CD0603

MATERIAL DECLARATION SHEET
Material Number
CD0603 Series
Product Line
Diode Products
Compliance Date
1 Jan 2005
RoHS Compliant
Yes
No.
1
2
Construction
Element (subpart)
Homogeneous
Material
Substrate/
Terminal
FR-5 BOARD
Wafer
MSL
Diode
1
Material
weight
[mg]
1.357
0.029
3
Al Wire
Conductor
0.001
4
Silver paste
Welding
0.006
5
Molding Compound
Outer
Total weight
1.881
Homogeneous
Material\
Substances
Copper
Nickel
Gold
Lead
Epoxy resin
Silicon
Aluminum
Titanium
Gold
Arsenic
Aluminum
Silicon
Silver
Epoxy
Silica fused
Epoxy resin
Phenol resin
Antimony Trioxide
Brominated Epoxy
resin
Carbon Black
Materials
Mass %
Material
Mass % of
total unit wt.
7440-50-8
29.34%
12.16
7440-02-0
4.762%
1.97
7440-57-5
0.155%
0.064
7439-92-1
0.002%
0.0008
68928-70-1
65.74%
27.249
7440-21-3
94.21%
0.838
7429-90-5
0.44%
0.0039
7440-32-6
0.08%
0.0007
7440-57-5
5.20%
0.046
7440-38-2
0.07%
0.0006
7429-90-5
99%
0.0297
7440-21-3
1%
0.0003
7440-22-4
78.5%
0.1413
9003-36-5
21.5%
0.0387
60676-86-0
85%
48.8325
68928-70-1
8%
4.596
29690-82-2
4%
2.298
1309-64-4
1.4%
0.8043
68541-56-0
1.4%
0.8043
1333-86-4
0.2%
0.1149
CASRN
if applicable
Subpart
mass of total
wt. (%)
41.45
0.89
0.03
0.18
57.45
3.274
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MATERIAL DECLARATION SHEET
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