AN5234: MPC5743R Single Core Initialization - Application notes

NXP Semiconductors
Application Note
Document Number: AN5234
Rev. 2, May 2016
MPC5743R Single Core
Initialization
by:
Randy Dees and Shanaka Yapa
Contents
1 Introduction
The MPC574xR family of microcontrollers are based on the
Power Architecture® cores and the enhanced Time Processing
Unit (eTPU). They are primarily intended for Automotive
Powertrain applications. They can be used in other types of
applications, including motor control. Some of the devices in
the MPC574xR family include dual independent cores. The
dual-core capability, however, is a single core plus a second
core, that for safety applications, includes a delayed lock-step
core. From an overall device standpoint, there are three cores
instantiated in the MCU. The delayed lock-step core executes
the same instructions to support safety critical applications.
The delay reduces the simultaneous switching currents of the
cores by having the cores execute with a delay.
The MPC5743R is a single core version of the MPC574xR.
The single-core device includes the safety core with the
delayed lock-step core. All of the current MPC574xR family
of devices implement all of the cores, however, on the single
core device, the second core must only be used for the initial
boot operation of the device and should be disabled in the
Boot Header Configuration word. It should not be used by
user application code.
This application note describes the proper initialization of the
single core (with delayed lock-step core) MPC5743R device.
1
Introduction................................................................1
2
MPC574xR family device differences.... .................. 2
3
2.1
MPC574xR flash definition............................2
2.2
MPC574xR SRAM definition... .....................6
2.3
MPC574xR cores................... ........................ 8
Start-up operation............................ ..........................8
3.1
Boot header......................... ........................... 9
4
Green Hills example linker file............ ...................10
5
Example memory usage.................. ........................ 12
6
Revision history.......................... ............................ 14
MPC574xR family device differences
2 MPC574xR family device differences
A summary of the primary differences between the different devices in the MPC574xR family is shown in the following
table. (Only the differences are shown in this table. Features that are the same are not listed, see the MPC5746R Reference
Manual for the complete features.)
Table 1. MPC574xR family of devices
Feature
MPC5746R
Main core
Locked Step Core
Flash memory
MPC5745R
MPC5743R
21
21
11
1
1
1
Total
4256 KB + 16 KB2
3232 KB + 16 KB2
2208 KB + 16 KB2
Code Flash
3984 KB
2960 KB
1936 KB
BAF
16 KB
16 KB
16 KB
Data flash
256 KB
256 KB
256 KB
256 KB
192 KB
128 KB
System RAM
MHz3
Core frequency
200 MHz
150
LINFlex
4+2MSB support
4+2MSB support
3+2MSB support4
DSPI
5+2MSB support
5+2MSB support5
4+2MSB support6
LQFP144
—
—
•
LQFP176
—
•
•
MAPBGA252
•
•
—
—
—
Package
MAPBGA292 Emulation •
Device
1.
2.
3.
4.
5.
6.
200 MHz
Core0 + Locked step core will be supported. Core 1 will be used for Boot Assist Flash (BAF) execution at start-up only.
User test flash (UTEST)
252 BGA package supports 200 MHz operation.
LINFlex 3 is not supported.
DSPI 4 is not supported on the 176 LQFP device.
DSPI 4 is not supported. In addition, DSPI M1 is not supported on the 144 LQFP device.
2.1 MPC574xR flash definition
The different devices in the MPC574xR family implement different flash memory sizes.
A summary of the flash size allocation is shown in the following table.
Table 2. Flash usage allocation
Description
One-time Programmable
(OTP)1
MPC5746R
MPC5745R
MPC5743R
32 KB
32 KB
32 KB
Data Flash (for EEPROM emulation)
256 KB
256 KB
256 KB
Code Flash
3984 KB
2960 KB
1936 KB
MPC5743R Single Core Initialization, Rev. 2, May 2016
2
NXP Semiconductors
MPC574xR family device differences
1. The 16 KB of the OTP area is reserved for the Boot Assist Flash (BAF) and 16 KB for device specific definitions and
Device Configuration Format (DCF) records (User Test/UTEST).
The table below shows the implemented flash blocks for each of the defined devices, as well as the partition number (for
read/while write restrictions1 ).
MPC5745R 2960 KB + 256 KB + 32 KB
MPC5743R 1936 KB + 256 KB + 32 KB
0x0040_0000
0x0040_3FFF
16
UTEST NVM Block Space
16KB
Partition 0
16k
•
•
•
0x0040_4000
0x0040_7FFF
16
16KB BAF block0
Partition 0 - Low
16k
•
•
•
0x0040_8000
0x005F_FFFF
2016
Reserved flash
—
—
512
Reserved flash
—
—
1536
Reserved flash
—
—
Start Address
End Address
Allocated Size [KB]
MPC5746R 3984 KB + 256 KB + 32 KB
Table 3. Flash memory definition
Description
RWW Partition
Block size
Reserved - no overlay
0x0000_0000
0x003F_FFFF
4096
Reserved flash
—
—
UTEST NVM Block - no overlay
Reserved - no overlay
0x0060_0000
0x0067_FFFF
Reserved - no overlay
0x0068_0000
0x007F_FFFF
Data Flash - no overlay
0x0080_0000
0x0080_3FFF
16
FMC EEPROM Block0
Partition 2 - Mid
16k
•
•
•
0x0080_4000
0x0080_7FFF
16
FMC EEPROM Block1
Partition 2 - Mid
16k
•
•
•
0x0080_8000
0x0080_BFFF
16
FMC EEPROM Block2
Partition 2 - Mid
16k
•
•
•
0x0080_C000
0x0080_FFFF
16
FMC EEPROM Block3
Partition 2 - Mid
16k
•
•
•
0x0081_0000
0x0081_3FFF
16
FMC EEPROM Block4
Partition 3 - Mid
16k
•
•
•
0x0081_4000
0x0081_7FFF
16
FMC EEPROM Block5
Partition 3 - Mid
16k
•
•
•
0x0081_8000
0x0081_BFFF
16
FMC EEPROM Block6
Partition 3 - Mid
16k
•
•
•
0x0081_C000
0x0081_FFFF
16
FMC EEPROM Block7
Partition 3 - Mid
16k
•
•
•
0x0082_0000
0x0082_FFFF
64
FMC EEPROM Block0
Partition 2 - Mid
64k
•
•
•
0x0083_0000
0x0083_FFFF
64
FMC EEPROM Block1
Partition 3 - Mid
64k
•
•
•
Table continues on the next page...
1.
See the device reference manual for more information about the flash restrictions for reading while programming the flash.
MPC5743R Single Core Initialization, Rev. 2, May 2016
NXP Semiconductors
3
MPC574xR family device differences
MPC5745R 2960 KB + 256 KB + 32 KB
MPC5743R 1936 KB + 256 KB + 32 KB
0x00A0_0000
0x00F9_BFFF
5744
Reserved flash
—
—
0x00F9_C000
0x00F9_FFFF
16
16KB Code Flash block5
Partition 1 - Low
16k
•
•
•
0x00FA_0000
0x00FA_3FFF
16
16KB Code Flash block1
Partition 0 - Low
16k
•
•
•
0x00FA_4000
0x00FA_7FFF
16
16KB Code Flash block2
Partition 0 - Low
16k
•
•
•
0x00FA_8000
0x00FA_BFFF
16
16KB Code Flash block3
Partition 1 - Low
16k
•
•
•
0x00FA_C000
0x00FA_FFFF
16
16KB Code Flash block4
Partition 1 - Low
16k
•
•
•
0x00FB_0000
0x00FB_7FFF
32
32KB Code Flash block0
Partition 0 - Low
32k
•
•
•
0x00FB_8000
0x00FB_FFFF
32
32KB Code Flash block1
Partition 1 - Low
32k
•
•
•
0x00FC_0000
0x00FC_FFFF
64
64KB Code Flash block0
Partition 0 - Low
64k
•
•
•
0x00FD_0000
0x00FD_FFFF
64
64KB Code Flash block1
Partition 0 - Low
64k
•
•
•
0x00FE_0000
0x00FE_FFFF
64
64KB Code Flash block2
Partition 1 - Low
64k
•
•
•
0x00FF_0000
0x00FF_FFFF
64
64KB Code Flash block3
Partition 1 - Low
64k
•
•
•
Start Address
0x0084_0000
End Address
0x009F_FFFF
Allocated Size [KB]
MPC5746R 3984 KB + 256 KB + 32 KB
Table 3. Flash memory definition (continued)
Description
RWW Partition
Block size
1792
Reserved flash
—
—
Low & Mid Flash Blocks - no overlay
Large Flash Blocks - no overlay
0x0100_0000
0x0103_FFFF
256
256KB Code Flash block0
Partition 6 - 256K 256k
•
•
•
0x0104_0000
0x0107_FFFF
256
256KB Code Flash block1
Partition 6 - 256K 256k
•
•
•
0x0108_0000
0x010B_FFFF
256
256KB Code Flash block2
Partition 6 - 256K 256k
•
•
•
0x010C_0000
0x010F_FFFF
256
256KB Code Flash block3
Partition 7 - 256K 256k
•
•
•
0x0110_0000
0x0113_FFFF
256
256KB Code Flash block4
Partition 7 - 256K 256k
•
•
•
0x0114_0000
0x0117_FFFF
256
256KB Code Flash block5
Partition 7 - 256K 256k
•
•
•
0x0118_0000
0x011B_FFFF
256
256KB Code Flash block6
Partition 6 - 256K 256k
•
•
0x011C_0000
0x011F_FFFF
256
256KB Code Flash block7
Partition 6 - 256K 256k
•
•
0x0120_0000
0x0123_FFFF
256
256KB Code Flash block8
Partition 6 - 256K 256k
•
•
0x0124_0000
0x0127_FFFF
256
256KB Code Flash block9
Partition 6 - 256K 256k
•
•
0x0128_0000
0x012B_FFFF
256
256KB Code Flash block10
Partition 7 - 256K 256k
•
0x012C_0000
0x012F_FFFF
256
256KB Code Flash block11
Partition 7 - 256K 256k
•
0x0130_0000
0x0133_FFFF
256
256KB Code Flash block12
Partition 7 - 256K 256k
•
Table continues on the next page...
MPC5743R Single Core Initialization, Rev. 2, May 2016
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NXP Semiconductors
MPC574xR family device differences
MPC5745R 2960 KB + 256 KB + 32 KB
MPC5743R 1936 KB + 256 KB + 32 KB
0x08F9_BFFF
5744
Reserved flash
—
—
0x08F9_C000
0x08F9_FFFF
16
Mirror 16 KB Code Flash
block5
Partition 1 - Low
16k
•
•
•
0x08FA_0000
0x08FA_3FFF
16
Mirror 16 KB Code Flash
block1
Partition 0 - Low
16k
•
•
•
0x08FA_4000
0x08FA_7FFF
16
Mirror 16 KB Code Flash
block2
Partition 0 - Low
16k
•
•
•
0x08FA_8000
0x08FA_BFFF
16
Mirror 16 KB Code Flash
block3
Partition 1 - Low
16k
•
•
•
0x08FA_C000
0x08FA_FFFF
16
Mirror 16 KB Code Flash
block4
Partition 1 - Low
16k
•
•
•
0x08FB_0000
0x08FB_7FFF
32
Mirror 32 KB Code Flash
block0
Partition 0 - Low
32k
•
•
•
0x08FB_8000
0x08FB_FFFF
32
Mirror 32 KB Code Flash
block1
Partition 1 - Low
32k
•
•
•
0x08FC_0000
0x08FC_FFFF
64
Mirror 64 KB Code Flash
block0
Partition 0 - Low
64k
•
•
•
0x08FD_0000
0x08FD_FFFF
64
Mirror 64 KB Code Flash
block1
Partition 0 - Low
64k
•
•
•
0x08FE_0000
0x08FE_FFFF
64
Mirror 64 KB Code Flash
block2
Partition 1 - Low
64k
•
•
•
0x08FF_0000
0x08FF_FFFF
64
Mirror 64 KB Code Flash
block3
Partition 1 - Low
64k
•
•
•
End Address
Allocated Size [KB]
0x08A0_0000
Start Address
Description
RWW Partition
Block size
0x0134_0000
0x0137_FFFF
256
256KB Code Flash block13
Partition 7 - 256K 256k
0x0138_0000
0x01FF_FFFF
12800
Reserved flash
—
—
98304
Reserved flash
—
—
10240
Reserved flash
—
—
MPC5746R 3984 KB + 256 KB + 32 KB
Table 3. Flash memory definition (continued)
•
Reserved - no overlay
0x0200_0000
0x07FF_FFFF
Mirror Reserved Flash
0x0800_0000
0x089F_FFFF
Mirror Low & Mid flash blocks
Mirror large flash blocks
Table continues on the next page...
MPC5743R Single Core Initialization, Rev. 2, May 2016
NXP Semiconductors
5
MPC574xR family device differences
MPC5745R 2960 KB + 256 KB + 32 KB
MPC5743R 1936 KB + 256 KB + 32 KB
0x0900_0000
0x0903_FFFF
256
Mirror 256 KB Code Flash
block0
Partition 6 - 256K 256k
•
•
•
0x0904_0000
0x0907_FFFF
256
Mirror 256 KB Code Flash
block1
Partition 6 - 256K 256k
•
•
•
0x0908_0000
0x090B_FFFF
256
Mirror 256 KB Code Flash
block2
Partition 6 - 256K 256k
•
•
•
0x090C_0000
0x090F_FFFF
256
Mirror 256 KB Code Flash
block3
Partition 7 - 256K 256k
•
•
•
0x0910_0000
0x0913_FFFF
256
Mirror 256 KB Code Flash
block4
Partition 7 - 256K 256k
•
•
•
0x0914_0000
0x0917_FFFF
256
Mirror 256 KB Code Flash
block5
Partition 7 - 256K 256k
•
•
•
0x0918_0000
0x091B_FFFF
256
Mirror 256 KB Code Flash
block6
Partition 6 - 256K 256k
•
•
0x091C_0000
0x091F_FFFF
256
Mirror 256 KB Code Flash
block7
Partition 6 - 256K 256k
•
•
0x0920_0000
0x0923_FFFF
256
Mirror 256 KB Code Flash
block8
Partition 6 - 256K 256k
•
•
0x09240_000
0x0927_FFFF
256
Mirror 256 KB Code Flash
block9
Partition 6 - 256K 256k
•
•
0x0928_0000
0x092B_FFFF
256
Mirror 256 KB Code Flash
block10
Partition 7 - 256K 256k
•
0x092C_0000
0x092F_FFFF
256
Mirror 256 KB Code Flash
block11
Partition 7 - 256K 256k
•
0x0930_0000
0x0933_FFFF
256
Mirror 256 KB Code Flash
block12
Partition 7 - 256K 256k
•
0x0934_0000
0x0937_FFFF
256
Mirror 256 KB Code Flash
block13
Partition 7 - 256K 256k
•
0x0938_0000
0x0BFF_FFFF
49152
Mirror reserved space
—
Start Address
End Address
Allocated Size [KB]
MPC5746R 3984 KB + 256 KB + 32 KB
Table 3. Flash memory definition (continued)
Description
RWW Partition
Block size
—
MPC5743R Single Core Initialization, Rev. 2, May 2016
6
NXP Semiconductors
MPC574xR family device differences
2.2 MPC574xR SRAM definition
The different devices in the MPC574xR family implement different SRAM memory sizes. The table below shows the
implemented SRAM allocation for each of the defined devices.
• System RAM - The System RAM (SRAM) is intended for use for data storage and can be accessed by any core or by
Direct Memory Access (DMA).
• Local Instruction Memory - A local Instruction SRAM (I-MEM) is available for each core. It allows fast access (one
clock) to instructions. Code must be copied from flash into the I-MEM via program control.
• Local Data Memory - A local Data SRAM (D-MEM) is available for each core. It is commonly used for the processor
stack and for critical variables that are primarily used by a single core. The access time is 1 clock for reads. Any other
core also has access to the D-MEM, however, the access time is longer.
The CPU1 (Core 1) local memory should not be accessed by devices that are defined with a single core (MPC5743R).
NOTE
All SRAM must be initialized prior to use to set the Error Correction Code (ECC) for
each SRAM location. The SRAM is initialized by writing a 64-bit double word to each
location of the SRAM. Once initialized, writes to the SRAMs can be byte (8-bit), halfword (16-bit), word (32-bit), or double-word (64-bit).
End Address
Allocated Description
Size [KB]
Actual
size
MPC5746R 256 KB + 96 KB
MPC5745R 192 KB + 96 KB
MPC5743R 128 KB + 48 KB
Table 4. SRAM memory definition
Start Address
0x4000_0000
0x4000_7FFF
32
System Standby RAM
32 KB
•
•
•
0x4000_8000
0x4001_FFFF
96
System RAM
96 KB
•
•
•
0x4002_0000
0x4002_FFFF
64
System RAM
64 KB
•
•
0x4003_0000
0x4003_FFFF
64
System RAM
64 KB
•
0x4004_0000
0x4FFF_FFFF
261888
Reserved
—
0x5000_0000
0x5000_3FFF
64
I-MEM CPU0
16 KB
0x5000_4000
0x5000_FFFF
Allocated for I-MEM CPU0
[48 KB]
0x5001_0000
0x507F_FFFF
8128
Reserved I-MEM CPU0
—
0x5080_0000
0x5080_7FFF
64
D-MEM CPU0
32 KB
0x5080_8000
0x5080_FFFF
Allocated D-MEM CPU0
[32 KB]
0x5081_0000
0x50FF_FFFF
8128
Reserved D-MEM CPU0
—
0x5100_0000
0x5100_3FFF
64
I-MEM CPU1
16 KB
0x5100_4000
0x5100_FFFF
Allocated for I-MEM CPU1
[48K]
0x5101_0000
0x517F_FFFF
8128
Reserved I-MEM CPU1
—
0x5180_0000
0x5180_7FFF
64
D-MEM CPU1
32 KB
System RAM
Local Memory
•
•
•
•
•
•
•
•
•
•
Table continues on the next page...
MPC5743R Single Core Initialization, Rev. 2, May 2016
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7
Start-up operation
Table 4. SRAM memory definition (continued)
0x5180_8000
0x5180_FFFF
0x5181_0000
0x51FF_FFFF
8128
Allocated D-MEM CPU1
[32 KB]
Reserved D-MEM CPU1
—
2.3 MPC574xR cores
The MPC574xR family of devices include either 1 or 2 main processing cores, On the two (2) core devices, both cores are
e200z425 cores that can operate at up to 200 MHz. In addition, one of the two cores includes an e200z424 core, as a third
core2. This core runs in a delayed lockstep mode (if enabled). The following table shows the cores that are available for use
for the different devices in this family.
Table 5. Cores available in the MPC574xR devices
Device
Number of cores
Core 0
Core C (Lock-step
core)
Core 1
MPC5746R
2 (31)
e200z425
e200z424
e200z425
MPC5745R
2
(31)
e200z425
e200z424
e200z425
1
(21)
e200z425
e200z424
e200z425
MPC5743R
1. Counting the lock-step core.
3 Start-up operation
The MPC5743R (single core versions of the MPC574xR family) boots from Core 1. However, this core is not available for
use after the boot sequence is completed.
When exiting reset, Core 1 begins executing code from the Boot Assist Flash (BAF). The BAF code searches the internal
flash for a valid boot header. The addresses of the boot header search locations are shown in the following table.
Table 6. MPC574xR boot flash addresses
Search order
Block
Address
1
16KB Code Flash block 0
0x00F9_C000
2
16KB Code Flash block 1
0x00FA_0000
3
16KB Code Flash block 2
0x00FA_4000
4
16KB Code Flash block 3
0x00FA_8000
5
16KB Code Flash block 4
0x00FA_C000
6
256KB Code Flash block 0
0x0100_0000
7
256KB Code Flash block 1
0x0104_0000
8
256KB Code Flash block 2
0x0108_0000
Table continues on the next page...
2.
This core shares instruction cache, local memory interface, and bus interfaces as core 0. This core cannot be used as a
standalone core.
MPC5743R Single Core Initialization, Rev. 2, May 2016
8
NXP Semiconductors
Start-up operation
Table 6. MPC574xR boot flash addresses (continued)
Search order
Block
9
Address
256KB Code Flash block 3
0x010C_0000
If a valid boot header is found, the BAF code determines which cores should be enabled by the BAF code and determines the
start location of the user code. In the case of the MPC5743, the boot header should only enable core 0. The MPC5746R and
the MPC5745R can have either or both of the cores enabled by the BAF.
3.1 Boot header
The boot header locations are read by the BAF to determine if the flash block is a valid boot location. The BAF checks for a
value of 0x005A in the first half-word (16-bits) of the flash block. If the reset configuration half-word (RCHW) is valid,
additional information is loaded by the BAF from the flash.
Table 7. Boot header structure
Address offset
Contents
0x00
Boot header configuration
0x04
Reserved
0x08
Reserved
0x10
Core 0 Reset vector
0x14
Core 1 Reset vector
0x18
Checker CPU0 Reset vector
The boot header field is used to not only determine whether the flash block is valid for booting, but also for selecting which
core will be enabled following the BAF execution.. The configuration is shown in the following tables.
Table 8. Boot header configuration
Address offset 0x0
0
1
2
3
0x0
16
4
5
6
7
0x0
17
18
0x0
19
20
8
9
10
11
0x5
21
0x0
22
23
24
12
13
14
15
28
29
30
31
Core 1
Core C
Core 0
0b0
0xA
25
26
27
0x0
Table 9. Boot header bit definitions
Bits
Field Name
Description
0:7
Reserved
These bits should be programmed to 0.
8:15
Boot Identifier
The Boot Identifier field serves two functions:
• Indicates which block in flash memory contains the boot program
• Indicates if the flash memory is programmed (BOOTID = 0x5A) or invalid
16:27
Reserved
These bits should be programmed to 0.
Table continues on the next page...
MPC5743R Single Core Initialization, Rev. 2, May 2016
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9
Green Hills example linker file
Table 9. Boot header bit definitions (continued)
Bits
Field Name
Description
28
CPU1
CPU1 is enabled (will start execution at CPU1 Reset Vector)1
29
CPUC
CPU_SC is enabled (will start execution at CPU_SC Reset Vector, must be the
same as CPU0 Reset Vector)2
30
CPU0
CPU0 is enabled (will start execution at CPU0 Reset Vector)
31
Reserved
This bits should be programmed to 0.
1. For the MPC5743R, this bit must be programmed to a 0b0.
2. CPUC is the lock-step "checker" core. It can be disabled for a slight improvement in operating current.
For the MPC5743R, Core 1 should always be set to 0b0 (disabled). Therefore, for these devices, the recommended setting of
the boot header configuration location is 0x005A_0006. This configuration enables Core 0 along with the Core 0 Checker
core (CORE C).
After the BAF determines which cores to enable (following BAF execution), the Core reset vector is read for the start
location for each core that is enabled for execution. The start location and initial run mode (DRUN) are loaded into the Mode
Entry Module Core Control register (MC_ME_CCTLn[DRUN] and the core address (reset vector) register
(MC_ME_CADDRn.
4 Green Hills example linker file
Below is an example of a typical linker file for the MPC5743R and MPC5744R for the Green Hills Multi-compiler.
/*---------- MODIFY THIS SECTION FOR THE ACTUAL DEVICE AND PROJECT -----------*/
DEFAULTS {
// Define Boot Header area Size
BOOTFLASH_SIZE = 0x20 // The first 32 bytes of a flash block are used for the flash
header.
// Define Boot Header area Base Address
BOOTFLASH_BASE_ADDR = 0x01000000
// Define Core 0 Flash Allocation with Large Flash Block
FLASH_SIZE = 1536K - BOOTFLASH_SIZE
// Define Core 0 Flash Base Address
FLASH_BASE_ADDR = BOOTFLASH_BASE_ADDR + BOOTFLASH_SIZE
// Define Standby RAM Allocation
C0_STBYRAM_SIZE = 32K
// Define Standby RAM Address
C0_STBYRAM_BASE_ADDR = 0x40000000
// Define Core 0 SRAM Allocation for MPC5743R
C0_SRAM_SIZE = 96K
// Define Processor 0 SRAM Base Address
C0_SRAM_BASE_ADDR = 0x40008000
// Define Core 0 IMEM
C0_IMEM_SIZE = 16K
// Define Processor 0 IMEM Base Address
C0_IMEM_BASE_ADDR = 0x50000000
// Define Core 0 DMEM
C0_DMEM_SIZE = 32K
// Define Processor 0 DMEM Base Address
C0_DMEM_BASE_ADDR = 0x50800000
// Stack located at end of DMEM
MPC5743R Single Core Initialization, Rev. 2, May 2016
10
NXP Semiconductors
Green Hills example linker file
// Define Stack Size
STACK_SIZE = 4K
}
/*---------- DO
MEMORY {
bootflash :
int_flash :
int_stbyram
int_sram :
int_imem :
int_dmem :
stack_ram :
}
SECTIONS
{
.bh
.init
.text
.vletext
*/
.fixaddr
.fixtype
.secinfo
.syscall
.rodata
NOT MODIFY ANYTHING BELOW THIS POINT -------*/
org = BOOTFLASH_BASE_ADDR, len = BOOTFLASH_SIZE
org = FLASH_BASE_ADDR,
len = FLASH_SIZE
: org = C0_STBYRAM_BASE_ADDR,
len = C0_STBYRAM_SIZE
org = C0_SRAM_BASE_ADDR,
len = C0_SRAM_SIZE
org = C0_IMEM_BASE_ADDR,
len = C0_IMEM_SIZE
org = C0_DMEM_BASE_ADDR,
len = C0_DMEM_SIZE-STACK_SIZE
org = (C0_DMEM_BASE_ADDR+C0_DMEM_SIZE-STACK_SIZE) len = STACK_SIZE
:
:
:
:
{}
{}
{}
{}
> bootflash
> int_flash
> .
> .
/* BookE Code
/* VLE Code
:
:
:
:
{}
{}
{}
{}
>
>
>
>
/*
/*
/*
/*
.
.
.
.
: {*(.rdata) *(.rodata)} > .
.ROM.data
ROM(.data)
.ROM.sdata ROM(.sdata)
.xptn_vectors ALIGN(0x100)
boundary */
.isrvectbl
ALIGN(0x1000)
: {} > .
: {} > .
: {} > .
*/
*/
*/
*/
/* Store Initialised RAM Variables */
/* temporarily in Flash
*/
/* Exception Vector Table (IVPR) - align 256 byte
/* ISR Vector Table - must be 4K aligned */
//
.IVOR4_HWvectors ALIGN(0x1000): {} > .
boundary */
.heap
.stack
Required for
compatibility with
GHS provided startup
code
/* Read Only Data */
: {} > .
.stbyram
: {} > int_stbyram
.data
: {} > int_sram
.bss
: {} > .
.sdabase ALIGN (2): {} > .
.sdata
: {} > .
.sbss
: {} > .
.sdata2
: {} > .
.sbss2
: {} > .
*/
/* IVOR4 HW Vector Table (IVPR) - align 4K
/*
/*
/*
/*
/*
/*
/*
/*
Standby Ram Data
*/
Initialised Data
*/
Uninitialised Data
*/
Base location for SDA Area
*/
Small Initialised Data (Area1) */
Small Uninitialised Data (Area1)*/
Small Initialised Constant Data */
Small Uninitialised Data (Area2)*/
ALIGN(16) PAD(1K)
: {} > int_sram
ALIGN(4) PAD(STACK_SIZE) : {} > stack_ram
/* Heap Area */
/* Stack Area */
/*------------------------------------------------------------*/
/* Example of allocating section at absolute address
*/
/*
*/
/* .my_section 0x40001000 :{} > int_flash
*/
/*
*/
/* Linker uses "0x40001000" address, rather than "int_flash" */
/*------------------------------------------------------------*/
/*-------- LABELS USED IN CODE -------------------------------*/
/* Interrupt Handler Parameters */
__IVPR = ADDR(.xptn_vectors);
/* Label for IMEM and DMEM Init */
__IMEM_START_CPU0 = C0_IMEM_BASE_ADDR;
__IMEM_END_CPU0
= C0_IMEM_BASE_ADDR + C0_IMEM_SIZE;
__DMEM_START_CPU0 = C0_DMEM_BASE_ADDR;
__DMEM_END_CPU0
= C0_DMEM_BASE_ADDR + C0_DMEM_SIZE-STACK_SIZE;
MPC5743R Single Core Initialization, Rev. 2, May 2016
NXP Semiconductors
11
Example memory usage
/* Labels for Copying Initialised Data from Flash to RAM */
__DATA_SRAM_ADDR_CPU0 = ADDR(.data);
__SDATA_SRAM_ADDR_CPU0 = ADDR(.sdata);
__DATA_SIZE_CPU0
__SDATA_SIZE_CPU0
= SIZEOF(.data);
= SIZEOF(.sdata);
__DATA_ROM_ADDR_CPU0 = ADDR(.ROM.data);
__SDATA_ROM_ADDR_CPU0 = ADDR(.ROM.sdata);
/* Labels for stack */
__STACK_SIZE = STACK_SIZE;
__STACK_START_CPU0 = C0_DMEM_BASE_ADDR+C0_DMEM_SIZE-STACK_SIZE;
__STACK_END_CPU0
= C0_DMEM_BASE_ADDR+C0_DMEM_SIZE;
/* Lables for Standby RAM */
__STBYRAM_ADDR = MEMADDR(int_stbyram);
__STBYRAM_SIZE
= MEMENDADDR(int_stbyram) - MEMADDR(int_stbyram);
/* These special symbols mark the bounds of RAM and ROM memory. */
/* They are used by the MULTI debugger.
*/
__ghs_ramstart
__ghs_ramend
__ghs_romstart
__ghs_romend
=
=
=
=
MEMADDR(int_sram);
MEMENDADDR(int_sram);
MEMADDR(int_flash);
MEMENDADDR(int_flash);
__ghs_rambootcodestart
__ghs_rambootcodeend =
__ghs_rombootcodestart
__ghs_rombootcodeend =
= 0;
/* zero for ROM image */
0;
/* zero for ROM image */
= MEMADDR(int_flash);
MEMENDADDR(int_flash);
}
5 Example memory usage
The following table shows the memory usage of the Green Hills Software (GHS) example linker file.
End Address
Section
Allocated Size [Bytes]
Start
Address
Memory Allocation
Table 10. Example Memory Usage
Description
Example usage
Flash
0x0040_0000 0x0040_3FFF —
—
16 KB
UTEST - for user
configuration
Not used in this GHS1
example code.
0x0040_4000 0x0040_7FFF —
—
16 KB
Boot Assist flash (no
user code)
Does not require
allocation in the GHS
project.
0x0080_0000 0x0083_FFFF —
—
256 KB
EEPROM emulation
area
Not used in this GHS
example code.
Table continues on the next page...
MPC5743R Single Core Initialization, Rev. 2, May 2016
12
NXP Semiconductors
Example memory usage
End Address
Section
Allocated Size [Bytes]
Start
Address
Memory Allocation
Table 10. Example Memory Usage (continued)
Description
Example usage
0x00FA_0000 0x00FF_FFFF —
—
400 KB
Small & Medium Flash Not used in this GHS
Blocks - no overlay
example code.
0x0100_0000 0x0100_001F bootflash
.bh
20 Bytes
Boot header structure
BOOTFLASH_BASE_
ADDR and
BOOTFLASH_SIZE
0x0100_0020 0x01FF_FFFF int_flash
.init, .text, .vletex
t, .fixaddr, .fixtyp
e, .secinfo, .sysc
all, .rodata, .RO
M.data, .ROM.sd
ata, .xptn_vector
s, .isrvectbl
User program code
area
FLASH_BASE_ADDR
and FLASH_SIZE
0x08F9_C000 0x08FF_FFFF —
—
6144 KB
Mirror Small & medium Not used in this GHS
flash blocks
example code
0x0900_0000 0x09FF_FFFF —
—
16384 KB
Mirror large flash
blocks
Could be used read
only data that allows
overlay.
0x4000_0000 0x4000_7FFF int_stbysam
.stbyram
32 KB
Standby SRAM
Not used in this GHS
example code.
0x4000_8000 0x4001_FFFF int_sram
.data, .bss, .sda 224 KB/
base, .sdata, .sb 160 KB/
ss, .sdata2, .sbs 96KB3
s2, .heap,
Volatile memory for
variables, data and
compiler heap support
0x5000_0000 0x5000_3FFF int_imem
—
16 KB
I-MEM - can hold
frequently executed
code
Not used in this GHS
example code.
0x5080_0000 0x5080_7FFF int_dmem
—
28 KB
D-MEM - Could be
used for frequently
accessed global
variable
Not used in this GHS
example code.
.stack4
4 KB
4KB of D-MEM used
for stack space
Used for stack storage.
SRAM
2
Local Memory (SRAM)
1.
2.
3.
4.
Green Hills Software (compiler)
0x4002_FFFF for the MPC5745R and 0x4003_FFFF for the MPC5746R.
96KB for the MPC5743R, 160KB for the MPC5745R, and 224KB, for the MPC5746R.
The stack space is from 0x5080_7000 to 0x5080_7FFF
MPC5743R Single Core Initialization, Rev. 2, May 2016
NXP Semiconductors
13
Revision history
6 Revision history
Table 11. Revision history
Revision
Description
Date
0
Initial customer release
December 2015
1
corrected data flash size of the MPC5743 and added clarification for
BAF and UTEST in MPC574xR family device differences and
MPC574xR flash definition.
February 2016
Corrected data flash used in the MPC5743R. (MPC574xR flash
definition)
Corrected SRAM Actual size of 96 KB SRAM block (Allocated and
Actual are the same). (MPC574xR SRAM definition)
Clarified allocated memory space versus actual (added address for the
actual end addresses.
Corrected end addresses in the Example memory usage table for nonMPC5743R devices.
Fixed formatting in several tables, including fixing a footnote location.
Corrected comment on Core 0 DMEM in the example linker file.
Added revision history section
Changed Freescale references to NXP.
2
Corrected flash block mapping (MPC574xR flash definition). Revision 6 May 2016
of the MPC5746R Reference Manual included an incorrect flash
memory map that was used in this application note. The Reference
Manual is currently being corrected.
MPC5743R Single Core Initialization, Rev. 2, May 2016
14
NXP Semiconductors
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Document Number AN5234
Revision 2, May 2016
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