CD1206-S01575

MATERIAL DECLARATION SHEET
CD1206-S01575
Material Number
Product Line
Diode Products
Compliance Date
RoHS Compliant
No.
Construction
Element(subpart)
1 Jan 2005
Yes
MSL
1
Homogeneous
Material
Material
weight [mg]
1
Base Material
Ceramic substrate
7.865
2
Silver
Silver
0.329
3
Conductor
Silver
0.573
4
Wafer
Chip die
0.033
5
Encapsulant
Epoxy
6
alloy electrode
alloy
0.004
7
Plating Layer
Pure tin
0.203
1.9
Total weight
This Document was updated on:
Homogeneous
Material\
CASRN
Substances
if applicable
Aluminum oxide
1344-28-1
>96
72.11
Silver
7440-22-4
90
2.72
Copper (II) oxide
1317-38-0
10
0.3
Silver
7440-22-4
100
5.25
Silicon
7440-21-3
60
0.18
Silver
7440-22-4
40
0.12
Silica
7631-86-9
75
13.06
Epoxy
9003-36-5
25
4.36
Ni
07440-02-0
80
0.032
Cr
07440-47-3
20
0.008
Tin
7440-31-5
100
1.86
Materials
Mass %
Subpart
Material Mass % of
mass of total
total unit wt.
wt. (%)
72.11
3.02
5.25
0.3
17.42
0.04
1.86
10.907
2014/11/17
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