MATERIAL DECLARATION SHEET Material Number CD1607 Series Product Line Diode Products Compliance Date 7-30-04 RoHS Compliant Yes No. Construction Element (subpart) Homogeneous Material MSL 1 Material weight [g] Homogeneous Material / Substances CASRN if applicable Materials Mass % Copper Iron Phosphorus Zinc Silicon Gold Aluminum Nickel Impurity Tin Lead Silver Silica (Fused) Epoxy Resin Phenolic Resin Mixed Siloxanes Carbon Black Tin 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-21-3 7440-57-5 7429-90-5 7440-02-0 --7440-31-5 7439-92-1 7440-22-4 60676-86-0 29690-82-2 9003-35-4 2530-83-8 1333-86-4 7440-31-5 97.05% 2.6% 0.15% 0.2% 97.6% 0.8% 0.8% 0.8% 0.5% 5% 92.5% 2.5% 80% 11.5% 6% 2% 0.5% 100% 1 Lead Frame Alloy 0.0102 2 Chip Dice 0.0001 3 Solder Pb/Sn/Ag High Temp Solder 0.0001 4 Molding Compound Epoxy 0.0069 5 Plating Tin 0.0001 Total weight 0.0174 This Document was updated on: 11 July 2013 Material Mass % of total unit wt. 57.26 1.53 0.09 0.12 0.59 0.00 0.00 0.00 0.00 0.04 0.65 0.02 31.20 4.49 2.34 0.78 0.20 0.70 Subpart mass of total wt. (%) 58.62 0.575 0.575 39.655 0.575 Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. 1. 7(a) – Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead). Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 1