CD1005-TxxC

MATERIAL DECLARATION SHEET
Material Number
CD1005-TxxC Series
Product Line
Semiconductor Products
2007/9/28
Compliance Date
RoHS Compliant
No.
Construction
Element
(subpart)
YES
Homogeneous
Material
MSL
Material
weight
[mg]
Substrate/
Terminal
2.716
1
FR-4 Board
2
Wafer
Diode
0.057
3
Al wire
Conductor
0.002
4
Silver paste
Welding
0.012
5
Molding
Compound
Outer
3.762
Total weight
6.549
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1
Homogeneous Material\
Substances
CASRN
if applicable
Materials
Mass %
Copper
Nickel
Gold
Epoxy resin
Silicon
Aluminum
Titanium
Gold
Arsenic
Aluminum
7440-50-8
7440-02-0
7440-57-5
65997-17-3
7440-21-3
7429-90-5
7440-32-6
7440-57-5
7440-38-2
7429-90-5
27.62%
4.244%
0.140%
68.00%
94.21%
0.44%
0.08%
5.20%
0.07%
99%
Material
Mass % of
total unit
wt.
0.750
0.115
0.004
1.847
0.055831
0.001140
0.000001
0.000001
0.000027
0.00198
Silicon
Modified Epoxy Resin
Silver
Imidazole
Dicyandiamide
Silica
Epoxy Resin
Phenolic Resin
Carbon Black
7440-21-3
29690-82-2
7440-22-4
827-43-0
461-58-5
60676-86-0
29690-82-2
9003-35-4
1333-86-4
1%
16%
80%
2%
2%
80.00%
10.00%
9.50%
0.50%
0.00002
0.00192
0.0096
0.00024
0.00024
3.010
0.376
0.357
0.019
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CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society
Subpart
mass of
total wt. (%)
41.47
0.87
0.03
0.18
57.45
page 1 of 2
MATERIAL DECLARATION SHEET
This Document was updated on:
2015/11/30
Important remarks:
1. It is the responsibility of the user to verify they are accessing the latest version.
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CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society
page 2 of 2
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