm and UCODE 7xm+
9.7 Supported features
The UCODE 7xm/7xm+ is equipped with features of previous UCODE generation. These
include:
- Automatic self pre-serialization of the 96-bit EPC
- Parallel encoding
- Tag Power Indicator
- Backscatter strength reduction
- Product Status Flag (PSF)
- Single-slit antenna solution
These features are implemented in such a way that standard EPCglobal v1.2.0 READ /
WRITE / ACCESS / SELECT commands can be used to operate these features.
The Configuration Word, as mentioned in the memory map, describes the additional
features located at address 200h of the EPC memory.
Bit 14h of the TID indicates the existence of a Configuration Word. This flag will enable the
selection of configuration word enhanced transponders in mixed tag populations.
9.7.1 UCODE 7xm/7xm+ features control mechanism
The different features of the UCODE 7xm/7xm+ can be activated / de-activated by
addressing or changing the content of the corresponding bit in the configuration word
located at address 200h in the EPC memory bank (see Table 13). The de-activation of the
action bit features will only happen after chip reset.
Table 13.
Configuration word UCODE 7xm/7xm+
Locked memory
Action bit
Locked memory Action bit
Locked memory
RFU
RFU
Parallel
encoding
RFU
Tag Power
Indicator
RFU
RFU
RFU
0
1
2
3
4
5
6
7
Table 14.
Configuration word UCODE 7xm/7xm+
Locked Permanent
memory bit
Locked memory
Permanent
bit
RFU
max.
backscatter
strength
RFU
RFU
RFU
RFU
RFU
PSF Alarm bit
8
9
10
11
12
13
14
15
The configuration word contains 2 different type of bits:
• Action bits: meant to trigger a feature upon a SELECT command on the related bit:
Parallel encoding
Tag Power indicator
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UCODE 7xm and UCODE 7xm+
• Permanent bits: permanently stored bits in the memory
Max. Backscatter Strength
PSF Alarm bit
The activation or the de-activation of the feature behind the permanent bits happens only
when attempting to write a “1” value to the related bit (value toggling) - writing “0” value
will have no effect.
If the feature is activated, the related bit will be read with a “1” value and, if de-activated,
with a “0” value.
The permanent bits can only be toggled by using standard EPC WRITE (not a BlockWrite)
if the EPC bank is unlocked or within the SECURED state if the EPC is locked. If the EPC
is permalocked, they cannot be changed.
Action bits will trigger a certain action only if the pointer of the SELECT command exactly
matches the action-bit address (i.e. 202h or 204h), if the length=1 and if mask=1b
(no multiple trigger of actions possible within one single SELECT command).
After issuing a SELECT to any action bits an interrogator shall transmit CW for RTCal
Ref. 3 + 80 s before sending the next command.
If the truncate bit in the SELECT command is set to "1" the SELECT will be ignored.
A SELECT on action bits will not change the digital state of the chip.
The action bits can be triggered regardless if the EPC memory is unlocked, locked or
permalocked.
9.7.2 Backscatter strength reduction
The UCODE 7xm/7xm+ features two levels of backscatter strengths. Per default
maximum backscatter is enabled in order to enable maximum read rates. When clearing
the flag the strength can be reduced if needed.
SL3S1004_1014
Product data sheet
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UCODE 7xm and UCODE 7xm+
9.7.3 Automatic self pre-serialization of the 96-bit EPC
UCODE 7xm TID 96-bit
TID+XTID header
(48-bit)
48-bit Serial number
E280 6D12 2000
Upper 13-bit Serial number
Lower 35-bit Serial number
(NXP)
111
Lower 35-bit from TID SNR
58-bit SKU
E280 6D12 0000 00
00 (2-bit)
Serial number (38-bit)
UCODE 7xm EPC 96-bit
Fig 5.
SL3S1004_1014
Product data sheet
COMPANY PUBLIC
aaa-017988
Automatic self pre-serialization scheme for 96-bit EPC
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UCODE 7xm and UCODE 7xm+
TID
E280
6D12
2000
FFFF
FFFF
FFFF
hex
EPC
word1
E280
word2
6D12
word3
0000
word4
003F
word5
FFFF
word6
FFFF
hex
EXAMPLE
0000
0000
0011
1111
binary
1
Write EPC word6 FFF0h
FFF0
EPC
Self pre-serialization
is gone
word1
word2
word3
word4
word5
word6
E280
6D12
0000
0000
0000
FFF0
0000
0000
0000
0000
hex
binary
2
Write EPC word6 0000h
0000
EPC
Self pre-serialization
is effective again
word1
word2
word3
word4
word5
word6
E280
6D12
0000
003F
FFFF
FFFF
0000
0000
0011
1111
hex
binary
3
Write EPC word4 FFEFh
FFEF
EPC
Self pre-serialization
is gone
word1
word2
word3
word4
word5
word6
E280
6D12
0000
FFEF
0000
0000
1111
1111
1110
1111
hex
binary
4
Write EPC word4 FF3Fh
FF3F
EPC
Self pre-serialization
is effective again
word1
word2
word3
word4
word5
word6
E280
6D12
0000
FF3F
FFFF
FFFF
1111
1111
0011
1111
hex
binary
5
Increase EPC length to 128-bit
EPC
Self pre-serialization
is gone
E280
6D12
1111
0000
1111
FF00
0000
0000
0000
0000
0000
binary
0000
hex
aaa-017989
Fig 6.
SL3S1004_1014
Product data sheet
COMPANY PUBLIC
Illustration of the handling of the EPC self-preserialization
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UCODE 7xm and UCODE 7xm+
Description
In case the EPC length is set to be 96-bit, the EPC is by default self pre-serialized
following a 96-bit EPC serialization scheme according to the Multi Vendor Chip-based
serialization guideline (see Ref. 5), meaning the lower 38-bit will always contain 3 bits for
the manufacturer code (111 for NXP) and 35 bit serial number taken from the lower 35 bits
of the TID serial number (see Figure 5).
As long as the initial content of the lower 38-bit of the EPC is not changed, the EPC will
appear serialized. As soon as any of those 38 bits are written, the EPC will show the
written content.
Once the pre-serialization of the EPC is overwritten and the EPC is not locked, the self
pre-serialization can be re-activated by one of the following ways:
• Setting the 38-bit Serial number of the EPC to “0” (see Figure 5), or
• Erase sixth and fifth word of the EPC to “00 00h” and keep the content of the lower 6
bits of the fourth word of the EPC at its serialized content (see Figure 6).
The self pre-serialization only applies to an EPC length of 96 bits, which is the initial EPC
length settings of UCODE 7xm/7xm+.
Use cases and benefits
This automatic EPC serialization is meant to be able to guarantee a unique EPC number
for each tagged items even if the same Stock Keeping Unit (SKU) i.e. same product type
is used. By being serialized by default, the encoding process of the tags with UCODE 7xm
gets simpler and faster as it only needs to encode the SKU (58-bit header of the EPC).
9.7.4 Parallel encoding
Description
This feature of the UCODE 7xm/7xm+ can be activated by the “Parallel encoding bit” in
the Configuration-Word located at (202h).
Upon issuing a EPC SELECT command on the “Parallel encoding bit”, in a population of
UCODE 7xm/7xm+ tags, a subsequent QUERY brings all tags go the OPEN state with a
specific handle (“AAAAh”).
Once in the OPEN state, for example a WRITE command will apply to all tags in the
OPEN state (see Figure 8). This parallel encoding is considerably lowering the encoding
time compared to a standard implementation (see Figure 7).
The amount of tags that can be encoded at the same time will depend on the strength of
the reader signal. Since all tags will backscatter their ACKNOWLEDGE (ACK) response
at the same time, the reader will observe collision in the signal from the tags.
SL3S1004_1014
Product data sheet
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NXP Semiconductors
SL3S1004_1014
QUERY/Adjust/Rep
READER
WRITE
Req_RN
Req_RN
ACK
WRITE
Req_RN
(16-bit)
handle
RN16
handle
TAG 1
handle
RN16
TAG 2
handle
PC + EPC
Tags
handle
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PC + EPC
ACK
Req_RN
(16-bit)
RN16
Product data sheet
COMPANY PUBLIC
QUERY/Adjust/Rep
Only TAG 1 is being addressed
24 of 35
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Fig 7.
Example of 16-bit Write command with standard EPC Gen 2 commands
SL3S1004_1014
aaa-006843
UCODE 7xm and UCODE 7xm+
Only TAG 2 is being addressed
SL3S1004_1014
NXP Semiconductors
UCODE 7xm and UCODE 7xm+
SELECT on
Parallel
encoding bit
QUERY (Q=0)
WRITE
READER
TAG 1
AAAAh
AAAAh
AAAAh
AAAAh
Tags
AAAAh
AAAAh
Req_RN
(16-bit)
TAG 2
AAAAh
AAAAh
AAAAh
TAG n
All UCODE 7xm/7xm+ tags receive the Command
aaa-017990
Fig 8.
Illustration of Parallel encoding for 16-bit Write command
Use cases and benefits
Parallel encoding feature of UCODE 7xm/7xm+ can enable ultra fast bulk encoding.
Taking in addition advantage of the pre-serialization scheme of UCODE 7xm/7xm+, the
same SKU can be encoded in multiple tags as the EPC will be delivered pre-serialized
already.
In the case of only one tag answering (like in printer encoding), this feature could be used
to save some overhead in commands to do direct EPC encoding after the handle reply.
Since this is a custom specific feature of UCODE 7xm/7xm+ (taken over from our
previous UHF tag IC UCODE 7/7m) the use of this features requires the same support on
the reader side as for previous UCODE products.
SL3S1004_1014
Product data sheet
COMPANY PUBLIC
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UCODE 7xm and UCODE 7xm+
9.7.5 Tag Power Indicator
Description
Upon a SELECT command on the “Tag Power Indicator”, located in the config word 204h,
an internal power check on the chip is performed to see if the power level is sufficient to
perform a WRITE command. The decision level is defined as nominal WRITE sensitivity
minus 1dB. In the case there is enough power, the SELECT command is matching and
non-matching if not enough power. The tag can then be singulated by the standard
inventory procedure.
Use cases and benefits
This feature gives the possibility to select only the tag(s) that receive enough power to be
written during e.g. printer encoding in a dense environment of tags even though the
reader may read more than one tag (see Figure 9 for illustration). The power level still
needs to be adjusted to transmit enough writing power to one tag only to do one tag
singulation.
Power level for READ/WRITE
too low/too low
OK/too low
OK/too low
OK/OK
Only this tag will select itself
OK/too low
OK/too low
too low/too low
Fig 9.
SL3S1004_1014
Product data sheet
COMPANY PUBLIC
aaa-005662
Selection of tags with Tag Power Indicator feature
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UCODE 7xm and UCODE 7xm+
9.7.6 Product Status Flag (PSF)
Description
The PSF is a general purpose bit located in the Configuration word at address 20Fh with a
value that can be freely changed.
Use cases and benefits
The PSF bit can be used as an EAS (Electronic Article Surveillance) flag, quality checked
flag or similar.
In order to detect the tag with the PSF activated, a EPC SELECT command selecting the
PSF flag of the Configuration word can be used. In the following inventory round only PSF
enabled chips will reply their EPC number.
9.7.7 Single-slit antenna solution
Description
In UCODE 7xm/7xm+ the test pads TP1 and TP2 are electrically disconnected meaning
they are not electrically active and can be safely short-circuited to the RF pads RF1 and
RF2 (see Figure 10).
Standard assembly
Single-slit assembly
Supporting pads
aaa-005857
Fig 10. Standard antenna design versus single-slit antenna
Uses cases and benefits
Using single-slit antenna enables easier assembly and antenna design. Inlay
manufacturer will only have to take care about one slit of the antenna instead of two in
case all pads need to be disconnected from each other.
Additionally single-slit antenna assembly and the related increased input capacitance (see
Table 16) can be used advantageously over the standard antenna design as additional
room for optimization to different antenna design.
SL3S1004_1014
Product data sheet
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UCODE 7xm and UCODE 7xm+
10. Limiting values
Table 15. Limiting values[1][2]
In accordance with the Absolute Maximum Rating System (IEC 60134).
Voltages are referenced to RFN
Symbol
Parameter
Conditions
Min
Max
Unit
55
+125
C
40
+85
C
-
2
kV
-
100
mW
Bare die limitations
Tstg
storage temperature
Tamb
ambient temperature
VESD
electrostatic discharge
voltage
Human body model
[3]
Pad limitations
Pi
SL3S1004_1014
Product data sheet
COMPANY PUBLIC
input power
maximum power
dissipation, RFP pad
[1]
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at these or any conditions other
than those described in the Operating Conditions and Electrical Characteristics section of this specification
is not implied.
[2]
This product includes circuitry specifically designed for the protection of its internal devices from the
damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be
taken to avoid applying greater than the rated maxima.
[3]
For ESD measurement, the die chip has been mounted into a CDIP20 package.
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UCODE 7xm and UCODE 7xm+
11. Characteristics
11.1 UCODE 7xm/7xm+ bare die characteristics
Table 16.
UCODE 7xm/7xm+ RF interface characteristics (RF1, RF2)
Symbol
Parameter
fi
input frequency
Conditions
Min
Typ
Max
Unit
840
-
960
MHz
Pi(min)
minimum input power
READ sensitivity
[1][3][8]
-
18.5
-
dBm
Pi(min)
minimum input power
WRITE sensitivity
[2]
-
12
-
dBm
-
7
-
dBm
Pi(min)
minimum input power
Reduced operating
range
[2]
t
encoding speed (16b-bit or 32-bit)
16-bit
[5]
-
1.5
-
ms
Ci
chip input capacitance
parallel
[3][4]
-
0.63
-
pF
Z
chip impedance
866 MHz
[3][4]
-
19-j284
-

915 MHz
[3][4]
-
17-j274
-

953 MHz
[3][4]
-
17-j265
-

915 MHz
[6]
-
26-j235
[6][7]
-
16-j181
-

[2]
-
11
-
dBm
[9]
Z
typical assembled impedance
Z
typical assembled impedance [9] in 915 MHz
case of single-slit antenna assembly

Tag Power Indicator mode
Pi(min)
[1]
minimum input power level to be
able to select the tag
Power to process a QUERY command
[2]
Tag sensitivity on a 2dBi gain antenna
[3]
Measured with a 50  source impedance directly on the chip
[4]
At minimum operating power
[5]
When the memory content is “0000...”.
[6]
The antenna shall be matched to this impedance
[7]
Depending on the specific assembly process, sensitivity losses of few tenths of dB might occur
[8]
Results in approximately -19dBm tag sensitivity with a 2dBi gain antenna
[9]
Assuming a 80fF additional input capacitance, 250fF in case of single slit antenna
Table 17.
Symbol
UCODE 7xm/7xm+ memory characteristics
Parameter
Conditions
Min
Typ
Max
Unit
Tamb 55 C
20
-
-
year
100k
-
-
cycle
EEPROM characteristics
SL3S1004_1014
Product data sheet
COMPANY PUBLIC
tret
retention time
Nendu(W)
write endurance
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UCODE 7xm and UCODE 7xm+
12. Package outline
This section is not applicable for this kind of device.
13. Packing information
13.1 Wafer
See Ref. 4 “Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BU-ID document number: 1093**”
14. Abbreviations
Table 18.
SL3S1004_1014
Product data sheet
COMPANY PUBLIC
Abbreviations
Acronym
Description
CRC
Cyclic Redundancy Check
CW
Continuous Wave
DSB-ASK
Double Side Band-Amplitude Shift Keying
DC
Direct Current
EAS
Electronic Article Surveillance
EEPROM
Electrically Erasable Programmable Read Only Memory
EPC
Electronic Product Code (containing Header, Domain Manager, Object Class
and Serial Number)
FM0
Bi phase space modulation
G2
Generation 2
IC
Integrated Circuit
PIE
Pulse Interval Encoding
PSF
Product Status Flag
RF
Radio Frequency
UHF
Ultra High Frequency
SECS
Semi Equipment Communication Standard
TID
Tag IDentifier
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UCODE 7xm and UCODE 7xm+
15. References
1.
[1]
GS1 EPCglobal: EPC™ Radio-Frequency Identity Protocols Class-1 Generation-2
UHF RFID Protocol for Communications at 860 MHz – 960 MHz, Version 1.2.0 (23
October 2008)
[2]
EPCglobal: EPC Tag Data Standard Version 1.9, ratified Nov-2014
[3]
RTCal is the Interrogator-to-Tag calibration symbol length defined in the EPCglobal
specification
[4]
Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BU-ID document number: 1093**1
[5]
Release Note - Formulas for Multi-Vendor Chip-Based Serialization (MCS) and
FastEPC, BU-ID document number: 2498**
** ... document version number
SL3S1004_1014
Product data sheet
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SL3S1004_1014
NXP Semiconductors
UCODE 7xm and UCODE 7xm+
16. Revision history
Table 19.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
SL3S1004_1014 v.3.1
20150727
Product data sheet
-
SL3S1004_1014 v.3.0
-
SL3S1004_1014 v.1.0
Modifications:
SL3S1004_1014 v.3.0
Modifications:
SL3S1004_1014 v.1.0
SL3S1004_1014
Product data sheet
COMPANY PUBLIC
•
Update UCODE 7xm+ Public Key
20150615
•
•
•
•
Product data sheet
Update Write sensitivity
Digital Signature explanation and source code added
Update of final feature set
Editorial changes
20150416
Objective data sheet
-
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 27 July 2015
325031
-
© NXP Semiconductors N.V. 2015. All rights reserved.
32 of 35
SL3S1004_1014
NXP Semiconductors
UCODE 7xm and UCODE 7xm+
17. Legal information
17.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
17.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
17.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
SL3S1004_1014
Product data sheet
COMPANY PUBLIC
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 27 July 2015
325031
© NXP Semiconductors N.V. 2015. All rights reserved.
33 of 35
SL3S1004_1014
NXP Semiconductors
UCODE 7xm and UCODE 7xm+
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
UCODE — is a trademark of NXP Semiconductors N.V.
18. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
SL3S1004_1014
Product data sheet
COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 27 July 2015
325031
© NXP Semiconductors N.V. 2015. All rights reserved.
34 of 35
SL3S1004_1014
NXP Semiconductors
UCODE 7xm and UCODE 7xm+
19. Contents
1
2
2.1
2.1.1
2.2
2.2.1
2.2.2
2.2.3
2.3
3
3.1
3.2
4
5
6
6.1
7
7.1
8
8.1
8.1.1
8.1.2
8.1.3
9
9.1
9.2
9.3
9.3.1
9.3.2
9.4
9.5
9.5.1
9.5.1.1
9.5.1.2
9.6
9.6.1
9.6.2
9.7
9.7.1
9.7.2
9.7.3
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Key features . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Key benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
End user benefit . . . . . . . . . . . . . . . . . . . . . . . . 2
Antenna design benefits . . . . . . . . . . . . . . . . . . 2
Label/module manufacturer benefit . . . . . . . . . 2
Supported features . . . . . . . . . . . . . . . . . . . . . . 2
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Markets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
Wafer layout . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Wafer layout . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Mechanical specification . . . . . . . . . . . . . . . . . 7
Wafer specification . . . . . . . . . . . . . . . . . . . . . . 7
Wafer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Fail die identification . . . . . . . . . . . . . . . . . . . . 8
Map file distribution. . . . . . . . . . . . . . . . . . . . . . 8
Functional description . . . . . . . . . . . . . . . . . . . 9
Air interface standards . . . . . . . . . . . . . . . . . . . 9
Power transfer . . . . . . . . . . . . . . . . . . . . . . . . . 9
Data transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Interrogator to tag Link . . . . . . . . . . . . . . . . . . . 9
Tag to interrogator Link . . . . . . . . . . . . . . . . . . . 9
UCODE 7xm and UCODE 7xm+ Overview . . 10
Supported commands . . . . . . . . . . . . . . . . . . 10
Custom commands. . . . . . . . . . . . . . . . . . . . . 11
Untraceable . . . . . . . . . . . . . . . . . . . . . . . . . . 11
ReadSignature (UCODE 7xm+ only) . . . . . . . 12
Digital Signature . . . . . . . . . . . . . . . . . . . . . . . .12
UCODE 7xm/7xm+ memory . . . . . . . . . . . . . . 15
UCODE 7xm/7xm+ overall memory map . . . . 16
UCODE 7xm/7xm+ TID memory details . . . . . 18
Supported features . . . . . . . . . . . . . . . . . . . . . 19
UCODE 7xm/7xm+ features control
mechanism . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Backscatter strength reduction . . . . . . . . . . . . 20
Automatic self pre-serialization of the 96-bit
EPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
Use cases and benefits . . . . . . . . . . . . . . . . . .23
9.7.4
9.7.5
9.7.6
9.7.7
10
11
11.1
12
13
13.1
14
15
16
17
17.1
17.2
17.3
17.4
18
19
Parallel encoding . . . . . . . . . . . . . . . . . . . . . . 23
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Use cases and benefits . . . . . . . . . . . . . . . . . . 25
Tag Power Indicator . . . . . . . . . . . . . . . . . . . . 26
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Use cases and benefits . . . . . . . . . . . . . . . . . . 26
Product Status Flag (PSF) . . . . . . . . . . . . . . 27
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Use cases and benefits . . . . . . . . . . . . . . . . . . 27
Single-slit antenna solution . . . . . . . . . . . . . . 27
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Uses cases and benefits . . . . . . . . . . . . . . . . . 27
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 28
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 29
UCODE 7xm/7xm+ bare die characteristics . 29
Package outline. . . . . . . . . . . . . . . . . . . . . . . . 30
Packing information . . . . . . . . . . . . . . . . . . . . 30
Wafer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 30
References. . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Revision history . . . . . . . . . . . . . . . . . . . . . . . 32
Legal information . . . . . . . . . . . . . . . . . . . . . . 33
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 33
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Contact information . . . . . . . . . . . . . . . . . . . . 34
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2015.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 27 July 2015
325031
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