MATERIAL DECLARATION SHEET Material Number CD1005-TxxC Series Product Line Semiconductor Products 2007/9/28 Compliance Date RoHS Compliant No. Construction Element (subpart) YES Homogeneous Material MSL Material weight [mg] Substrate/ Terminal 2.716 1 FR-4 Board 2 Wafer Diode 0.057 3 Al wire Conductor 0.002 4 Silver paste Welding 0.012 5 Molding Compound Outer 3.762 Total weight 6.549 Headquarters Riverside CA 1 Homogeneous Material\ Substances CASRN if applicable Materials Mass % Copper Nickel Gold Epoxy resin Silicon Aluminum Titanium Gold Arsenic Aluminum 7440-50-8 7440-02-0 7440-57-5 65997-17-3 7440-21-3 7429-90-5 7440-32-6 7440-57-5 7440-38-2 7429-90-5 27.62% 4.244% 0.140% 68.00% 94.21% 0.44% 0.08% 5.20% 0.07% 99% Material Mass % of total unit wt. 0.750 0.115 0.004 1.847 0.055831 0.001140 0.000001 0.000001 0.000027 0.00198 Silicon Modified Epoxy Resin Silver Imidazole Dicyandiamide Silica Epoxy Resin Phenolic Resin Carbon Black 7440-21-3 29690-82-2 7440-22-4 827-43-0 461-58-5 60676-86-0 29690-82-2 9003-35-4 1333-86-4 1% 16% 80% 2% 2% 80.00% 10.00% 9.50% 0.50% 0.00002 0.00192 0.0096 0.00024 0.00024 3.010 0.376 0.357 0.019 www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society Subpart mass of total wt. (%) 41.47 0.87 0.03 0.18 57.45 page 1 of 2 MATERIAL DECLARATION SHEET This Document was updated on: 2015/11/30 Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 2 of 2