CD1005 MDS

MATERIAL DECLARATION SHEET
Material Number
CD1005 Series
Product Line
Diode Products
Compliance Date
1 Jan 2005
RoHS Compliant
Yes
No.
1
Construction
Element (subpart)
MSL
Homogeneous
Material
Substrate/
Terminal
FR-5 BOARD
1
Material
weight
[mg]
2.716
2
Wafer
Diode
0.057
3
Al Wire
Conductor
0.002
4
Silver paste
Welding
0.012
5
Molding Compound
Outer
3.762
Total weight
Homogeneous
Material\
Substances
Copper
Nickel
Gold
Lead
Epoxy resin
Silicon
Aluminum
Titanium
Gold
Arsenic
Aluminum
Silicon
Silver
Epoxy
Dicyanodiamide
p-t Butylphenyl
Glycidyl Ether
Silica fused
Epoxy resin
Phenol resin
Antimony Trioxide
Brominated Epoxy
resin
Carbon Black
Materials
Mass %
Material
Mass % of
total unit wt.
7440-50-8
29.34%
12.16
7440-02-0
7440-57-5
7439-92-1
7440-21-3
7429-90-5
7440-32-6
7440-57-5
7440-38-2
4.762%
0.155%
0.002%
65.74%
94.21%
0.44%
0.08%
5.20%
0.07%
1.97
0.064
0.0008
27.249
0.838
0.0039
0.0007
0.046
0.0006
7429-90-5
.>99%
>0.0297
7440-21-3
7440-22-4
9003-36-5
461-58-5
<1%
75~82%
<0.0003
0.135~0.147
18~25%
0.0324~0.045
60676-86-0
68928-70-1
29690-82-2
1309-64-4
75~95%
6~10%
2~6%
0.5~2.5%
43.08~54.57
3.447~5.745
1.149~3.447
0.287~1.436
68541-56-0
0.5~2.5%
0.287~1.436
1333-86-4
0.1~0.5%
0.057~0.287
CASRN
if applicable
68928-70-1
Subpart
mass of total
wt. (%)
41.45
0.89
0.03
0.18
3101-60-8
57.45
6.549
This Document was updated on: 3-14-2012
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MATERIAL DECLARATION SHEET
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