CD1408

MATERIAL DECLARATION SHEET
Material Number
CD1408 Serial
Product Line
Semiconductor Products
Compliance Date
RoHS Compliant
No.
1
Construction
Element(subpart)
FRP
2006/9/12
Yes
MSL
Homogeneous
Material
1
Material
weight
[mg]
Others
6
2
Epoxy
Plastic
3.54
3
Solder Cream
Metal
0.17
4
Dice
Others
2.05
5
Terminal Plating
Metal
0.24
Total weight
This Document was updated on:
Homogeneous
Material\
Substances
Continuous
filament glass
fibers
Copper foil
Non-Hazardous
cured resin
Silicon Dioxides
P-F-R Resin
Lead *2
Tin
Silver
Silicon
Nickel
*3
Lead
Gold
Tin
CASRN
if applicable
Materials
Mass %
Material
Mass % of
total unit
wt.
65997-17-3
43
21.5
7440-50-8
14
7
Proprietary
43
21.5
7631-86-9
9003-36-5
7439-92-1
7440-31-5
7440-22-4
7440-21-3
7440-02-0
7439-92-1
7440-57-5
55
45
88
10
2
35.77
0.7
63.51
0.02
16.225
13.275
1.247
0.142
0.028
6.11
0.12
10.85
0.003
7440-31-5
>99.9
2
Subpart
mass of total
wt. (%)
50.0
29.5
1.4
17.1
2.0
12
2015/05/05
Important remarks:
Headquarters Riverside CA
www.bourns.com
CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society
page 1 of 2
MATERIAL DECLARATION SHEET
1.
It is the responsibility of the user to verify they are accessing the latest version.
2. *:Excepted for RoHS 7(a)-Lead in high melting temperature type solders (i.e. lead- based alloys containing 85% by weight or more
lead);
3. Excepted for RoHS 7(c) I-Electrical and electronic components containing lead in a glass or ceramic other then dielectric ceramic in
capacitors,e.g.piezoelectronic devices, or in a glass or ceramic matrix compound;
Headquarters Riverside CA
www.bourns.com
CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society
page 2 of 2
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