CD1607

MATERIAL DECLARATION SHEET
Material Number
CD1607 Series
Product Line
Diode Products
Compliance Date
7-30-04
RoHS Compliant
Yes
No.
Construction
Element
(subpart)
Homogeneous
Material
MSL
1
Material
weight [g]
Homogeneous Material /
Substances
CASRN
if applicable
Materials
Mass %
Copper
Iron
Phosphorus
Zinc
Silicon
Gold
Aluminum
Nickel
Impurity
Tin
Lead
Silver
Silica (Fused)
Epoxy Resin
Phenolic Resin
Mixed Siloxanes
Carbon Black
Tin
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-21-3
7440-57-5
7429-90-5
7440-02-0
--7440-31-5
7439-92-1
7440-22-4
60676-86-0
29690-82-2
9003-35-4
2530-83-8
1333-86-4
7440-31-5
97.05%
2.6%
0.15%
0.2%
97.6%
0.8%
0.8%
0.8%
0.5%
5%
92.5%
2.5%
80%
11.5%
6%
2%
0.5%
100%
1
Lead Frame
Alloy
0.0102
2
Chip
Dice
0.0001
3
Solder
Pb/Sn/Ag High
Temp Solder
0.0001
4
Molding
Compound
Epoxy
0.0069
5
Plating
Tin
0.0001
Total weight
0.0174
This Document was updated on: 11 July 2013
Material
Mass % of
total unit wt.
57.26
1.53
0.09
0.12
0.59
0.00
0.00
0.00
0.00
0.04
0.65
0.02
31.20
4.49
2.34
0.78
0.20
0.70
Subpart
mass of
total wt. (%)
58.62
0.575
0.575
39.655
0.575
Important remarks:
1. It is the responsibility of the user to verify they are accessing the latest version.
1. 7(a) – Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).
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