CD0603-TxxC MDS

MATERIAL DECLARATION SHEET
CD0603-TxxC Series
Material Number
Product Line
Semiconductor Products
2007/9/28
Compliance Date
RoHS Compliant
No.
1
YES
Construction
Element
(subpart)
Homogeneous
Material
FR-4 Board
Substrate/ Terminal
MSL
Material
weight
[mg]
1.357
2
Wafer
Diode
0.029
3
Al wire
Conductor
0.001
4
Silver paste
Welding
0.006
5
Molding
Compound
Outer
1.881
Total weight
3.274
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1
Homogeneous
Material\
Substances
Copper
Nickel
Gold
Continuous Filament
Fiber Glass
Silicon
Aluminum
Titanium
Silver
Silicon dioxide
Aluminum
Silicon
Modified Epoxy Resin
Silver
Imidazole
Dicyandiamide
Silica
Epoxy Resin
Phenolic Resin
Carbon Black
CASRN
if applicable
Materials
Mass %
7440-50-8
7440-02-0
7440-57-5
29.34%
4.762%
0.155%
Material
Mass % of
total unit wt.
0.39814
0.06463
0.00210
65997-17-3
65.74%
0.89213
7440-21-3
7429-90-5
7440-32-6
7440-22-4
14808-60-7
7429-90-5
7440-21-3
29690-82-2
7440-22-4
827-43-0
461-58-5
60676-86-0
29690-82-2
9003-35-4
1333-86-4
97.948%
2%
0.001%
0.001%
0.05%
99.00%
1%
16%
80%
2%
2%
80.00%
10.00%
9.50%
0.50%
0.02840492
0.00058
0.00000029
0.00000029
0.0000145
0.00099
0.00001
0.00096
0.0048
0.00012
0.00012
1.505
0.188
0.179
0.009
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CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society
Subpart
mass of total
wt. (%)
41.45
0.89
0.03
0.18
57.45
page 1 of 2
MATERIAL DECLARATION SHEET
This Document was updated on:
2015/11/30
Important remarks:
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